JP3224578U - Surface mount type LED lamp - Google Patents

Surface mount type LED lamp Download PDF

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JP3224578U
JP3224578U JP2018600053U JP2018600053U JP3224578U JP 3224578 U JP3224578 U JP 3224578U JP 2018600053 U JP2018600053 U JP 2018600053U JP 2018600053 U JP2018600053 U JP 2018600053U JP 3224578 U JP3224578 U JP 3224578U
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mounting portion
positive electrode
negative electrode
electrode mounting
led light
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志雄 顔
志雄 顔
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Zhongshan Xiongna Hardware Lighting Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

【課題】外形の制御を達成することができるだけでなく、型締めをして接着剤を注入するときに使用される上型を節約することができる、表面実装型ＬＥＤランプを提供する。【解決手段】一枚以上のＬＥＤ発光ウェハ１を備え、ＬＥＤ発光ウェハ１に少なくとも一組の互いにマッチングした正極ピン１１と負極ピンが接続される表面実装型ＬＥＤランプであって、正極ピン１１は正極実装部１１１を備え、正極実装部１１１にＬＥＤ発光ウェハ１を接続するための正極凸部１１２が突起して設けられ、負極ピンは負極実装部１２１を備え、負極実装部１２１にＬＥＤ発光ウェハ１を接続するための負極凸部１２２が突起して設けられ、負極実装部１２１と正極実装部１１１の高さが同じであり、正極凸部１１２、負極凸部１２２及びＬＥＤ発光ウェハ１の外にコロイド２が包まれ、正極実装部１１１又は負極実装部１２１がコロイド２に突き出る。【選択図】図１Provided is a surface-mounted LED lamp that not only achieves control of the outer shape but also saves an upper mold used when clamping and injecting an adhesive. A surface-mounted LED lamp including one or more LED light-emitting wafers (1), wherein at least one pair of a matched positive electrode pin (11) and a negative electrode pin are connected to the LED light-emitting wafer (1), A positive electrode mounting portion 111 is provided, a positive electrode convex portion 112 for connecting the LED light emitting wafer 1 to the positive electrode mounting portion 111 is provided so as to protrude, and a negative electrode pin is provided with a negative electrode mounting portion 121. The negative electrode mounting portion 121 and the positive electrode mounting portion 111 have the same height, and the negative electrode mounting portion 121 and the positive electrode mounting portion 111 have the same height. The positive electrode mounting portion 111 or the negative electrode mounting portion 121 protrudes into the colloid 2. [Selection diagram] Fig. 1

Description

本考案は表面実装型ＬＥＤランプに関する。   The present invention relates to a surface mount type LED lamp.

従来のいくつかのＬＥＤビーズは接着剤を直接注入して成形され、その形状が円柱状であり、接着剤の注入量が多く、製作コストが高く、後で改良された工程において、接着剤を注入した後、接着剤を塗布するという方式が採用されるが、接着剤塗布工程が製品の外形を調整できないので、製作された製品の外形が単一で、発光面が平面である製品しか製作できず、且つその工程が複雑で、製作コストが高く、また、一般的な表面実装型ＬＥＤランプのコロイドに対して上下の型締めの方式によって接着剤を注入し、金型の精度の要求が高く、さらに離型された表面実装型ＬＥＤランプのピンが曲げられてこそ回路基板に実装されることができ、製作のステップが多く、製作効率に影響を及ぼす。   Some conventional LED beads are molded by directly injecting an adhesive, the shape of which is cylindrical, the amount of the injected adhesive is large, the manufacturing cost is high, and the adhesive is formed in an improved process later. Adhesive is applied after injection.However, since the adhesive application process cannot adjust the outer shape of the product, only products with a single outer shape and a flat light emitting surface are manufactured. It is not possible, the process is complicated, the production cost is high, and the adhesive is injected into the colloid of the general surface mount type LED lamp by the upper and lower mold clamping system, and the precision of the mold is required. Only when the pins of the surface-mounted LED lamps which are high and released are bent can be mounted on the circuit board, the number of manufacturing steps is increased, and the manufacturing efficiency is affected.

上記の課題を解決するために、本考案は構造が簡単で、接着剤の注入量を節約し、製作効率が高い表面実装型ＬＥＤランプを提供することを目的とする。   SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide a surface mount type LED lamp which has a simple structure, saves the amount of adhesive to be injected, and has high manufacturing efficiency.

本考案がその技術的課題を解決するために使用する技術手段は以下の通りである。   The technical means used by the present invention to solve the technical problem are as follows.

