JP3285408B2 - 緩衝層としてPb/Biを含有しないペロブスカイトを用いたPb/Biを含有する高比誘電率酸化物 - Google Patents
緩衝層としてPb/Biを含有しないペロブスカイトを用いたPb/Biを含有する高比誘電率酸化物Info
- Publication number
- JP3285408B2 JP3285408B2 JP10455293A JP10455293A JP3285408B2 JP 3285408 B2 JP3285408 B2 JP 3285408B2 JP 10455293 A JP10455293 A JP 10455293A JP 10455293 A JP10455293 A JP 10455293A JP 3285408 B2 JP3285408 B2 JP 3285408B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- dielectric constant
- oxide
- high dielectric
- buffer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10P14/60—
-
- H10D64/0134—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
- H10D1/684—Capacitors having no potential barriers having dielectrics comprising perovskite structures the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers
-
- H10D64/01332—
-
- H10D64/01336—
-
- H10D64/01342—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/681—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
- H10D64/685—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered being perpendicular to the channel plane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates
-
- H10P14/6506—
-
- H10P14/6349—
-
- H10P14/69396—
-
- H10P14/69398—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/014—Capacitor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/118—Oxide films
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/967—Semiconductor on specified insulator
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Semiconductor Memories (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87693092A | 1992-05-01 | 1992-05-01 | |
| US876930 | 1992-05-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06224184A JPH06224184A (ja) | 1994-08-12 |
| JP3285408B2 true JP3285408B2 (ja) | 2002-05-27 |
Family
ID=25368867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10455293A Expired - Fee Related JP3285408B2 (ja) | 1992-05-01 | 1993-04-30 | 緩衝層としてPb/Biを含有しないペロブスカイトを用いたPb/Biを含有する高比誘電率酸化物 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US5393352A (cg-RX-API-DMAC10.html) |
| EP (1) | EP0568064B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP3285408B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR940006213A (cg-RX-API-DMAC10.html) |
| DE (1) | DE69325614T2 (cg-RX-API-DMAC10.html) |
| TW (1) | TW232748B (cg-RX-API-DMAC10.html) |
Families Citing this family (91)
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| US6537830B1 (en) | 1992-10-23 | 2003-03-25 | Symetrix Corporation | Method of making ferroelectric FET with polycrystalline crystallographically oriented ferroelectric material |
| DE69404189T2 (de) * | 1993-03-31 | 1998-01-08 | Texas Instruments Inc | Leicht donatoren-dotierte Elektroden für Materialien mit hoher dielektrischer Konstante |
| US5504041A (en) * | 1994-08-01 | 1996-04-02 | Texas Instruments Incorporated | Conductive exotic-nitride barrier layer for high-dielectric-constant materials |
| US5629229A (en) * | 1995-07-12 | 1997-05-13 | Sharp Kabushiki Kaisha | Metalorganic chemical vapor deposition of (Ba1-x Srx)RuO3 /(Ba1-x Srx)TIO3 /(Ba1-x Srx)TiO3 /(Ba1- Srx)RuO3 capacitors for high dielectric materials |
| JP3274326B2 (ja) * | 1995-09-08 | 2002-04-15 | 株式会社東芝 | 半導体装置およびその製造方法 |
| US5612560A (en) * | 1995-10-31 | 1997-03-18 | Northern Telecom Limited | Electrode structure for ferroelectric capacitors for integrated circuits |
| KR100215861B1 (ko) * | 1996-03-13 | 1999-08-16 | 구본준 | 유전체 박막 제조방법 및 이를 이용한 반도체 장치제조방법 |
