JP3723124B2 - 固体撮像装置 - Google Patents

固体撮像装置 Download PDF

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Publication number
JP3723124B2
JP3723124B2 JP2001381928A JP2001381928A JP3723124B2 JP 3723124 B2 JP3723124 B2 JP 3723124B2 JP 2001381928 A JP2001381928 A JP 2001381928A JP 2001381928 A JP2001381928 A JP 2001381928A JP 3723124 B2 JP3723124 B2 JP 3723124B2
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JP
Japan
Prior art keywords
semiconductor region
imaging device
solid
state imaging
substrate
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Expired - Fee Related
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JP2001381928A
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English (en)
Japanese (ja)
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JP2003188367A (ja
JP2003188367A5 (enrdf_load_stackoverflow
Inventor
宏明 石渡
浩史 山下
鉄也 山口
秀俊 野崎
久典 井原
長孝 田中
雄一郎 江木
昌之 綾部
幸雄 遠藤
宗平 真鍋
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Toshiba Corp
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Toshiba Corp
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Priority to JP2001381928A priority Critical patent/JP3723124B2/ja
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Publication of JP2003188367A5 publication Critical patent/JP2003188367A5/ja
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Publication of JP3723124B2 publication Critical patent/JP3723124B2/ja
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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2001381928A 2001-12-14 2001-12-14 固体撮像装置 Expired - Fee Related JP3723124B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001381928A JP3723124B2 (ja) 2001-12-14 2001-12-14 固体撮像装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001381928A JP3723124B2 (ja) 2001-12-14 2001-12-14 固体撮像装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004344712A Division JP2005129965A (ja) 2004-11-29 2004-11-29 固体撮像装置

Publications (3)

Publication Number Publication Date
JP2003188367A JP2003188367A (ja) 2003-07-04
JP2003188367A5 JP2003188367A5 (enrdf_load_stackoverflow) 2005-04-28
JP3723124B2 true JP3723124B2 (ja) 2005-12-07

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Family Applications (1)

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JP2001381928A Expired - Fee Related JP3723124B2 (ja) 2001-12-14 2001-12-14 固体撮像装置

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JP (1) JP3723124B2 (enrdf_load_stackoverflow)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101596A (ja) * 2003-09-03 2005-04-14 Matsushita Electric Ind Co Ltd 固体撮像装置およびカメラ
JP4758061B2 (ja) * 2003-10-16 2011-08-24 パナソニック株式会社 固体撮像装置およびその製造方法
KR100619396B1 (ko) 2003-12-31 2006-09-11 동부일렉트로닉스 주식회사 시모스 이미지 센서 및 그 제조방법
WO2005083790A1 (ja) * 2004-02-27 2005-09-09 Texas Instruments Japan Limited 固体撮像装置、ラインセンサ、光センサおよび固体撮像装置の動作方法
JP3727639B2 (ja) * 2004-04-16 2005-12-14 松下電器産業株式会社 固体撮像装置
JP2005327858A (ja) * 2004-05-13 2005-11-24 Matsushita Electric Ind Co Ltd 固体撮像装置
DE102005026629B4 (de) 2004-06-04 2014-07-10 Samsung Electronics Co., Ltd. Bildsensor und zugehöriges Herstellungsverfahren
KR100761824B1 (ko) * 2004-06-04 2007-09-28 삼성전자주식회사 이미지 센서 및 그 제조 방법
US7271430B2 (en) * 2004-06-04 2007-09-18 Samsung Electronics Co., Ltd. Image sensors for reducing dark current and methods of fabricating the same
JP4935354B2 (ja) * 2004-07-20 2012-05-23 富士通セミコンダクター株式会社 Ｃｍｏｓ撮像素子
KR100614650B1 (ko) * 2004-09-16 2006-08-22 삼성전자주식회사 이미지 센서 및 그 형성 방법
JP4595464B2 (ja) 2004-09-22 2010-12-08 ソニー株式会社 Ｃｍｏｓ固体撮像素子の製造方法
JP4742661B2 (ja) * 2005-04-25 2011-08-10 ソニー株式会社 固体撮像素子の製造方法
EP1722421A3 (fr) * 2005-05-13 2007-04-18 Stmicroelectronics Sa Photodiode intégrée de type à substrat flottant
US7141836B1 (en) * 2005-05-31 2006-11-28 International Business Machines Corporation Pixel sensor having doped isolation structure sidewall
KR100699849B1 (ko) 2005-06-21 2007-03-27 삼성전자주식회사 국부적인 불순물 영역을 갖는 ｃｍｏｓ 이미지 소자 및 그제조방법
JP4953635B2 (ja) * 2006-01-06 2012-06-13 キヤノン株式会社 固体撮像素子の製造方法
JP2006222452A (ja) * 2006-04-24 2006-08-24 Matsushita Electric Ind Co Ltd 固体撮像装置
JP5063223B2 (ja) 2007-07-02 2012-10-31 キヤノン株式会社 光電変換装置及び撮像システム
JP2011009466A (ja) * 2009-06-25 2011-01-13 Sony Corp 固体撮像装置及び電子機器
JP5295188B2 (ja) * 2010-08-27 2013-09-18 キヤノン株式会社 光電変換装置、その製造方法及び撮像システム
JP5456644B2 (ja) * 2010-11-17 2014-04-02 本田技研工業株式会社 受光素子及び制御方法
TW201415613A (zh) * 2012-08-02 2014-04-16 Sony Corp 固體攝像裝置、固體攝像裝置之製造方法及電子機器
JP2017130577A (ja) 2016-01-21 2017-07-27 ソニー株式会社 半導体装置およびその製造方法、固体撮像素子、並びに電子機器
JP6897740B2 (ja) * 2016-03-07 2021-07-07 株式会社リコー 画素ユニット、及び撮像素子
JP6842240B2 (ja) * 2016-03-07 2021-03-17 株式会社リコー 画素ユニット、及び撮像素子
JP6862129B2 (ja) * 2016-08-29 2021-04-21 キヤノン株式会社 光電変換装置および撮像システム
JP6701108B2 (ja) * 2017-03-21 2020-05-27 キヤノン株式会社 固体撮像装置及び撮像システム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3329291B2 (ja) * 1998-02-06 2002-09-30 日本電気株式会社 電荷転送装置
KR100278285B1 (ko) * 1998-02-28 2001-01-15 김영환 씨모스 이미지센서 및 그 제조방법
JP3600430B2 (ja) * 1998-03-19 2004-12-15 株式会社東芝 固体撮像装置
JP3403061B2 (ja) * 1998-03-31 2003-05-06 株式会社東芝 固体撮像装置
JP2000091551A (ja) * 1998-09-11 2000-03-31 Toshiba Corp 固体撮像装置およびその製造方法

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