表面実装型ＬＥＤランプであって、それは一枚以上のＬＥＤ発光ウェハを備え、前記ＬＥＤ発光ウェハに少なくとも一組の互いにマッチングした正極ピンと負極ピンが接続され、前記正極ピンは正極実装部を備え、前記正極実装部にＬＥＤ発光ウェハを接続するための正極凸部が突起して設けられ、前記負極ピンは負極実装部を備え、前記負極実装部にＬＥＤ発光ウェハを接続するための負極凸部が突起して設けられ、前記負極実装部と正極実装部の高さが同じであり、前記正極凸部、負極凸部及びＬＥＤ発光ウェハの外にコロイドで包まれ、前記正極実装部又は負極実装部が前記コロイドに突き出る。   A surface-mounted LED lamp, comprising one or more LED light-emitting wafers, at least one pair of mutually matched positive and negative pins connected to the LED light-emitting wafer, wherein the positive pin comprises a positive electrode mounting part; A positive electrode protrusion for connecting an LED light emitting wafer to the positive electrode mounting portion is provided so as to protrude, the negative electrode pin includes a negative electrode mounting portion, and a negative electrode protrusion for connecting the LED light emitting wafer to the negative electrode mounting portion is provided. The negative electrode mounting portion and the positive electrode mounting portion have the same height, and are wrapped with colloid outside the positive electrode convex portion, the negative electrode convex portion, and the LED light emitting wafer, and are provided with a protrusion. Protrude into the colloid.

前記正極凸部及び負極凸部がいずれも前記コロイドの底からコロイドの内部に伸びる。   Both the positive and negative electrode protrusions extend from the bottom of the colloid to the inside of the colloid.

前記表面実装型ＬＥＤランプを製作する方法であって、下記のステップを含む。   A method of manufacturing the surface mount type LED lamp includes the following steps.

ステップ１：金属ホルダーを製作することであり、金属ホルダーに複数のＬＥＤライトポイントを製作し、各ＬＥＤライトポイントに金属サーキットボードが設置され、各金属サーキットボードに少なくとも一組の互いにマッチングした正極ピンと負極ピンが設置され、金属ホルダーにおける金属サーキットボードを押し抜き、正極ピンを押し抜くことによって前記正極凸部と正極実装部を形成し、負極ピンを押し抜くことによって前記負極凸部と負極実装部を形成する。   Step 1: fabricating a metal holder, fabricating a plurality of LED light points on the metal holder, installing a metal circuit board on each LED light point, and attaching at least one set of matched positive pins to each metal circuit board. A negative electrode pin is installed, a metal circuit board in a metal holder is punched out, the positive electrode pin is punched out to form the positive electrode convex portion and the positive electrode mounting portion, and the negative electrode pin is punched out to form the negative electrode convex portion and the negative electrode mounting portion. To form

ステップ２：ウェハを固定することであり、各金属サーキットボードにＬＥＤ発光ウェハが固定される。   Step 2: fixing the wafer, in which the LED light emitting wafer is fixed to each metal circuit board.

ステップ３：ワイヤを溶接することであり、ＬＥＤ発光ウェハにおける回路と金属サーキットボードにおける正極ピン及び負極ピンとを溶接する。   Step 3: Welding the wires, welding the circuit on the LED light emitting wafer and the positive and negative pins on the metal circuit board.

ステップ４：接着剤を注入することであり、樹脂接着剤を金型のキャビティに注入し、前記キャビティの開口が上に向き、キャビティの開口の両側の端面が同じ高さになり、ワイヤを溶接した後の金属ホルダーを金型に置き、各ＬＥＤライトポイントを一つのキャビティに一対一で対応させ、前記正極凸部と負極凸部をキャビティに伸ばさせ、前記正極実装部と負極実装部がそれぞれキャビティの開口の両側の端面に掛けられる。   Step 4: Injecting the adhesive, injecting the resin adhesive into the cavity of the mold, the opening of the cavity faces upward, the end faces on both sides of the opening of the cavity become the same height, and the wire is welded. After placing the metal holder in the mold, each LED light point is made to correspond to one cavity one-to-one, the positive electrode convex part and the negative electrode convex part are extended into the cavity, and the positive electrode mounting part and the negative electrode mounting part are respectively It is hung on the end faces on both sides of the cavity opening.

ステップ５：焼き付けることであり、接着剤を注入した後の金属ホルダーと金型を焼付装置に置いて焼き付け、樹脂接着剤を凝固させる。   Step 5: Baking, in which the metal holder and the mold after the adhesive is injected are placed in a baking device and baked to solidify the resin adhesive.

ステップ６：離型することであり、焼き付けした後、金属ホルダーを金型から取り出す。   Step 6: To release, after baking, remove the metal holder from the mold.

