JP3768169B2 - 金型組立体及び射出成形方法 - Google Patents

金型組立体及び射出成形方法 Download PDF

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Publication number
JP3768169B2
JP3768169B2 JP2002124352A JP2002124352A JP3768169B2 JP 3768169 B2 JP3768169 B2 JP 3768169B2 JP 2002124352 A JP2002124352 A JP 2002124352A JP 2002124352 A JP2002124352 A JP 2002124352A JP 3768169 B2 JP3768169 B2 JP 3768169B2
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Japan
Prior art keywords
mold
cavity
mold part
insert
thermoplastic resin
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2002124352A
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English (en)
Japanese (ja)
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JP2003019717A5 (https=
JP2003019717A (ja
Inventor
久志 田原
彰雅 兼石
昌哉 上田
博義 丸山
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Mitsubishi Engineering Plastics Corp
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Mitsubishi Engineering Plastics Corp
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Priority to JP2002124352A priority Critical patent/JP3768169B2/ja
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Publication of JP2003019717A5 publication Critical patent/JP2003019717A5/ja
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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
JP2002124352A 2001-05-01 2002-04-25 金型組立体及び射出成形方法 Expired - Lifetime JP3768169B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002124352A JP3768169B2 (ja) 2001-05-01 2002-04-25 金型組立体及び射出成形方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-133899 2001-05-01
JP2001133899 2001-05-01
JP2002124352A JP3768169B2 (ja) 2001-05-01 2002-04-25 金型組立体及び射出成形方法

Publications (3)

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JP2003019717A JP2003019717A (ja) 2003-01-21
JP2003019717A5 JP2003019717A5 (https=) 2005-07-07
JP3768169B2 true JP3768169B2 (ja) 2006-04-19

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ID=26614576

Family Applications (1)

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JP2002124352A Expired - Lifetime JP3768169B2 (ja) 2001-05-01 2002-04-25 金型組立体及び射出成形方法

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003300227A (ja) * 2002-04-08 2003-10-21 Seikoh Giken Co Ltd ディスク成形用金型
KR20060008286A (ko) * 2003-03-03 2006-01-26 마츠시타 덴끼 산교 가부시키가이샤 디스크 기판 성형용 금형 및 디스크 기판의 제조 방법
JP2005014278A (ja) * 2003-06-24 2005-01-20 Tdk Corp スタンパを保持する面に断熱層とダイヤモンド様炭素膜を施した光ディスク成形金型とそれを使用する成型方法
JP2007144880A (ja) * 2005-11-29 2007-06-14 Seikoh Giken Co Ltd 金型装置及び鏡面盤
EP4105627B1 (en) * 2021-06-18 2025-08-06 ABB Schweiz AG A sensor device for determining differential pressure in liquid or gaseous media

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6436413A (en) * 1987-07-31 1989-02-07 Showa Denko Kk Molding mold
JPH08318534A (ja) * 1995-05-26 1996-12-03 Mitsubishi Eng Plast Kk 熱可塑性樹脂成形用の金型組立体及び入れ子
JPH09239768A (ja) * 1996-03-08 1997-09-16 Mitsubishi Eng Plast Kk 中空部を有する成形品の成形方法
JP4130007B2 (ja) * 1997-05-28 2008-08-06 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂成形用の金型組立体及び成形品の製造方法
JP3719826B2 (ja) * 1997-07-23 2005-11-24 三菱エンジニアリングプラスチックス株式会社 金型組立体及び成形品の製造方法
JP3747983B2 (ja) * 1997-08-04 2006-02-22 三菱エンジニアリングプラスチックス株式会社 成形品の成形方法、並びに金型組立体
JP2000225635A (ja) * 1999-02-05 2000-08-15 Mitsubishi Engineering Plastics Corp 表面がメッキされた成形品及びその製造方法
JP2000271970A (ja) * 1999-03-29 2000-10-03 Mitsubishi Engineering Plastics Corp ポリアセタール樹脂から成る成形品及びその製造方法
JP4301717B2 (ja) * 2000-09-20 2009-07-22 三菱エンジニアリングプラスチックス株式会社 入れ子及び金型組立体、並びに、成形方法

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JP2003019717A (ja) 2003-01-21

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