JP3588314B2 - 貼り合わせ用ウレタン接着剤組成物 - Google Patents
貼り合わせ用ウレタン接着剤組成物 Download PDFInfo
- Publication number
- JP3588314B2 JP3588314B2 JP2000247932A JP2000247932A JP3588314B2 JP 3588314 B2 JP3588314 B2 JP 3588314B2 JP 2000247932 A JP2000247932 A JP 2000247932A JP 2000247932 A JP2000247932 A JP 2000247932A JP 3588314 B2 JP3588314 B2 JP 3588314B2
- Authority
- JP
- Japan
- Prior art keywords
- polyester
- adhesive composition
- diisocyanate
- adhesive
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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Description
【発明の属する技術分野】
本発明は、ポリマーフィルムを接合するのに有用な貼り合わせ用接着剤に関し、特に食品、医薬品等のためのポリマーフィルム積層体を提供することに関する。本発明の貼り合わせ用接着剤は、水も有機溶剤も含まないという意味で「無溶剤型」の接着剤である。この接着剤は、優れた酸素遮断性及び防湿性を備えている。
【0002】
【従来の技術及び発明が解決しようとする課題】
酸素、湿分及び他の気体は多くの食品及び医薬品の品質を劣化させる傾向を有する。食品包装、医薬品包装等に有用な多くのポリマーフィルムが、酸素及び湿分が比較的透過しうるものである。遮断性を高めるために、ポリマーフィルムは、高遮断性を有する接着剤層を使用して積層体に形成される。
【0003】
現在のところ、遮断性のある貼り合わせ用接着剤は主として水性又は溶剤型のポリ塩化ビニリデン(PVDC)配合物である。溶液が水性である場合には、水を蒸発させるためにエネルギーを消費させる必要がある。有機溶剤型配合物も、溶剤を除去するために若干のエネルギー消費を伴い、さらに溶剤は作業場及び環境に有害である。無溶剤型貼り合わせ機のみを所有する包装業者は、PVDCで予めコーティングされたフィルムを使用しなくてはならない。また、PVDC中の塩素は環境汚染物質の発生原因である。
【0004】
もう1つ別の高遮断性材料にはエチレンビニルアルコール(EVOH)があるが、これは典型的には水性接着剤配合物として適用される。EVOHは塩素を含まないが、配合物中の水はエネルギーの消費を必要とする。EVOHは高い融点、すなわち150℃よりも高い融点を有する。そのような高い融点では、また殆どのポリマーフィルムが溶融する。従って、EVOHを溶剤型接着剤として適用することはできない。EVOHは酸素及び他の気体に対して優れた遮断性を有するが、不十分な防湿性を有する。また、EVOHは比較的高価である。
【0005】
本発明は、貼り合わせに有用であり、かつ酸素及び湿分の両方に対する高い遮断性を提供する無溶剤型ウレタン接着剤に関する。殆どの商用の無溶剤型ウレタン接着剤は、それらがアモルファスポリマーとなる傾向があるために、非常に不十分な酸素遮断性を有する。
【0006】
【課題を解決するための手段】
本発明は、ポリマー材料の第1フィルムをポリマー材料の第2フィルムに貼り合わせる方法であって、
末端ヒドロキシル基及び2〜10個の炭素原子を有する1種の線状脂肪族ジオールと1種の線状ジカルボン酸から形成された溶融状態にある無溶剤ヒドロキシル末端ポリエステルであって、300〜5000の数平均分子量及び80℃以下の融点を有するポリエステル(A)を準備する工程;
液体状態にある1種のジイソシアネート(B)を準備する工程;
前記ジイソシアネート(B)と前記ポリエステル(A)を1〜1.1の間のNCO/OH比で混合して接着剤混合物(I)を形成させるか、又は前記ジイソシアネート(B)の全部若しくは一部(B’)を前記ポリエステル(A)の一部(A’)と2〜8の間のNCO/OH比で反応させてウレタンプレポリマー(C)を形成させ、前記ポリエステル(A)の残りの部分(A’’)及びもし存在するならば前記ジイソシアネート(B)の残りの部分(B’’)と前記ウレタンプレポリマー(C)とを混合し、(B)に対する(A)のNCO/OH比が1〜1.1の間である接着剤混合物(II)を形成させる工程;
前記接着剤混合物(I)又は(II)を前記第1フィルム及び第2フィルムの片方又は両方に適用する工程であって、前記接着剤混合物が前記フィルムとの接触直前に調製される工程;
前記混合物の実質的な硬化及びそれに伴うポリウレタン接着剤の形成に先立って、結晶性ポリエステルドメインが形成されるように前記第1フィルムと第2フィルムを接着させる工程;並びに
前記ジイソシアネート(B)及び前記ポリエステル(A)を完全に反応させ、それにより高いガス遮断特性を有する接着層を形成する工程;
を含む方法を提供する。
【0007】
