JP2003188198A5 - - Google Patents

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Publication number
JP2003188198A5
JP2003188198A5 JP2001387617A JP2001387617A JP2003188198A5 JP 2003188198 A5 JP2003188198 A5 JP 2003188198A5 JP 2001387617 A JP2001387617 A JP 2001387617A JP 2001387617 A JP2001387617 A JP 2001387617A JP 2003188198 A5 JP2003188198 A5 JP 2003188198A5
Authority
JP
Japan
Prior art keywords
electronic component
electrode
component
base material
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001387617A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003188198A (ja
JP3739699B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001387617A priority Critical patent/JP3739699B2/ja
Priority claimed from JP2001387617A external-priority patent/JP3739699B2/ja
Priority to US10/285,475 priority patent/US7176055B2/en
Priority to CNB02149813XA priority patent/CN1204610C/zh
Publication of JP2003188198A publication Critical patent/JP2003188198A/ja
Publication of JP2003188198A5 publication Critical patent/JP2003188198A5/ja
Application granted granted Critical
Publication of JP3739699B2 publication Critical patent/JP3739699B2/ja
Priority to US11/653,304 priority patent/US20070200217A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001387617A 2001-11-02 2001-12-20 電子部品実装済み部品の製造方法及び製造装置 Expired - Fee Related JP3739699B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001387617A JP3739699B2 (ja) 2001-12-20 2001-12-20 電子部品実装済み部品の製造方法及び製造装置
US10/285,475 US7176055B2 (en) 2001-11-02 2002-11-01 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
CNB02149813XA CN1204610C (zh) 2001-11-02 2002-11-04 安装电子元件后的零件的制造方法及其制造装置
US11/653,304 US20070200217A1 (en) 2001-11-02 2007-01-16 Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001387617A JP3739699B2 (ja) 2001-12-20 2001-12-20 電子部品実装済み部品の製造方法及び製造装置

Publications (3)

Publication Number Publication Date
JP2003188198A JP2003188198A (ja) 2003-07-04
JP2003188198A5 true JP2003188198A5 (enExample) 2005-05-26
JP3739699B2 JP3739699B2 (ja) 2006-01-25

Family

ID=27596389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001387617A Expired - Fee Related JP3739699B2 (ja) 2001-11-02 2001-12-20 電子部品実装済み部品の製造方法及び製造装置

Country Status (1)

Country Link
JP (1) JP3739699B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4688679B2 (ja) * 2003-09-09 2011-05-25 三洋電機株式会社 半導体モジュール
JP4792749B2 (ja) * 2005-01-14 2011-10-12 大日本印刷株式会社 電子部品内蔵プリント配線板の製造方法
JP5036563B2 (ja) 2006-01-17 2012-09-26 スパンション エルエルシー 半導体装置およびその製造方法
JP4976840B2 (ja) 2006-12-22 2012-07-18 株式会社東芝 プリント配線板、プリント配線板の製造方法および電子機器
JP5191688B2 (ja) * 2007-05-18 2013-05-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN101543152A (zh) * 2007-06-19 2009-09-23 株式会社村田制作所 元器件内置基板的制造方法及元器件内置基板
JP5233288B2 (ja) * 2008-01-18 2013-07-10 富士通セミコンダクター株式会社 半導体装置の製造方法及び基板
JP4883145B2 (ja) * 2008-10-30 2012-02-22 株式会社デンソー 半導体装置
JP5340789B2 (ja) * 2009-04-06 2013-11-13 新光電気工業株式会社 電子装置及びその製造方法
EP3787381A1 (en) 2019-08-30 2021-03-03 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Electronic device with multilayer laminate
JP7632744B2 (ja) * 2022-03-31 2025-02-19 株式会社村田製作所 高周波モジュール及び高周波モジュールの製造方法

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