JP3487264B2 - 電子部品のボンディング装置 - Google Patents

電子部品のボンディング装置

Info

Publication number
JP3487264B2
JP3487264B2 JP2000204643A JP2000204643A JP3487264B2 JP 3487264 B2 JP3487264 B2 JP 3487264B2 JP 2000204643 A JP2000204643 A JP 2000204643A JP 2000204643 A JP2000204643 A JP 2000204643A JP 3487264 B2 JP3487264 B2 JP 3487264B2
Authority
JP
Japan
Prior art keywords
suction
electronic component
hole
horn
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000204643A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002026078A (ja
JP2002026078A5 (enExample
Inventor
誠司 ▲高▼橋
健一 大竹
隆稔 石川
誠 岡崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2000204643A priority Critical patent/JP3487264B2/ja
Priority to US09/899,356 priority patent/US6497354B2/en
Publication of JP2002026078A publication Critical patent/JP2002026078A/ja
Priority to US10/271,220 priority patent/US6543669B2/en
Application granted granted Critical
Publication of JP3487264B2 publication Critical patent/JP3487264B2/ja
Publication of JP2002026078A5 publication Critical patent/JP2002026078A5/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2000204643A 2000-07-06 2000-07-06 電子部品のボンディング装置 Expired - Fee Related JP3487264B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000204643A JP3487264B2 (ja) 2000-07-06 2000-07-06 電子部品のボンディング装置
US09/899,356 US6497354B2 (en) 2000-07-06 2001-07-05 Bonding apparatus and bonding tool for component
US10/271,220 US6543669B2 (en) 2000-07-06 2002-10-15 Bonding apparatus and bonding tool for component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000204643A JP3487264B2 (ja) 2000-07-06 2000-07-06 電子部品のボンディング装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2003171934A Division JP3966234B2 (ja) 2003-06-17 2003-06-17 電子部品のボンディング装置およびボンディングツール
JP2003171936A Division JP3487306B2 (ja) 2003-06-17 2003-06-17 電子部品のボンディングツール

Publications (3)

Publication Number Publication Date
JP2002026078A JP2002026078A (ja) 2002-01-25
JP3487264B2 true JP3487264B2 (ja) 2004-01-13
JP2002026078A5 JP2002026078A5 (enExample) 2004-07-08

Family

ID=18701878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000204643A Expired - Fee Related JP3487264B2 (ja) 2000-07-06 2000-07-06 電子部品のボンディング装置

Country Status (2)

Country Link
US (2) US6497354B2 (enExample)
JP (1) JP3487264B2 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6885522B1 (en) * 1999-05-28 2005-04-26 Fujitsu Limited Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
JP2003197686A (ja) * 2001-10-18 2003-07-11 Nec Corp 電子部品実装装置及び電子部品実装方法
JP3788351B2 (ja) * 2002-01-21 2006-06-21 松下電器産業株式会社 電子部品のボンディング装置および電子部品のボンディングツール
JP3966217B2 (ja) * 2003-04-23 2007-08-29 松下電器産業株式会社 ボンディング装置およびボンディングツール
JP2005079527A (ja) * 2003-09-03 2005-03-24 Toshiba Corp 電子部品実装装置、電子部品実装方法および電子回路装置
JP2006135249A (ja) * 2004-11-09 2006-05-25 Fujitsu Ltd 超音波実装方法およびこれに用いる超音波実装装置
KR100899421B1 (ko) * 2007-02-28 2009-05-27 삼성테크윈 주식회사 칩 본딩 툴, 그 본딩 툴을 구비하는 플립 칩 본딩 장치 및 방법
US7850056B2 (en) * 2007-04-27 2010-12-14 Panasonic Corporation Electronic component mounting apparatus and electronic component mounting method
KR101294039B1 (ko) * 2007-10-09 2013-08-08 현대자동차주식회사 연료 전지의 금속 분리판 접합용 초음파 용접장치
JP4874445B2 (ja) * 2007-11-07 2012-02-15 超音波工業株式会社 超音波接合ツール及び超音波接合ツールの取付方法
JP4564548B2 (ja) * 2008-04-28 2010-10-20 株式会社アルテクス 超音波振動接合用共振器とそれを支持する支持装置
JP5313751B2 (ja) * 2008-05-07 2013-10-09 パナソニック株式会社 電子部品装着装置
US8056792B2 (en) * 2009-05-05 2011-11-15 Branson Ultrasonics Corporation Scalloped horn
JP5491081B2 (ja) * 2009-06-22 2014-05-14 株式会社アルテクス 超音波振動金属接合用共振器
US8113411B2 (en) * 2010-03-30 2012-02-14 Flextronics Ap, Llc Universal radio frequency shield removal
JP4880055B2 (ja) 2010-06-04 2012-02-22 株式会社新川 電子部品実装装置及びその方法
CN102284764B (zh) * 2011-07-27 2013-01-23 上海第一机床厂有限公司 小孔径通孔的堆焊方法
KR102073189B1 (ko) * 2013-04-04 2020-02-04 삼성에스디아이 주식회사 이차전지용 용접혼
US9136243B2 (en) 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
KR20230019842A (ko) * 2020-06-03 2023-02-09 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 초음파 용접 시스템, 이를 사용하는 방법, 및 용접된 전도성 핀을 포함하는 관련 작업물
KR20220153723A (ko) * 2021-05-11 2022-11-21 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
CN113732482A (zh) * 2021-09-30 2021-12-03 广州市科普超声电子技术有限公司 超声金属焊工具头

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3684384A (en) * 1969-03-17 1972-08-15 Hitachi Ltd Positioning arrangement and face down bonder incorporating the same
JP2915350B2 (ja) 1996-07-05 1999-07-05 株式会社アルテクス 超音波振動接合チップ実装装置
JP3099942B2 (ja) 1996-08-08 2000-10-16 株式会社アルテクス 超音波振動接合用共振器
DE69919822T2 (de) * 1998-12-10 2005-09-15 Ultex Corp. Ultraschallschwingungsschweissverfahren
CA2314733A1 (en) * 1999-08-02 2001-02-02 Ultex Corporation Ultrasonic vibration bonding tool

Also Published As

Publication number Publication date
US20030038158A1 (en) 2003-02-27
US6497354B2 (en) 2002-12-24
JP2002026078A (ja) 2002-01-25
US6543669B2 (en) 2003-04-08
US20020066767A1 (en) 2002-06-06

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