本発明の無溶剤型ウレタン接着剤は、2〜10個の炭素原子、好ましくは3〜6個の炭素原子を有する1種の線状脂肪族ジオール及び1種の線状ジカルボン酸から形成されたヒドロキシル末端ポリエステル(A)と1種の液状ジイソシアネート(B)とが約1〜約1.1の間のNCO/OH比で反応した反応生成物を含む。前記ポリエステル(A)は、周囲温度で結晶質であり、約80℃以下、好ましくは約70℃以下、より好ましくは約60℃以下、最も好ましくは約55℃以下の融点を有する。前記ポリエステルの数平均分子量(Mn )は、約300〜約5000の間、好ましくは約500〜約2000の間である。結果として得られるウレタンは、1種の線状ジオール、1種の線状ジカルボン酸及び1種のジイソシアネートから形成されるため、ポリウレタンは高い結晶性を有し、それに伴って高い酸素遮断性及び高い防湿性を有する。前記ポリエステルの低い融点はいかなる溶剤も必要とせずに低温での接着剤の適用を可能にするため、貼り合わされるポリマーフィルムは分解も変形もしない。
【0008】
前記ポリエステル(A)の一部(A’)を前記イソシアネート(B)の全部又は一部(B’)と約2〜約8のNCO/OH比で反応させてウレタンプレポリマー(C)を形成させ、その後にポリエステル(A)の残りの部分(A’’)をプレポリマー(C)及びイソシアネート(B)の残りの部分(B’’)と混合してフィルムを貼り合わせるのに適する接着剤混合物を形成させることは本発明の範囲内に含まれることであり、ある場合に好ましい。そのような場合においても、(A’)及び(A’’)の両方を包含する(A)に対する(B’)及び(B’’)を包含する(B)のNCO/OH比は約1〜約1.1の間である。
【0009】
【発明の実施の形態】
前記ポリエステルを形成するのに好ましい線状脂肪族ジオールは、C3 〜C6 ジオールであり、優れた遮断性を有する接着剤を形成するという観点及び経済的観点からn−ブタンジオール及びn−ヘキサンジオールが好ましいジオールである。
【0010】
アジピン酸は本発明のポリエステルを形成するのに好ましいジカルボン酸であるが、他の適切なジカルボン酸が使用されてもよい。このような適切なジカルボン酸としてはアゼライン酸及びセバシン酸があるが、これらに限定されない。
【0011】
現在のところ、最も好ましいポリエステルは、1,6−ヘキサンジオール又は1,4−ブタンジオールとアジピン酸との反応生成物である。
【0012】
約20〜約350、好ましくは約100〜約250のOH価を有するヒドロキシル末端ポリエステルが形成するようにジオールを反応させる。
【0013】
好ましいジイソシアネートは、脂肪族ジイソシアネート、特に線状ジイソシアネートであり、高分子量ヘキサメチレンジイソシアネート(HDI)が挙げられる。
【0014】
しかしながら、メチレンジフェニルジイソシアネート(MDI)、ジシクロヘキシルメタン4,4’−ジイソシアネート(H12MDI)及びトルエンジイソシアネート(TDI)を包含する他のジイソシアネートが使用されてもよい。ジイソシアネートは、概して、ポリエステルよりも小さな割合で線状ポリウレタン鎖を構成する。そのため、ジイソシアネートの選択はポリエステルの性質よりも概して厳密ではない。遮断性が非常に優れた遮断層を形成する観点から、高分子量HDIが現在のところ好ましい。しかしながら、高分子量HDIは比較的高価な材料であり、遮断性に対する要求があまり厳しくない場合にはMDIのようなあまり高価でないジイソシアネートを使用することができる。
【0015】
本発明において有用なジイソシアネートは、周囲温度、すなわち20〜25℃で液状である。本発明の低分子量ポリエステルは非常に結晶性が高いが、それらの分子量が小さいために比較的低い温度で溶融する。ポリエステルは、周囲温度よりもほんの僅か高い温度であるが積層体を形成するポリマーフィルムが分解又は変形しない温度で接着剤を適用することができるように、周囲温度よりもほんの僅か高い低温で溶融することが必要である。このことは、当然のことながらポリマーフィルムの個々の性質に依存するが、より感熱性の高いフィルムに対してはポリエステルが約80℃以下の温度で溶融することが望ましい。
【0016】
高速貼り合わせ機を使用する適用、例えば、600ft/分(183m/分)以上の速度での適用に対しては、ジイソシアネート/ポリエステル混合物の粘度は貼り合わせ温度で約300〜約2000cpsであることが好ましく、貼り合わせ温度で約400〜約1000cpsであることがより好ましい。貼り合わせ温度は、好ましくは80℃以下、より好ましくは70℃以下、さらに好ましくは60℃以下、最も好ましくは55℃以下である。すなわち、参考までに述べると、個々の適用に依存して、上記粘度は、先に列挙した温度のうちの少なくとも1つの温度、すなわち80℃、70℃、60℃又は55℃での粘度に該当すべきである。
【0017】
本発明の接着剤は、ポリプロピレン、ポリエチレン、ポリエステル、ポリアミドのフィルム及び同時押出フィルムを包含する種々のポリマーフィルムを接着するのに有用である。当然のことながら、この接着剤は、不十分な遮断性を有するフィルムを接着させて高遮断性積層体を提供することにおいて最も有用である。2枚のフィルム同士の間の接着性は非常に優れ、このウレタン接着剤から形成される積層体は剥離性でない。
【0018】