ステップ７：フットカットして脱穀することであり、各金属サーキットボードにおける正極ピンと負極ピンを切り、各表面実装型ＬＥＤランプに金属ホルダーを離脱させる。   Step 7: Threshing by foot cutting, cutting the positive and negative pins on each metal circuit board, and detaching the metal holder from each surface-mounted LED lamp.

好ましくは、ステップ２において接着剤の塗布によりＬＥＤ発光ウェハを固定する。   Preferably, in step 2, the LED light emitting wafer is fixed by applying an adhesive.

ここで、ステップ４において注入された接着剤が液体樹脂であり、金属ホルダーが動くことを防止するために、前記金型にプレッシャープレートを被せ、プレッシャープレートで金属ホルダーを金型に固定する。   Here, the adhesive injected in step 4 is a liquid resin, and in order to prevent the metal holder from moving, a pressure plate is put on the mold, and the metal holder is fixed to the mold with the pressure plate.

ステップ５において焼き付け温度は１３０℃〜１３５℃であり、焼け付け時間は４０分〜４５分である。   In step 5, the baking temperature is 130 ° C. to 135 ° C., and the baking time is 40 minutes to 45 minutes.

ステップ７の後、ステップ８が設けられる：テストするを行うことであり、表面実装型ＬＥＤランプの性能をテストし、不合格の製品を篩う。   After step 7, step 8 is provided: performing a test, testing the performance of the surface mount LED lamp and sieving the rejected product.

ステップ８において自動分光機でテストを行う。   In step 8, a test is performed with an automatic spectrometer.

ステップ８の後、ステップ９が設けられる：編組をして包装することであり、テストして合格する表面実装型ＬＥＤランプを自動編組機に入れ、プラスチックリールに巻き取る。   After step 8, step 9 is provided: braiding and packaging, the tested and passing surface mounted LED lamp is put into an automatic braiding machine and wound on a plastic reel.

考案の有益な効果は以下の通りである：本考案の表面実装型ＬＥＤランプの正極ピンと負極ピンにそれぞれコロイドに突き出る正極実装部と負極実装部が設けられ、ピンを曲げることなくＬＥＤランプをサーキットボードに実装されることができ、上記の表面実装型ＬＥＤランプを製作する方法はウェハを固定し、ワイヤを溶接した後に接着剤を注入することであり、接着剤を注入するときに上向きのキャビティを有する金型の中に行い、このようにキャビティ形状を変えることにより表面実装型ＬＥＤランプの外形の調整を達成することができるだけでなく、型締めをして接着剤を注入するときに使用される上型を節約することができ、使用される金型のコストを削減させ、製作工程が簡単で、コストが低い。   The beneficial effects of the present invention are as follows: the positive electrode pin and the negative electrode pin of the surface mount type LED lamp of the present invention are provided with a positive electrode mounting part and a negative electrode mounting part, respectively, which protrude into colloid, so that the LED lamp can be circuited without bending the pin The method of fabricating the above surface mount LED lamps, which can be mounted on a board, is to fix the wafer, weld the wires and then inject the adhesive, with the upward facing cavity when injecting the adhesive. By changing the cavity shape in this way, not only can the outer shape of the surface-mounted LED lamp be adjusted, but also it is used when the mold is closed and the adhesive is injected. The upper mold can be saved, the cost of the mold used can be reduced, the manufacturing process is simple, and the cost is low.

本考案の表面実装型ＬＥＤランプの概略構成図である。FIG. 2 is a schematic configuration diagram of the surface-mounted LED lamp of the present invention. 表面実装型ＬＥＤランプを製作する方法の工程ステップ図である。FIG. 4 is a process step diagram of a method for manufacturing a surface-mounted LED lamp. 本考案の金属ホルダーの正面図である。It is a front view of the metal holder of the present invention. 本考案のキャビティの実施例１の断面図である。FIG. 3 is a cross-sectional view of Embodiment 1 of the cavity of the present invention. 本考案のキャビティの実施例２の断面図である。FIG. 4 is a cross-sectional view of Embodiment 2 of the cavity of the present invention. 離型した後の金属ホルダーの概略構成図である。It is a schematic structure figure of a metal holder after release.

以下に図面と具体的な実施形態を組み合わせて本考案をさらに詳しく説明する。   Hereinafter, the present invention will be described in more detail by combining the drawings with specific embodiments.