| US6455916B1 (en) | 1996-04-08 | 2002-09-24 | Micron Technology, Inc. | Integrated circuit devices containing isolated dielectric material |
| US6023082A (en) * | 1996-08-05 | 2000-02-08 | Lockheed Martin Energy Research Corporation | Strain-based control of crystal anisotropy for perovskite oxides on semiconductor-based material |
| US6548854B1 (en) | 1997-12-22 | 2003-04-15 | Agere Systems Inc. | Compound, high-K, gate and capacitor insulator layer |
| EP0851473A3 (en) * | 1996-12-23 | 1998-07-22 | Lucent Technologies Inc. | Method of making a layer with high dielectric K, gate and capacitor insulator layer and device |
| US6074885A (en) * | 1997-11-25 | 2000-06-13 | Radiant Technologies, Inc | Lead titanate isolation layers for use in fabricating PZT-based capacitors and similar structures |
| US6171898B1 (en) | 1997-12-17 | 2001-01-09 | Texas Instruments Incorporated | Method of fabricating an oxygen-stable layer/diffusion barrier/poly bottom electrode structure for high-K-DRAMS using a disposable-oxide processing |
| US6180446B1 (en) | 1997-12-17 | 2001-01-30 | Texas Instruments Incorporated | Method of fabricating an oxygen-stable layer/diffusion barrier/poly bottom electrode structure for high-K DRAMS using disposable-oxide processing |
| US5998225A (en) * | 1997-12-17 | 1999-12-07 | Texas Instruments Incorporated | Method of fabricating an oxygen-stable layer/diffusion barrier/poly bottom electrode structure for high-K DRAMs using disposable-oxide processing |
| US6184074B1 (en) | 1997-12-17 | 2001-02-06 | Texas Instruments Incorporated | Method of fabrication a self-aligned polysilicon/diffusion barrier/oxygen stable sidewall bottom electrode structure for high-K DRAMS |
| EP0926739A1 (en) | 1997-12-24 | 1999-06-30 | Texas Instruments Incorporated | A structure of and method for forming a mis field effect transistor |
| KR100275121B1 (ko) | 1997-12-30 | 2001-01-15 | 김영환 | 강유전체 캐패시터 제조방법 |
| KR100436059B1 (ko) * | 1997-12-30 | 2004-12-17 | 주식회사 하이닉스반도체 | 강유전체 캐패시터 형성 방법 |
| KR100275726B1 (ko) * | 1997-12-31 | 2000-12-15 | 윤종용 | 강유전체 메모리 장치 및 그 제조 방법 |
| KR100321714B1 (ko) * | 1998-12-30 | 2002-05-09 | 박종섭 | 반도체메모리소자의캐패시터제조방법 |
| US6340827B1 (en) * | 1999-01-13 | 2002-01-22 | Agere Systems Guardian Corp. | Diffusion barrier for use with high dielectric constant materials and electronic devices incorporating same |
| US6241821B1 (en) | 1999-03-22 | 2001-06-05 | Motorola, Inc. | Method for fabricating a semiconductor structure having a crystalline alkaline earth metal oxide interface with silicon |
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| US6215644B1 (en) | 1999-09-09 | 2001-04-10 | Jds Uniphase Inc. | High frequency tunable capacitors |
| KR100340951B1 (ko) * | 1999-11-18 | 2002-06-22 | 윤덕용 | 초고집적도 디램 커패시터용 스트론튬-납 티탄산 박막의 제조방법 |
| US6496351B2 (en) | 1999-12-15 | 2002-12-17 | Jds Uniphase Inc. | MEMS device members having portions that contact a substrate and associated methods of operating |
| US6229684B1 (en) | 1999-12-15 | 2001-05-08 | Jds Uniphase Inc. | Variable capacitor and associated fabrication method |
| US6479173B1 (en) | 1999-12-17 | 2002-11-12 | Motorola, Inc. | Semiconductor structure having a crystalline alkaline earth metal silicon nitride/oxide interface with silicon |
| US6291319B1 (en) * | 1999-12-17 | 2001-09-18 | Motorola, Inc. | Method for fabricating a semiconductor structure having a stable crystalline interface with silicon |
| US6693033B2 (en) | 2000-02-10 | 2004-02-17 | Motorola, Inc. | Method of removing an amorphous oxide from a monocrystalline surface |