概して、貼り合わせ前、すなわち貼り合わせ前の約1分以内に2つの接着剤成分が混合される。溶融ポリエステルは液状ジイソシアネートと混合され、接着剤混合物組成物が形成される。接着剤混合物組成物は、ポリマーフィルムのうちの1枚に適用され、両方のフィルムがニップに通され、そしてその結果として得られる積層体がリールに巻き取られる。塗布量は、典型的には1〜3ポンド毎連(1.6〜4.9g/m2 )、好ましくは約1.5ポンド毎連(2.4g/m2 )である。高い遮断性を達成するには、速度が遅いウレタン形成反応が最も望ましく、貼り合わせ後に、積層体は巻き取られ、そのリールは周囲温度でイソシアネートとポリエステルのヒドロキシル基の間の反応を完了させるのに十分な時間貯蔵される。周囲温度で少なくとも1週間の貯蔵が望ましい。
【0019】
低粘度イソシアネートキャップドプレポリマーが形成されるようにジイソシアネートをポリエステルの一部と予備反応させ、ポリエステルの残りをプレポリマーと反応させること、及び適用の時点でNCO/OH比が約1〜約1.1であることも本発明の範囲内に含まれる。いずれの場合においても、高結晶性であり、そのため酸素、湿分及び他の気体に対して高遮断性である接着剤層を提供するために、1種のジオール、ジカルボン酸及び好ましくはジイソシアネートが使用される。プレポリマーが形成される場合には、プレポリマーを形成する際に約2〜約8の間のNCO/OH比が概して使用される。ポリエステルの一部をジイソシアネートと予備反応させたプレポリマーを形成させることの主な理由は、接着剤混合物組成物の粘度が適用温度で低くなりすぎないようにするためである。概して、この方法に従う場合には、ジイソシアネートの全部がポリエステルの適切な割合の一部と反応する。しかしながら、ジイソシアネートの25重量%がポリエステルの適切な割合の一部と予備反応したとしても、粘度の実質的な調節が確認される。粘度調節のためにウレタンプレポリマーが望ましい場合には、ポリエステルの少なくとも50重量%を予備反応させることが望ましい。
【0020】
ポリエステルをジイソシアネートと反応させる場合であってもウレタンプレポリマーをポリエステルと反応させる場合であっても、ポリエステルをイソシアネートと反応させる際に1のNCO/OH比が理論的に望ましい。しかしながら、ポリエステルがポリエステル縮合反応に由来する若干の残留水を含みうるため、約1.1のNCO/OH比まで僅かに過剰のジイソシアネートが典型的には使用される。
特定の実施例によって本発明をより詳細に説明する。
【0021】
【実施例】
実施例1〜5
実施例1:1,4−ブタンジオールアジペート(OH価225)のポリエステル13重量部(pbw)を10重量部の高分子量HDIと混合した。混合物を1.6ポンド毎連(2.6g/m2 )の塗布量で1ミル(25ミクロン)の透明延伸ポリプロピレン(OPP)フィルム上にコーティングした。コーティングされたフィルムを160°F(71℃)のニップ温度でもう1枚の1ミル(25ミクロン)OPPフィルムに貼り合わせた。
【0022】
実施例2:26.4pbwの1,6−ヘキサンジオールアジペート(OH価112)を10pbwのHDIポリイソシアネートと混合した。接着剤を2ポンド/連(3.25g/m2 )の塗布量で1ミルの低密度ポリエチレン(LDPE)フィルム上にコーティングした。コーティングされたフィルムを160°F(71℃)のニップ温度でもう1枚の1ミル(25ミクロン)LDPEフィルムに貼り合わせた。
【0023】
実施例3:40pbwの1,6−ヘキサンジオールアジペート(OH価112)を10pbwの2,4’−4,4’−メチレンジフェニルジイソシアネート(MDI)と混合した。混合物を使用し、160°F(71℃)のニップ温度で2枚の1ミル(25ミクロン)同時押出(COEX)フィルムを貼り合わせた。
【0024】
比較例4:40pbwのジエチレングリコールアジペート(OH価112)を10pbwの2,4’−4,4’−MDIと混合し、実施例3におけるように積層体を形成することに使用した。
【0025】
比較例5:従来のアモルファスウレタン接着剤を使用し、実施例2におけるように2枚の1ミル(25ミクロン)LDPEフィルムを貼り合わせた。
【0026】
参考のため、実施例において使用した接着剤層を有していない1ミル(25ミクロン)の各フィルム層は湿度0%、75°F(23.9℃)で次の酸素透過度(OTR)(単位: cc/in2/日)を有していた:LDPE 479.0;OPP
98.0;COEX 85.6。
結果(湿度0%、75°F(23.9℃)でのOTR(cc/in2/日))は次の通りである:
【0027】
【表1】
【0028】
実施例1の透湿度は0.13cc/100in2/日であり、これに対して1ミル(25ミクロン)のOPP層の透湿度は0.40cc/100in2/日であった。
Claims (6)
- 高遮断性接着剤を形成するための貼り合わせ用ウレタン接着剤組成物であって、
(A)が末端ヒドロキシル基及び2〜10個の炭素原子を有する1種の線状脂肪族ジオールと1種の線状ジカルボン酸から形成された溶融状態にあるヒドロキシル末端ポリエステルであって、300〜5000の数平均分子量及び80℃以下の融点を有するヒドロキシル末端ポリエステルであり、
