JP3341221B2 - 半導体ウエハの固定方法及びその装置 - Google Patents

半導体ウエハの固定方法及びその装置

Info

Publication number
JP3341221B2
JP3341221B2 JP1699894A JP1699894A JP3341221B2 JP 3341221 B2 JP3341221 B2 JP 3341221B2 JP 1699894 A JP1699894 A JP 1699894A JP 1699894 A JP1699894 A JP 1699894A JP 3341221 B2 JP3341221 B2 JP 3341221B2
Authority
JP
Japan
Prior art keywords
wafer
electrodes
capacitance
wafer support
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP1699894A
Other languages
English (en)
Japanese (ja)
Other versions
JPH077073A (ja
Inventor
ガスキル ブレイク ジュリアン
トゥー ヴェイリン
キース ストーン デイル
カーレトン ホールデン スコット
Original Assignee
アクセリス テクノロジーズ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21713775&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3341221(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by アクセリス テクノロジーズ インコーポレーテッド filed Critical アクセリス テクノロジーズ インコーポレーテッド
Publication of JPH077073A publication Critical patent/JPH077073A/ja
Application granted granted Critical
Publication of JP3341221B2 publication Critical patent/JP3341221B2/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Jigs For Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
JP1699894A 1993-01-15 1994-01-17 半導体ウエハの固定方法及びその装置 Ceased JP3341221B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/005,030 US5436790A (en) 1993-01-15 1993-01-15 Wafer sensing and clamping monitor
US005030 1993-01-15

Publications (2)

Publication Number Publication Date
JPH077073A JPH077073A (ja) 1995-01-10
JP3341221B2 true JP3341221B2 (ja) 2002-11-05

Family

ID=21713775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1699894A Ceased JP3341221B2 (ja) 1993-01-15 1994-01-17 半導体ウエハの固定方法及びその装置

Country Status (7)

Country Link
US (1) US5436790A (enExample)
EP (1) EP0607043B1 (enExample)
JP (1) JP3341221B2 (enExample)
KR (1) KR100284663B1 (enExample)
CA (1) CA2113290C (enExample)
DE (1) DE69400113T2 (enExample)
TW (1) TW231366B (enExample)

