JP3357069B2 - Ｃｍｏｓ装置 - Google Patents

Ｃｍｏｓ装置

Info

Publication number
JP3357069B2
JP3357069B2 JP52084597A JP52084597A JP3357069B2 JP 3357069 B2 JP3357069 B2 JP 3357069B2 JP 52084597 A JP52084597 A JP 52084597A JP 52084597 A JP52084597 A JP 52084597A JP 3357069 B2 JP3357069 B2 JP 3357069B2
Authority
JP
Japan
Prior art keywords
substrate
cmos device
region
nmos
cmos
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP52084597A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000501247A (ja
Inventor
ゼトラク ホルガー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JP2000501247A publication Critical patent/JP2000501247A/ja
Application granted granted Critical
Publication of JP3357069B2 publication Critical patent/JP3357069B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS
    • H10D84/858—Complementary IGFETs, e.g. CMOS comprising a P-type well but not an N-type well

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
JP52084597A 1995-12-06 1996-11-18 Ｃｍｏｓ装置 Expired - Fee Related JP3357069B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19545554A DE19545554A1 (de) 1995-12-06 1995-12-06 CMOS-Anordnung
DE19545554.1 1995-12-06
PCT/DE1996/002189 WO1997021240A2 (de) 1995-12-06 1996-11-18 Cmos-anordnung

Publications (2)

Publication Number Publication Date
JP2000501247A JP2000501247A (ja) 2000-02-02
JP3357069B2 true JP3357069B2 (ja) 2002-12-16

Family

ID=7779372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52084597A Expired - Fee Related JP3357069B2 (ja) 1995-12-06 1996-11-18 Ｃｍｏｓ装置

Country Status (10)

Country Link
US (1) US6160295A (2)
EP (1) EP0865669A2 (2)
JP (1) JP3357069B2 (2)
KR (1) KR100415129B1 (2)
CN (1) CN1230903C (2)
DE (1) DE19545554A1 (2)
IN (1) IN190506B (2)
RU (1) RU2170475C2 (2)
UA (1) UA56148C2 (2)
WO (1) WO1997021240A2 (2)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1549130A (en) * 1977-06-01 1979-08-01 Hughes Microelectronics Ltd Cm Monolithic integrated circuit
JPS5591162A (en) * 1978-12-27 1980-07-10 Fujitsu Ltd Semiconductor device
JPS58223362A (ja) * 1982-06-21 1983-12-24 Nippon Telegr & Teleph Corp <Ntt> 半導体装置
JPH0669086B2 (ja) * 1983-03-29 1994-08-31 株式会社日立製作所 半導体装置
EP0197730A3 (en) * 1985-03-29 1987-08-19 Advanced Micro Devices, Inc. Latch-up resistant integrated circuit and method of manufacture
ATE75877T1 (de) * 1985-08-26 1992-05-15 Siemens Ag Integrierte schaltung in komplementaerer schaltungstechnik mit einem substratvorspannungs- generator und einer schottky-diode.
US5336911A (en) * 1988-05-10 1994-08-09 Seiko Epson Corporation Semiconductor device
JPH02152254A (ja) * 1988-12-02 1990-06-12 Mitsubishi Electric Corp 半導体集積回路装置
JPH0396272A (ja) * 1989-09-08 1991-04-22 Toshiba Micro Electron Kk Ｃｍｏｓ半導体装置
RU2018994C1 (ru) * 1992-03-31 1994-08-30 Константин Иванович Баринов Элемент памяти
KR0120572B1 (ko) * 1994-05-04 1997-10-20 김주용 반도체 소자 및 그 제조방법

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Ｎｅｉｌ Ｈ．Ｅ．Ｗｅｓｔｅ ｅｔ ａｌ．，Ｐｒｉｎｃｉｐｌｅｓ ｏｆ ＣＭＯＳ ＶＬＳＩ ｄｅｓｉｇｎ，米国，Ａｄｄｉｓｏｎ−Ｗｅｓｌｅｙ Ｐｕｂ．，１９８５年１０月，ｐｐ．７５−７６，８４−８５

Also Published As

Publication number Publication date
EP0865669A2 (de) 1998-09-23
CN1207829A (zh) 1999-02-10
US6160295A (en) 2000-12-12
UA56148C2 (uk) 2003-05-15
RU2170475C2 (ru) 2001-07-10
JP2000501247A (ja) 2000-02-02
CN1230903C (zh) 2005-12-07
DE19545554A1 (de) 1997-06-12
KR19990071877A (ko) 1999-09-27
WO1997021240A2 (de) 1997-06-12
KR100415129B1 (ko) 2004-04-13
WO1997021240A3 (de) 1997-07-31
IN190506B (2) 2003-08-02

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