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| JP2001313429A (ja) * | 2000-04-27 | 2001-11-09 | Tdk Corp | 積層薄膜その製造方法および電子デバイス |
| JP2004503920A (ja) * | 2000-05-31 | 2004-02-05 | モトローラ・インコーポレイテッド | 半導体デバイスおよび該半導体デバイスを製造する方法 |
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| JP4422678B2 (ja) * | 2002-12-17 | 2010-02-24 | イブル・フォトニクス・インコーポレイテッド | 蒸着法を用いた強誘電性単結晶膜構造物の製造方法 |
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Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4994435A (en) * | 1987-10-16 | 1991-02-19 | The Furukawa Electric Co., Ltd. | Laminated layers of a substrate, noble metal, and interlayer underneath an oxide superconductor |
| US5179070A (en) * | 1988-04-30 | 1993-01-12 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate having a superconducting thin film with a buffer layer in between |
| AU7479291A (en) * | 1990-02-26 | 1991-09-18 | Symetrix Corporation | Electronic devices and methods of constructing and utilizing same |
| JPH0488685A (ja) * | 1990-07-31 | 1992-03-23 | Matsushita Electric Ind Co Ltd | 薄膜基板およびその製造方法 |
| US5173835A (en) * | 1991-10-15 | 1992-12-22 | Motorola, Inc. | Voltage variable capacitor |
| DE59203461D1 (de) * | 1991-11-04 | 1995-10-05 | Asea Brown Boveri | Speiseschaltung für eine Zweirohr-Hydraulik. |
| US5338951A (en) * | 1991-11-06 | 1994-08-16 | Ramtron International Corporation | Structure of high dielectric constant metal/dielectric/semiconductor capacitor for use as the storage capacitor in memory devices |
| EP0540993A1 (en) * | 1991-11-06 | 1993-05-12 | Ramtron International Corporation | Structure and fabrication of high transconductance MOS field effect transistor using a buffer layer/ferroelectric/buffer layer stack as the gate dielectric |
| US5326721A (en) * | 1992-05-01 | 1994-07-05 | Texas Instruments Incorporated | Method of fabricating high-dielectric constant oxides on semiconductors using a GE buffer layer |
| DE69325614T2 (de) * | 1992-05-01 | 2000-01-13 | Texas Instruments Inc | Pb/Bi enthaltende Oxide von hohen Dielektrizitätskonstanten unter Verwendung von Perovskiten als Pufferschicht, die keine Pb/Bi enthalten |
| US5471364A (en) * | 1993-03-31 | 1995-11-28 | Texas Instruments Incorporated | Electrode interface for high-dielectric-constant materials |
-
1993
- 1993-04-29 DE DE69325614T patent/DE69325614T2/de not_active Expired - Fee Related
- 1993-04-29 EP EP93106971A patent/EP0568064B1/en not_active Expired - Lifetime
- 1993-04-30 KR KR1019930007401A patent/KR940006213A/ko not_active Ceased
- 1993-04-30 JP JP10455293A patent/JP3285408B2/ja not_active Expired - Fee Related
- 1993-08-26 TW TW082106903A patent/TW232748B/zh not_active IP Right Cessation
- 1993-09-27 US US08/127,222 patent/US5393352A/en not_active Expired - Lifetime
-
1995
- 1995-02-27 US US08/395,016 patent/US5650646A/en not_active Expired - Lifetime
-
1997
- 1997-04-17 US US08/842,863 patent/US5912486A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| TW232748B (cg-RX-API-DMAC10.html) | 1994-10-21 |
| US5912486A (en) | 1999-06-15 |
| KR940006213A (ko) | 1994-03-23 |
| JPH06224184A (ja) | 1994-08-12 |
| US5650646A (en) | 1997-07-22 |
| EP0568064A3 (cg-RX-API-DMAC10.html) | 1994-04-06 |
| DE69325614D1 (de) | 1999-08-19 |
| EP0568064B1 (en) | 1999-07-14 |
| EP0568064A2 (en) | 1993-11-03 |
| DE69325614T2 (de) | 2000-01-13 |
| US5393352A (en) | 1995-02-28 |
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