JP3804047B2 - 回路基板の検査装置および検査方法 - Google Patents
回路基板の検査装置および検査方法 Download PDFInfo
- Publication number
- JP3804047B2 JP3804047B2 JP2002009492A JP2002009492A JP3804047B2 JP 3804047 B2 JP3804047 B2 JP 3804047B2 JP 2002009492 A JP2002009492 A JP 2002009492A JP 2002009492 A JP2002009492 A JP 2002009492A JP 3804047 B2 JP3804047 B2 JP 3804047B2
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- Prior art keywords
- electrode
- circuit board
- wiring
- inspection
- inspected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 title claims description 136
- 238000000034 method Methods 0.000 title claims description 14
- 230000000694 effects Effects 0.000 claims description 32
- 238000001514 detection method Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 230000006837 decompression Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 43
- 239000000523 sample Substances 0.000 description 23
- 239000003990 capacitor Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 9
- 230000005684 electric field Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 6
- 238000012856 packing Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002009492A JP3804047B2 (ja) | 2001-04-10 | 2002-01-18 | 回路基板の検査装置および検査方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001111132 | 2001-04-10 | ||
| JP2001-111132 | 2001-04-10 | ||
| JP2002009492A JP3804047B2 (ja) | 2001-04-10 | 2002-01-18 | 回路基板の検査装置および検査方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006067136A Division JP2006184291A (ja) | 2001-04-10 | 2006-03-13 | 回路基板の検査装置および検査方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002372562A JP2002372562A (ja) | 2002-12-26 |
| JP2002372562A5 JP2002372562A5 (https=) | 2004-10-28 |
| JP3804047B2 true JP3804047B2 (ja) | 2006-08-02 |
Family
ID=26613352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002009492A Expired - Lifetime JP3804047B2 (ja) | 2001-04-10 | 2002-01-18 | 回路基板の検査装置および検査方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3804047B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4287255B2 (ja) * | 2003-11-27 | 2009-07-01 | 日本電産リード株式会社 | 基板検査装置及び基板検査方法 |
-
2002
- 2002-01-18 JP JP2002009492A patent/JP3804047B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002372562A (ja) | 2002-12-26 |
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