JP3756930B2 - 半導体発光デバイスの製造方法 - Google Patents

半導体発光デバイスの製造方法 Download PDF

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Publication number
JP3756930B2
JP3756930B2 JP2005166093A JP2005166093A JP3756930B2 JP 3756930 B2 JP3756930 B2 JP 3756930B2 JP 2005166093 A JP2005166093 A JP 2005166093A JP 2005166093 A JP2005166093 A JP 2005166093A JP 3756930 B2 JP3756930 B2 JP 3756930B2
Authority
JP
Japan
Prior art keywords
phosphor
light emitting
emitting device
semiconductor light
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005166093A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005277441A5 (enExample
JP2005277441A (ja
Inventor
俊秀 前田
祥三 大塩
克昭 岩間
博実 北原
忠昭 池田
英徳 亀井
康行 花田
恵 坂上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2005166093A priority Critical patent/JP3756930B2/ja
Publication of JP2005277441A publication Critical patent/JP2005277441A/ja
Publication of JP2005277441A5 publication Critical patent/JP2005277441A5/ja
Application granted granted Critical
Publication of JP3756930B2 publication Critical patent/JP3756930B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F21S6/002—Table lamps, e.g. for ambient lighting
    • F21S6/003—Table lamps, e.g. for ambient lighting for task lighting, e.g. for reading or desk work, e.g. angle poise lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
JP2005166093A 2001-09-03 2005-06-06 半導体発光デバイスの製造方法 Expired - Fee Related JP3756930B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005166093A JP3756930B2 (ja) 2001-09-03 2005-06-06 半導体発光デバイスの製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2001265540 2001-09-03
JP2001381370 2001-12-14
JP2001381369 2001-12-14
JP2001381368 2001-12-14
JP2005166093A JP3756930B2 (ja) 2001-09-03 2005-06-06 半導体発光デバイスの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003525920A Division JP3749243B2 (ja) 2001-09-03 2002-09-03 半導体発光デバイス，発光装置及び半導体発光デバイスの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005337096A Division JP2006080565A (ja) 2001-09-03 2005-11-22 半導体発光デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2005277441A JP2005277441A (ja) 2005-10-06
JP2005277441A5 JP2005277441A5 (enExample) 2006-01-19
JP3756930B2 true JP3756930B2 (ja) 2006-03-22

Family

ID=35176690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005166093A Expired - Fee Related JP3756930B2 (ja) 2001-09-03 2005-06-06 半導体発光デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP3756930B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7422504B2 (en) 2001-09-03 2008-09-09 Matsushita Electric Industrial Co., Ltd. Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7575697B2 (en) * 2004-08-04 2009-08-18 Intematix Corporation Silicate-based green phosphors
US7601276B2 (en) * 2004-08-04 2009-10-13 Intematix Corporation Two-phase silicate-based yellow phosphor
JP4873183B2 (ja) 2005-08-04 2012-02-08 日亜化学工業株式会社 蛍光体及び発光装置
WO2007018260A1 (ja) 2005-08-10 2007-02-15 Mitsubishi Chemical Corporation 蛍光体及びそれを用いた発光装置
JP2008038081A (ja) * 2006-08-09 2008-02-21 Mitsubishi Chemicals Corp 蛍光体及びそれを用いた発光装置
JP5118837B2 (ja) * 2005-10-25 2013-01-16 インテマティックス・コーポレーション シリケート系オレンジ色蛍光体
TW200717856A (en) * 2005-10-28 2007-05-01 Taiwan Oasis Technology Co Ltd Method of fabricating light emitting diode
JP5181492B2 (ja) * 2006-02-28 2013-04-10 三菱化学株式会社 蛍光体原料及び蛍光体原料用合金の製造方法
JP4438761B2 (ja) 2006-03-09 2010-03-24 ソニー株式会社 発光組成物及び光源装置
US7997745B2 (en) 2006-04-20 2011-08-16 Cree, Inc. Lighting device and lighting method
JP5134788B2 (ja) 2006-07-19 2013-01-30 株式会社東芝 蛍光体の製造方法
JP4199267B2 (ja) * 2006-07-19 2008-12-17 株式会社東芝 蛍光体、その製造方法、および発光装置
JP4314279B2 (ja) 2007-02-01 2009-08-12 株式会社東芝 蛍光体、その製造方法、および発光装置
JP2008218998A (ja) * 2007-02-09 2008-09-18 Toshiba Lighting & Technology Corp 発光装置
JP2008244468A (ja) * 2007-02-28 2008-10-09 Toshiba Lighting & Technology Corp 発光装置
JP2008244469A (ja) * 2007-02-28 2008-10-09 Toshiba Lighting & Technology Corp 発光装置
JP2012146691A (ja) * 2009-05-07 2012-08-02 Pearl Lighting Co Ltd Ｌｅｄ照明灯
JP5530128B2 (ja) * 2009-07-31 2014-06-25 株式会社小糸製作所 蛍光体および発光装置
WO2011044974A1 (de) * 2009-10-13 2011-04-21 Merck Patent Gmbh Leuchtstoffmischungen mit europium dotieren ortho-silikaten
US20120138874A1 (en) 2010-12-02 2012-06-07 Intematix Corporation Solid-state light emitting devices and signage with photoluminescence wavelength conversion and photoluminescent compositions therefor
JP2013067710A (ja) * 2011-09-21 2013-04-18 Dexerials Corp 被覆蛍光体の製造方法、被覆蛍光体及び白色光源
US9309461B2 (en) 2011-09-26 2016-04-12 Konica Minolta, Inc. Phosphor dispersion liquid and method for manufacturing LED device
JP6070536B2 (ja) * 2013-12-26 2017-02-01 住友金属鉱山株式会社 シリケート蛍光体粒子の製造方法
US9318670B2 (en) 2014-05-21 2016-04-19 Intematix Corporation Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements
JP6398556B2 (ja) * 2014-10-01 2018-10-03 コニカミノルタ株式会社 照明用発光装置および画像読取装置
JP2016028170A (ja) * 2015-11-11 2016-02-25 デクセリアルズ株式会社 被覆蛍光体の製造方法、被覆蛍光体及び白色光源
JP6927857B2 (ja) * 2017-11-13 2021-09-01 日本アエロジル株式会社 ケイ酸塩蛍光体の製造方法
JP7348521B2 (ja) * 2019-12-24 2023-09-21 日亜化学工業株式会社 発光装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7422504B2 (en) 2001-09-03 2008-09-09 Matsushita Electric Industrial Co., Ltd. Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
US7592639B2 (en) 2001-09-03 2009-09-22 Panasonic Corporation Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
US7629620B2 (en) 2001-09-03 2009-12-08 Panasonic Corporation Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
US7772769B2 (en) 2001-09-03 2010-08-10 Panasonic Corporation Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
USRE47453E1 (en) 2001-09-03 2019-06-25 Panasonic Corporation Luminescent layer and light-emitting semiconductor device

Also Published As

Publication number Publication date
JP2005277441A (ja) 2005-10-06

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