(B)が1種のジイソシアネートであり、
(C)が前記ジイソシアネート(B)の全部若しくは一部(B’)を前記ポリエステル(A)の一部(A’)と2〜8のNCO/OH比で反応させて得られる反応生成物であるウレタンプレポリマーであり、
(A'')が前記ポリエステル(A)の残りの部分であり、
(B'')が前記ジイソシアネート(B)の残りの部分であるとすると、(A)を含む第1部分と(B)を含む第2部分との又は(A'')を含む第1部分ともし存在するならば(B'')及び(C)を含む第2部分との無溶剤液状混合物であって、前記ポリエステル(A)に対する前記イソシアネート(B)のNCO/OH比が1〜1.1の間である無溶剤液状混合物を含む貼り合わせ用ウレタン接着剤組成物。 - 前記ジオールが3〜6個の炭素原子を有する請求項1記載の接着剤組成物。
- 前記ポリエステルが500〜2000の間の数平均分子量を有する請求項1記載の接着剤組成物。
- 前記ポリエステルが70℃以下の融点を有する請求項1記載の接着剤組成物。
- 前記ポリエステルが60℃以下の融点を有する請求項1記載の接着剤組成物。
- 前記ポリエステルが55℃以下の融点を有する請求項1記載の接着剤組成物。
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US93212697A | 1997-09-17 | 1997-09-17 | |
US08/932126 | 1997-09-17 |
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JP2000247932A Expired - Lifetime JP3588314B2 (ja) | 1997-09-17 | 2000-08-09 | 貼り合わせ用ウレタン接着剤組成物 |
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US (2) | US6462163B2 (ja) |
EP (1) | EP0906944B1 (ja) |
JP (2) | JP3160578B2 (ja) |
CN (1) | CN1090219C (ja) |
AT (1) | ATE221110T1 (ja) |
AU (1) | AU706147B2 (ja) |
BR (1) | BR9806482A (ja) |
CA (1) | CA2245530A1 (ja) |
DE (1) | DE69806709T2 (ja) |
NO (1) | NO984287L (ja) |
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SG (1) | SG72856A1 (ja) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NZ331408A (en) * | 1997-09-17 | 1999-10-28 | Morton Int Inc | Solvent free urethane adhesive composition containing a mixture of hydroxy-terminated polyester and diisocyanate |
JP4524463B2 (ja) | 1999-07-27 | 2010-08-18 | 三井化学株式会社 | ガスバリア性ポリウレタン樹脂及びこれを含むガスバリア性フィルム |
JP2002249745A (ja) | 2001-02-27 | 2002-09-06 | Mitsui Takeda Chemicals Inc | 2液硬化型無溶剤系接着剤組成物 |
AU2002308113A1 (en) * | 2001-03-30 | 2002-10-15 | Ludwig Fr. Noltemeyer Gmbh | Method for producing composite films by using a solvent-free adhesive system |
US7168581B2 (en) | 2001-12-21 | 2007-01-30 | Rexam Medical Packaging Inc. | Closure for a retort processed container having a peelable seal |
US7644902B1 (en) | 2003-05-31 | 2010-01-12 | Rexam Medical Packaging Inc. | Apparatus for producing a retort thermal processed container with a peelable seal |
DE10344448A1 (de) | 2003-09-25 | 2005-04-28 | Henkel Kgaa | Bindemittel mit Barriere-Eigenschaft |
DE102004062204A1 (de) * | 2004-05-03 | 2005-12-01 | Süd-Chemie AG | Schichtförmiges Material, insbesondere zur Verpackung von sauerstoffempfindlichen Produkten |
