JP3274326B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法

Info

Publication number
JP3274326B2
JP3274326B2 JP23162795A JP23162795A JP3274326B2 JP 3274326 B2 JP3274326 B2 JP 3274326B2 JP 23162795 A JP23162795 A JP 23162795A JP 23162795 A JP23162795 A JP 23162795A JP 3274326 B2 JP3274326 B2 JP 3274326B2
Authority
JP
Japan
Prior art keywords
capacitor
film
insulating film
electrode
capacitor electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23162795A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0982907A (ja
Inventor
馨太郎 今井
賢朗 中村
和弘 江口
正弘 清利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23162795A priority Critical patent/JP3274326B2/ja
Priority to DE19636054A priority patent/DE19636054A1/de
Priority to KR1019960038803A priority patent/KR100253866B1/ko
Priority to TW085112080A priority patent/TW306037B/zh
Publication of JPH0982907A publication Critical patent/JPH0982907A/ja
Application granted granted Critical
Publication of JP3274326B2 publication Critical patent/JP3274326B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP23162795A 1995-09-08 1995-09-08 半導体装置およびその製造方法 Expired - Fee Related JP3274326B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP23162795A JP3274326B2 (ja) 1995-09-08 1995-09-08 半導体装置およびその製造方法
DE19636054A DE19636054A1 (de) 1995-09-08 1996-09-05 Halbleitervorrichtung und Verfahren zu deren Herstellung
KR1019960038803A KR100253866B1 (ko) 1995-09-08 1996-09-07 다이나믹 랜덤 억세스 메모리장치 및 그 반도체장치의 제조방법
TW085112080A TW306037B (OSRAM) 1995-09-08 1996-10-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23162795A JP3274326B2 (ja) 1995-09-08 1995-09-08 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPH0982907A JPH0982907A (ja) 1997-03-28
JP3274326B2 true JP3274326B2 (ja) 2002-04-15

Family

ID=16926478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23162795A Expired - Fee Related JP3274326B2 (ja) 1995-09-08 1995-09-08 半導体装置およびその製造方法

Country Status (4)

Country Link
JP (1) JP3274326B2 (OSRAM)
KR (1) KR100253866B1 (OSRAM)
DE (1) DE19636054A1 (OSRAM)
TW (1) TW306037B (OSRAM)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG74643A1 (en) 1997-07-24 2000-08-22 Matsushita Electronics Corp Semiconductor device and method for fabricating the same
JP3424900B2 (ja) * 1997-10-24 2003-07-07 松下電器産業株式会社 半導体装置およびその製造方法
KR20000014388A (ko) * 1998-08-20 2000-03-15 윤종용 강유전체 메모리 커패시터 및 그 제조방법
DE19854418C2 (de) * 1998-11-25 2002-04-25 Infineon Technologies Ag Halbleiterbauelement mit zumindest einem Kondensator sowie Verfahren zu dessen Herstellung
JP2002319636A (ja) * 2001-02-19 2002-10-31 Nec Corp 半導体記憶装置及びその製造方法
JP2002353416A (ja) * 2001-05-25 2002-12-06 Sony Corp 半導体記憶装置およびその製造方法
JP2002367989A (ja) * 2001-06-12 2002-12-20 Tokyo Inst Of Technol 酸化物誘電体薄膜及びその製造方法
KR100433491B1 (ko) * 2002-06-25 2004-05-31 동부전자 주식회사 반도체 소자의 제조방법
JP5726501B2 (ja) * 2010-12-10 2015-06-03 一般財団法人ファインセラミックスセンター 研磨材料、研磨用組成物及び研磨方法
JP5703170B2 (ja) * 2011-08-16 2015-04-15 株式会社アルバック 強誘電体膜の作製方法
US11482529B2 (en) * 2019-02-27 2022-10-25 Kepler Computing Inc. High-density low voltage non-volatile memory with unidirectional plate-line and bit-line and pillar capacitor
US10847201B2 (en) 2019-02-27 2020-11-24 Kepler Computing Inc. High-density low voltage non-volatile differential memory bit-cell with shared plate line
US11744081B1 (en) 2021-05-07 2023-08-29 Kepler Computing Inc. Ferroelectric device film stacks with texturing layer which is part of a bottom electrode, and method of forming such
US11527277B1 (en) 2021-06-04 2022-12-13 Kepler Computing Inc. High-density low voltage ferroelectric memory bit-cell
US12324163B1 (en) 2022-03-15 2025-06-03 Kepler Computing Inc. Planar capacitors with shared electrode and methods of fabrication
US20230395134A1 (en) 2022-06-03 2023-12-07 Kepler Computing Inc. Write disturb mitigation for non-linear polar material based multi-capacitor bit-cell
US12324162B1 (en) 2022-06-17 2025-06-03 Kepler Computing Inc. Stacked capacitors with shared electrodes and methods of fabrication
US12300297B1 (en) 2022-08-05 2025-05-13 Kepler Computing Inc. Memory array with buried or backside word-line
US12334127B2 (en) 2023-01-30 2025-06-17 Kepler Computing Inc. Non-linear polar material based multi-capacitor high density bit-cell
US11765908B1 (en) 2023-02-10 2023-09-19 Kepler Computing Inc. Memory device fabrication through wafer bonding
US20240274651A1 (en) 2023-02-10 2024-08-15 Kepler Computing Inc. Method of forming stacked capacitors through wafer bonding

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5434102A (en) * 1991-02-25 1995-07-18 Symetrix Corporation Process for fabricating layered superlattice materials and making electronic devices including same
JP2715736B2 (ja) * 1991-06-28 1998-02-18 日本電気株式会社 半導体装置の製造方法
EP0568064B1 (en) * 1992-05-01 1999-07-14 Texas Instruments Incorporated Pb/Bi-containing high-dielectric constant oxides using a non-Pb/Bi-containing perovskite as a buffer layer
EP0571948B1 (en) * 1992-05-29 2000-02-09 Texas Instruments Incorporated Donor doped perovskites for thin film dielectrics
US5471364A (en) * 1993-03-31 1995-11-28 Texas Instruments Incorporated Electrode interface for high-dielectric-constant materials
JP2550852B2 (ja) * 1993-04-12 1996-11-06 日本電気株式会社 薄膜キャパシタの製造方法

Also Published As

Publication number Publication date
KR100253866B1 (ko) 2000-04-15
JPH0982907A (ja) 1997-03-28
TW306037B (OSRAM) 1997-05-21
DE19636054A1 (de) 1997-03-13

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