JP3739699B2 - 電子部品実装済み部品の製造方法及び製造装置 - Google Patents

電子部品実装済み部品の製造方法及び製造装置 Download PDF

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Publication number
JP3739699B2
JP3739699B2 JP2001387617A JP2001387617A JP3739699B2 JP 3739699 B2 JP3739699 B2 JP 3739699B2 JP 2001387617 A JP2001387617 A JP 2001387617A JP 2001387617 A JP2001387617 A JP 2001387617A JP 3739699 B2 JP3739699 B2 JP 3739699B2
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Japan
Prior art keywords
electronic component
base material
electrode
manufacturing
semiconductor element
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Expired - Fee Related
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JP2001387617A
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English (en)
Japanese (ja)
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JP2003188198A (ja
JP2003188198A5 (enExample
Inventor
大輔 櫻井
法人 塚原
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001387617A priority Critical patent/JP3739699B2/ja
Priority to US10/285,475 priority patent/US7176055B2/en
Priority to CNB02149813XA priority patent/CN1204610C/zh
Publication of JP2003188198A publication Critical patent/JP2003188198A/ja
Publication of JP2003188198A5 publication Critical patent/JP2003188198A5/ja
Application granted granted Critical
Publication of JP3739699B2 publication Critical patent/JP3739699B2/ja
Priority to US11/653,304 priority patent/US20070200217A1/en
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Expired - Fee Related legal-status Critical Current

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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2001387617A 2001-11-02 2001-12-20 電子部品実装済み部品の製造方法及び製造装置 Expired - Fee Related JP3739699B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001387617A JP3739699B2 (ja) 2001-12-20 2001-12-20 電子部品実装済み部品の製造方法及び製造装置
US10/285,475 US7176055B2 (en) 2001-11-02 2002-11-01 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
CNB02149813XA CN1204610C (zh) 2001-11-02 2002-11-04 安装电子元件后的零件的制造方法及其制造装置
US11/653,304 US20070200217A1 (en) 2001-11-02 2007-01-16 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

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CN101543152A (zh) * 2007-06-19 2009-09-23 株式会社村田制作所 元器件内置基板的制造方法及元器件内置基板
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