US7798359B1 (en) * | 2004-08-17 | 2010-09-21 | Momar Industries LLC | Heat-sealed, peelable lidding membrane for retort packaging |
US8933188B2 (en) * | 2004-11-12 | 2015-01-13 | Henkel US IP LLC | Low misting laminating adhesives |
US8100277B1 (en) | 2005-07-14 | 2012-01-24 | Rexam Closures And Containers Inc. | Peelable seal for an opening in a container neck |
US7780024B1 (en) | 2005-07-14 | 2010-08-24 | Rexam Closures And Containers Inc. | Self peel flick-it seal for an opening in a container neck |
US20070047852A1 (en) * | 2005-08-29 | 2007-03-01 | Exopack-Technology, Llc | Grease-resistant pinch-bottom bag, adhesive closure for bag, and related methods |
US8282539B2 (en) | 2008-12-22 | 2012-10-09 | Exopack, Llc | Multi-layered bags and methods of manufacturing the same |
US20070047853A1 (en) * | 2005-08-29 | 2007-03-01 | Exopack-Technology, Llc | Grease-resistant bag having adhesive closure, adhesive closure for bag, and related methods |
US20070042146A1 (en) * | 2005-08-19 | 2007-02-22 | Exopack-Technology, Llc | Grease-resistant bag and related methods |
US8251236B1 (en) | 2007-11-02 | 2012-08-28 | Berry Plastics Corporation | Closure with lifting mechanism |
JP5397584B2 (ja) | 2008-07-22 | 2014-01-22 | 東洋製罐株式会社 | 無溶剤型接着剤を使用した多層フィルム、その製造方法および包装容器 |
US9056697B2 (en) | 2008-12-15 | 2015-06-16 | Exopack, Llc | Multi-layered bags and methods of manufacturing the same |
JP5410788B2 (ja) * | 2009-02-27 | 2014-02-05 | 株式会社クレハ | 包装容器の製造方法 |
US8604399B2 (en) | 2009-10-19 | 2013-12-10 | Exopack, Llc | Microwavable bags for use with liquid oil and related methods |
WO2013027609A1 (ja) * | 2011-08-24 | 2013-02-28 | Dic株式会社 | 板状無機化合物を含有する接着剤用樹脂組成物、および接着剤 |
ES2381514B1 (es) | 2011-12-09 | 2013-05-27 | Plasticos Romero, S.A. | Procedimiento de inclusion de materiales barrera en adhesivos |
RU2659260C2 (ru) | 2013-05-30 | 2018-06-29 | Дау Глоубл Текнолоджиз Ллк | Способ ламинирования |
RU2015156806A (ru) | 2013-05-30 | 2017-07-05 | Дау Глоубл Текнолоджиз Ллк | Гибридные полиолы |
JP6407264B2 (ja) * | 2013-10-15 | 2018-10-17 | ダウ グローバル テクノロジーズ エルエルシー | 低減した酸素透過率を有する積層体を作製する方法 |
JP6668704B2 (ja) * | 2015-11-24 | 2020-03-18 | 東洋製罐株式会社 | 多層構造フィルム及びその製造方法 |
WO2017104639A1 (ja) * | 2015-12-17 | 2017-06-22 | Dic株式会社 | ガスバリア性接着剤、フィルム、及びガスバリア性フィルム |