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US5886864A (en) * 1996-12-02 1999-03-23 Applied Materials, Inc. Substrate support member for uniform heating of a substrate
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US6075375A (en) * 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
US6205870B1 (en) 1997-10-10 2001-03-27 Applied Komatsu Technology, Inc. Automated substrate processing systems and methods
US5901030A (en) * 1997-12-02 1999-05-04 Dorsey Gage, Inc. Electrostatic chuck employing thermoelectric cooling
US5872694A (en) * 1997-12-23 1999-02-16 Siemens Aktiengesellschaft Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage
US5948986A (en) * 1997-12-26 1999-09-07 Applied Materials, Inc. Monitoring of wafer presence and position in semiconductor processing operations
US5886865A (en) * 1998-03-17 1999-03-23 Applied Materials, Inc. Method and apparatus for predicting failure of an eletrostatic chuck
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
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US6113165A (en) * 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
US6454332B1 (en) 1998-12-04 2002-09-24 Applied Materials, Inc. Apparatus and methods for handling a substrate
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US6430022B2 (en) * 1999-04-19 2002-08-06 Applied Materials, Inc. Method and apparatus for controlling chucking force in an electrostatic
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US6433342B1 (en) 1999-08-18 2002-08-13 Ibis Technology Corporation Coated wafer holding pin
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US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6307728B1 (en) * 2000-01-21 2001-10-23 Applied Materials, Inc. Method and apparatus for dechucking a workpiece from an electrostatic chuck
JP4615670B2 (ja) * 2000-04-19 2011-01-19 アプライド マテリアルズ インコーポレイテッド 静電チャックにおけるチャッキング力を制御する方法及び装置
KR100344221B1 (ko) * 2000-09-22 2002-07-20 삼성전자 주식회사 웨이퍼 클램프 텐션 측정 장치
US6403322B1 (en) 2001-03-27 2002-06-11 Lam Research Corporation Acoustic detection of dechucking and apparatus therefor
US7073383B2 (en) * 2001-06-07 2006-07-11 Tokyo Electron Limited Apparatus and method for determining clamping status of semiconductor wafer
US6998353B2 (en) 2001-11-05 2006-02-14 Ibis Technology Corporation Active wafer cooling during damage engineering implant to enhance buried oxide formation in SIMOX wafers
US6710360B2 (en) 2002-07-10 2004-03-23 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6900444B2 (en) * 2002-07-29 2005-05-31 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6774373B2 (en) * 2002-07-29 2004-08-10 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US20040079289A1 (en) * 2002-10-23 2004-04-29 Kellerman Peter L. Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging
US6740894B1 (en) 2003-02-21 2004-05-25 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter utilizing a linear scan motor
US20040187787A1 (en) * 2003-03-31 2004-09-30 Dawson Keith E. Substrate support having temperature controlled substrate support surface
US6828572B2 (en) * 2003-04-01 2004-12-07 Axcelis Technologies, Inc. Ion beam incident angle detector for ion implant systems
US6794664B1 (en) 2003-12-04 2004-09-21 Axcelis Technologies, Inc. Umbilical cord facilities connection for an ion beam implanter
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6987272B2 (en) * 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US7030395B2 (en) * 2004-08-06 2006-04-18 Axcelis Technologies, Inc. Workpiece support structure for an ion beam implanter featuring spherical sliding seal vacuum feedthrough
US7982195B2 (en) * 2004-09-14 2011-07-19 Axcelis Technologies, Inc. Controlled dose ion implantation
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US7629597B2 (en) * 2006-08-18 2009-12-08 Axcelis Technologies, Inc. Deposition reduction system for an ion implanter
US7993465B2 (en) * 2006-09-07 2011-08-09 Applied Materials, Inc. Electrostatic chuck cleaning during semiconductor substrate processing
US7986146B2 (en) * 2006-11-29 2011-07-26 Globalfoundries Inc. Method and system for detecting existence of an undesirable particle during semiconductor fabrication
US20090181475A1 (en) * 2008-01-11 2009-07-16 Novellus Systems, Inc. Detecting the presence of a workpiece relative to a carrier head
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
US7948734B2 (en) * 2008-09-11 2011-05-24 Tel Epion Inc. Electrostatic chuck power supply
US8169769B2 (en) * 2008-09-11 2012-05-01 Tel Epion Inc. Electrostatic chuck power supply
US8514544B2 (en) * 2009-08-07 2013-08-20 Trek, Inc. Electrostatic clamp optimizer
JP6151028B2 (ja) * 2013-01-17 2017-06-21 株式会社日立ハイテクノロジーズ 荷電粒子線装置
JP6066084B2 (ja) * 2013-12-11 2017-01-25 日新イオン機器株式会社 基板保持装置、半導体製造装置及び基板吸着判別方法
US9543110B2 (en) 2013-12-20 2017-01-10 Axcelis Technologies, Inc. Reduced trace metals contamination ion source for an ion implantation system
GB2540883B (en) 2014-02-07 2018-12-26 Trek Inc System and method for clamping a work piece
US20150357151A1 (en) 2014-06-10 2015-12-10 Axcelis Technologies, Inc. Ion implantation source with textured interior surfaces
JP6942936B2 (ja) * 2017-08-25 2021-09-29 株式会社アルバック 真空装置、吸着電源
JP7419288B2 (ja) * 2021-03-30 2024-01-22 キヤノントッキ株式会社 制御装置、成膜装置、制御方法、及び電子デバイスの製造方法
CN113984788B (zh) * 2021-12-24 2022-03-15 北京凯世通半导体有限公司 一种通过光学检测仪器对超低温离子注入设备监测的方法
US12435964B2 (en) 2023-11-16 2025-10-07 Tokyo Electron Limited Contactless capacitive measurement tool with improved throughput and accuracy
CN119008501B (zh) * 2024-10-21 2025-02-14 天津吉兆源科技有限公司 静电卡盘电源及控制方法

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Also Published As

Publication number Publication date
KR100284663B1 (ko) 2001-04-02
CA2113290C (en) 1999-11-30
CA2113290A1 (en) 1994-07-16
DE69400113D1 (de) 1996-05-02
US5436790A (en) 1995-07-25
EP0607043B1 (en) 1996-03-27
JPH077073A (ja) 1995-01-10
EP0607043A1 (en) 1994-07-20
DE69400113T2 (de) 1996-10-24
TW231366B (enExample) 1994-10-01
KR940018947A (ko) 1994-08-19

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