JP3804046B2 - 回路基板の検査装置および検査方法 - Google Patents
回路基板の検査装置および検査方法 Download PDFInfo
- Publication number
- JP3804046B2 JP3804046B2 JP2002007639A JP2002007639A JP3804046B2 JP 3804046 B2 JP3804046 B2 JP 3804046B2 JP 2002007639 A JP2002007639 A JP 2002007639A JP 2002007639 A JP2002007639 A JP 2002007639A JP 3804046 B2 JP3804046 B2 JP 3804046B2
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- wiring
- circuit board
- wirings
- electrode
- main surface
- Prior art date
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- 238000007689 inspection Methods 0.000 title claims description 210
- 238000000034 method Methods 0.000 title claims description 22
- 238000001514 detection method Methods 0.000 claims description 49
- 230000000694 effects Effects 0.000 claims description 44
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- 230000001678 irradiating effect Effects 0.000 claims description 7
- 230000005684 electric field Effects 0.000 description 14
- 238000005259 measurement Methods 0.000 description 7
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- 239000004065 semiconductor Substances 0.000 description 5
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- 238000012856 packing Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
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Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002007639A JP3804046B2 (ja) | 2001-02-19 | 2002-01-16 | 回路基板の検査装置および検査方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-42356 | 2001-02-19 | ||
| JP2001042356 | 2001-02-19 | ||
| JP2002007639A JP3804046B2 (ja) | 2001-02-19 | 2002-01-16 | 回路基板の検査装置および検査方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006067135A Division JP3934664B2 (ja) | 2001-02-19 | 2006-03-13 | 回路基板の検査装置および検査方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002318258A JP2002318258A (ja) | 2002-10-31 |
| JP2002318258A5 JP2002318258A5 (https=) | 2004-10-28 |
| JP3804046B2 true JP3804046B2 (ja) | 2006-08-02 |
Family
ID=26609652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002007639A Expired - Lifetime JP3804046B2 (ja) | 2001-02-19 | 2002-01-16 | 回路基板の検査装置および検査方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3804046B2 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7202690B2 (en) | 2001-02-19 | 2007-04-10 | Nidec-Read Corporation | Substrate inspection device and substrate inspecting method |
| JP2006029997A (ja) * | 2004-07-16 | 2006-02-02 | Nidec-Read Corp | 基板検査装置及び基板検査方法 |
| JP4336170B2 (ja) * | 2003-09-10 | 2009-09-30 | 日本電産リード株式会社 | 基板検査装置及びレーザービーム光照射位置補正方法 |
| JP4287255B2 (ja) * | 2003-11-27 | 2009-07-01 | 日本電産リード株式会社 | 基板検査装置及び基板検査方法 |
| US10670656B2 (en) * | 2016-05-09 | 2020-06-02 | International Business Machines Corporation | Integrated electro-optical module assembly |
| CN112738992A (zh) * | 2020-11-24 | 2021-04-30 | 合肥联宝信息技术有限公司 | 一种印制电路板、电路板的印制方法及调试方法 |
-
2002
- 2002-01-16 JP JP2002007639A patent/JP3804046B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002318258A (ja) | 2002-10-31 |
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