EP3622032A4 (en) * | 2017-05-11 | 2020-12-23 | Dow Global Technologies LLC | ADHESIVE COMPOSITIONS BASED ON AN AQUEOUS POLYURETHANE DISPERSION |
MX2020001151A (es) * | 2017-07-31 | 2020-03-24 | Dow Global Technologies Llc | Estructuras de película laminada completamente de polietileno con capa adhesiva de barrera. |
CN111107990A (zh) * | 2017-09-22 | 2020-05-05 | 陶氏环球技术有限责任公司 | 具有阻挡胶粘层的层压膜结构 |
WO2020187681A1 (en) | 2019-03-15 | 2020-09-24 | Henkel Ag & Co. Kgaa | Sulfone-resin containing gas-barrier adhesive |
CN111267446A (zh) * | 2020-03-09 | 2020-06-12 | 黄山永新股份有限公司 | 一种单一透明材质阻隔包装复合膜及其制备方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE160881C (ja) * | ||||
US2801648A (en) * | 1954-01-21 | 1957-08-06 | Goodrich Co B F | Container bonded with a polyesterurethane |
BE637524A (ja) | 1963-09-17 | |||
BE793239A (fr) * | 1971-12-24 | 1973-06-22 | Basf Ag | Feuille combinee a couches multiples |
DE2328430C2 (de) * | 1973-06-05 | 1983-05-11 | Basf Ag, 6700 Ludwigshafen | Verfahren zur Herstellung von Haftklebern |
US4010311A (en) * | 1973-09-14 | 1977-03-01 | Ppg Industries, Inc. | Impact-resistant glass-polyesterurethane laminates |
JPS50161598A (ja) * | 1974-06-22 | 1975-12-27 | ||
US4242488A (en) * | 1979-05-09 | 1980-12-30 | National Starch And Chemical Corporation | Modified polyurethane adhesive compositions containing a carbamate ester additive useful in laminating substrates |
JPS56155270A (en) * | 1980-04-30 | 1981-12-01 | Toyoda Gosei Co Ltd | Adhesive for synthetic resin |
DE3230009A1 (de) * | 1981-08-18 | 1983-03-24 | VEB Synthesewerk Schwarzheide Kombinat SYS, DDR 7817 Schwarzheide | Verfahren zur herstellung von festen polyurethan-klebstoffen |
JPS60115616A (ja) * | 1983-11-26 | 1985-06-22 | Toyobo Co Ltd | 熱可塑性ポリウレタン樹脂の製造法 |
EP0160881A3 (de) | 1984-05-07 | 1988-08-24 | GEIMUPLAST PETER MUNDT GmbH & Co. KG | Verfahren zum Herstellen von Diapositiv-Rähmchen |
DE3707350A1 (de) | 1987-03-07 | 1988-09-15 | Teroson Gmbh | Zweikomponentenmasse und deren verwendung |
DE4000889A1 (de) * | 1990-01-13 | 1991-07-25 | Herberts Gmbh | Bindemittelzusammensetzung zur herstellung von pigmentpasten und waessrige ueberzugsmittel, die diese pigmentpasten enthalten |
US5306787A (en) * | 1990-11-26 | 1994-04-26 | Showa Highpolymer Co., Ltd. | Method for producing saturated polyester |
