JP2003188198A5

JP2003188198A5 -

Info

Publication number: JP2003188198A5
Application number: JP2001387617A
Authority: JP
Filing date: 2001-12-20
Publication date: 2005-05-26
Anticipated expiration: 2021-12-20

Description

本発明の第１態様によれば、電子部品を基材中に埋設する工程と、
上記電子部品の電極を上記基材表面に露出させる工程とを備え、
上記露出工程において、上記電極を上記基材表面に露出させることを特徴とする電子部品実装済み部品の製造方法を提供する。 According to a first aspect of the invention, the step of embedding the electronic component in a substrate,
Exposing the electrode of the electronic component on the surface of the substrate;
In the above-mentioned exposure process, the above-mentioned electrode is made to expose on the above-mentioned substrate surface. The manufacturing method of the electronic part mounting completed parts characterized by the above-mentioned is provided.

本発明の第５態様によれば、上記埋設工程において、複数個の電子部品を一括して上記基材に埋設し、
上記露出工程の後、個片に切断する工程をさらに備える第１から４のいずれか１つの態様に記載の電子部品実装済み部品の製造方法を提供する。
According to the fifth aspect of the present invention, in the embedding step, a plurality of electronic components are collectively embedded in the base material,
The manufacturing method of the electronic component mounted part according to any one of the first to fourth aspects, further comprising the step of cutting into pieces after the exposing step.

Claims

Embedding the electronic component in the substrate ;
Exposing the electrode of the electronic component on the surface of the substrate;
A method of manufacturing an electronic component-mounted component, wherein the electrode is exposed to the surface of the base material in the exposing step .

Before forming the projection-like electrode on the electrode pad of the semiconductor element as the electronic component before the step of embedding the electronic component in the base material,
In the burying step, the protrusion-like electrode is aligned to a predetermined height or the semiconductor element is directly buried in a base material,
The method according to claim 1, wherein the projecting electrode is exposed on the surface of the base in the exposing step.

A circuit pattern, a metal thin film capacitor, a coil, or a resistor is formed on the electrode exposed on the surface of the base material by plating, ion plating, sputtering or vapor deposition after the exposure step. The manufacturing method of the electronic component mounted components as described.

After the said exposure process, after printing a solder paste or a conductive adhesive on the electrode exposed on the said base-material surface, a circuit pattern is formed by heat-hardening with a high temperature furnace or a high temperature stage. Method of electronic parts mounted parts.

In the embedding step, a plurality of electronic components are collectively embedded in the base material,
The manufacturing method of the electronic component mounted part according to any one of claims 1 to 4, further comprising the step of cutting into pieces after the exposure step.

An electronic component-mounted component or an electronic component-mounted component on one side or both sides of the electronic component-mounted component after manufacturing the electronic component-mounted component according to the method of manufacturing an electronic component-mounted component according to any one of claims 1 to 5. A method for producing a multilayer-laminated electronic component-mounted component, wherein a multilayer-laminated electronic component-mounted component is manufactured by laminating a plurality of base materials in a thickness direction and arranging protective sheets on both the front and back surfaces.

The electronic component mounted part manufactured by the manufacturing method of the electronic component mounted part according to any one of claims 1 to 5.

A substrate,
An electronic component mounted component comprising: an electronic component embedded in the base material in a state in which the electrode is exposed on the surface of the base material by either or both of polishing processing and plasma electric discharge processing.

9. The electron according to claim 8, further comprising a circuit pattern, a metal thin film capacitor, a coil or a resistor formed by plating, ion plating, sputtering or vapor deposition on the electrode exposed to the substrate surface. Component mounted parts.

An electronic component supply apparatus for supplying a substrate and an electronic component;
A recognition device for recognizing the electronic component and the electrode position and shape thereof;
A vertical reversing device that vertically reverses after suctioning the electronic component;
An electronic component mounting apparatus for mounting the electronic component on the substrate;
An electronic component embedding device for embedding the electronic component in the base material;
An apparatus for producing an electronic component-mounted component, comprising: an electrode exposing device for exposing the electrode of the electronic component on the surface of the base using either or both of plasma electric discharge machining and polishing.