JP2002318258A5 - - Google Patents
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- Publication number
- JP2002318258A5 JP2002318258A5 JP2002007639A JP2002007639A JP2002318258A5 JP 2002318258 A5 JP2002318258 A5 JP 2002318258A5 JP 2002007639 A JP2002007639 A JP 2002007639A JP 2002007639 A JP2002007639 A JP 2002007639A JP 2002318258 A5 JP2002318258 A5 JP 2002318258A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- circuit board
- electrode portion
- electromagnetic wave
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 claims 15
- 230000001678 irradiating effect Effects 0.000 claims 8
- 238000001514 detection method Methods 0.000 claims 7
- 230000000694 effects Effects 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000000523 sample Substances 0.000 claims 2
- 230000005670 electromagnetic radiation Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002007639A JP3804046B2 (ja) | 2001-02-19 | 2002-01-16 | 回路基板の検査装置および検査方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-42356 | 2001-02-19 | ||
| JP2001042356 | 2001-02-19 | ||
| JP2002007639A JP3804046B2 (ja) | 2001-02-19 | 2002-01-16 | 回路基板の検査装置および検査方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006067135A Division JP3934664B2 (ja) | 2001-02-19 | 2006-03-13 | 回路基板の検査装置および検査方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002318258A JP2002318258A (ja) | 2002-10-31 |
| JP2002318258A5 true JP2002318258A5 (https=) | 2004-10-28 |
| JP3804046B2 JP3804046B2 (ja) | 2006-08-02 |
Family
ID=26609652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002007639A Expired - Lifetime JP3804046B2 (ja) | 2001-02-19 | 2002-01-16 | 回路基板の検査装置および検査方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3804046B2 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7202690B2 (en) | 2001-02-19 | 2007-04-10 | Nidec-Read Corporation | Substrate inspection device and substrate inspecting method |
| JP2006029997A (ja) * | 2004-07-16 | 2006-02-02 | Nidec-Read Corp | 基板検査装置及び基板検査方法 |
| JP4336170B2 (ja) * | 2003-09-10 | 2009-09-30 | 日本電産リード株式会社 | 基板検査装置及びレーザービーム光照射位置補正方法 |
| JP4287255B2 (ja) * | 2003-11-27 | 2009-07-01 | 日本電産リード株式会社 | 基板検査装置及び基板検査方法 |
| US10670656B2 (en) * | 2016-05-09 | 2020-06-02 | International Business Machines Corporation | Integrated electro-optical module assembly |
| CN112738992A (zh) * | 2020-11-24 | 2021-04-30 | 合肥联宝信息技术有限公司 | 一种印制电路板、电路板的印制方法及调试方法 |
-
2002
- 2002-01-16 JP JP2002007639A patent/JP3804046B2/ja not_active Expired - Lifetime
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