JP2882756B2 (ja) * | 1994-10-12 | 1999-04-12 | 昭和高分子株式会社 | 脂肪族ポリエステル組成物からなる延伸中空成形体 |
US5872203A (en) | 1995-09-25 | 1999-02-16 | Adco Products, Inc. | Polyurethane adhesive composition for bonding polymeric roofing materials to roof-deck substrates |
NZ331408A (en) * | 1997-09-17 | 1999-10-28 | Morton Int Inc | Solvent free urethane adhesive composition containing a mixture of hydroxy-terminated polyester and diisocyanate |
EP1374574B1 (en) | 2001-02-28 | 2009-10-21 | Thomson Licensing | Method for searching of an electronic program guide |
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1998
- 1998-08-17 NZ NZ331408A patent/NZ331408A/en unknown
- 1998-08-19 AU AU80784/98A patent/AU706147B2/en not_active Ceased
- 1998-08-20 SG SG1998003159A patent/SG72856A1/en unknown
- 1998-08-24 CA CA 2245530 patent/CA2245530A1/en not_active Abandoned
- 1998-09-15 BR BR9806482A patent/BR9806482A/pt not_active Application Discontinuation
- 1998-09-16 NO NO984287A patent/NO984287L/no not_active Application Discontinuation
- 1998-09-17 CN CN98119608A patent/CN1090219C/zh not_active Expired - Lifetime
- 1998-09-17 AT AT98307585T patent/ATE221110T1/de not_active IP Right Cessation
- 1998-09-17 DE DE69806709T patent/DE69806709T2/de not_active Expired - Lifetime
- 1998-09-17 JP JP26318298A patent/JP3160578B2/ja not_active Expired - Lifetime
- 1998-09-17 EP EP19980307585 patent/EP0906944B1/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
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EP0906944A3 (en) | 1999-12-08 |
NO984287L (no) | 1999-03-18 |
CA2245530A1 (en) | 1999-03-17 |
CN1212984A (zh) | 1999-04-07 |
NZ331408A (en) | 1999-10-28 |
EP0906944A2 (en) | 1999-04-07 |
US6589384B2 (en) | 2003-07-08 |
JP3160578B2 (ja) | 2001-04-25 |
JPH11148066A (ja) | 1999-06-02 |
US20010013393A1 (en) | 2001-08-16 |
JP2001098247A (ja) | 2001-04-10 |
DE69806709T2 (de) | 2002-11-28 |
US6462163B2 (en) | 2002-10-08 |
EP0906944B1 (en) | 2002-07-24 |
ATE221110T1 (de) | 2002-08-15 |
AU706147B2 (en) | 1999-06-10 |
NO984287D0 (no) | 1998-09-16 |
CN1090219C (zh) | 2002-09-04 |
DE69806709D1 (de) | 2002-08-29 |
AU8078498A (en) | 1999-04-01 |
BR9806482A (pt) | 1999-12-14 |
SG72856A1 (en) | 2000-05-23 |
US20010012868A1 (en) | 2001-08-09 |
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