図１を参照すると、表面実装型ＬＥＤランプであって、それは一枚以上のＬＥＤ発光ウェハ１を備え、前記ＬＥＤ発光ウェハ１に少なくとも一組の互いにマッチングした正極ピン１１と負極ピン１２が接続され、前記正極ピン１１は正極実装部１１１を備え、前記正極実装部１１１にＬＥＤ発光ウェハ１を接続するための正極凸部１１２が突起して設けられ、前記負極ピン１２は負極実装部１２１をそなえ、前記負極実装部１２１にＬＥＤ発光ウェハ１を連結するための負極凸部１２２が突起して設けられ、前記負極実装部１２１と正極実装部１１１の高さが同じであり、前記正極凸部１１２、負極凸部１２２及びＬＥＤ発光ウェハの外にコロイドが包まれ、前記正極実装部１１１又は負極実装部１２１が前記コロイドに突き出る。本実施例において、該表面実装型ＬＥＤランプは三枚のＬＥＤ発光ウェハ１を備え、各発光ウェハ１に一組の互いにマッチングした正極ピン１１と負極ピン１２がそれぞれ接続され、上記三枚のＬＥＤ発光ウェハの発光色が異なり、三枚のＬＥＤ発光ウェハから発された光は異なる色を示すように混合することができる。   Referring to FIG. 1, a surface-mounted LED lamp includes one or more LED light emitting wafers 1, and at least one pair of matched positive and negative pins 11 and 12 is connected to the LED light emitting wafer 1. The positive electrode pin 11 includes a positive electrode mounting portion 111, a positive electrode convex portion 112 for connecting the LED light emitting wafer 1 to the positive electrode mounting portion 111 is provided to protrude, and the negative electrode pin 12 includes a negative electrode mounting portion 121. A negative protrusion 122 for connecting the LED light-emitting wafer 1 to the negative mount 121 is protruded, and the height of the negative mount 121 and the positive mount 111 is the same. The colloid is wrapped around the negative electrode convex portion 122 and the LED light emitting wafer, and the positive electrode mounting portion 111 or the negative electrode mounting portion 121 protrudes into the colloid. In this embodiment, the surface-mount type LED lamp includes three LED light emitting wafers 1, and each light emitting wafer 1 is connected to a pair of matched positive electrode pins 11 and negative electrode pins 12, respectively. The emission colors of the light emitting wafers are different, and the light emitted from the three LED light emitting wafers can be mixed to show different colors.

好ましくは、前記正極凸部１１２と負極凸部１２２がいずれも前記コロイド２の底からコロイド２の内部に伸びる。以上の構成のような表面実装型ＬＥＤランプは、正極実装部１１１と負極実装部１２１を曲げることなく回路基板に実装されることができ、同時に、接着剤量を減らすことができる。   Preferably, both the positive electrode convex portion 112 and the negative electrode convex portion 122 extend from the bottom of the colloid 2 to the inside of the colloid 2. The surface-mounted LED lamp having the above configuration can be mounted on a circuit board without bending the positive electrode mounting portion 111 and the negative electrode mounting portion 121, and at the same time, the amount of the adhesive can be reduced.

図２〜図６を参照すると、前記表面実装型ＬＥＤランプを製作する方法であって、下記のステップを含む。   Referring to FIGS. 2 to 6, a method of manufacturing the surface mount LED lamp includes the following steps.

ステップ１：金属ホルダーを製作することであり、金属ホルダーに複数のＬＥＤライトポイント３を製作し、各ＬＥＤライトポイント３に金属サーキットボード１０が設置され、各金属サーキットボード１０に少なくとも一組の互いにマッチングした正極ピン１１と負極ピン１２が設置される。本実施例において、金属サーキットボード１０に三組の正極ピン１１と負極ピン１２が設置され、金属ホルダーにおける金属サーキットボード１０を押し抜き、正極ピン１１を押し抜くことによって前記正極凸部１１２と正極実装部１１１を形成し、負極ピン１２を押し抜くことによって前記負極凸部１２２と負極実装部１２１を形成する。   Step 1: Producing a metal holder, producing a plurality of LED light points 3 on the metal holder, installing a metal circuit board 10 on each LED light point 3, and attaching at least one set of each metal circuit board 10 to each other. A matched positive electrode pin 11 and negative electrode pin 12 are provided. In the present embodiment, three sets of positive electrode pins 11 and negative electrode pins 12 are installed on a metal circuit board 10, and the metal circuit board 10 in a metal holder is pushed out, and the positive electrode pins 11 are pushed out, so that the positive electrode convex portion 112 and the positive electrode The mounting portion 111 is formed, and the negative electrode pin 12 is pushed out to form the negative electrode convex portion 122 and the negative electrode mounting portion 121.

ステップ２：ウェハを固定することであり、各金属サーキットボード１０にＬＥＤ発光ウェハ１が固定され、ＬＥＤ発光ウェハ１が接着剤の塗布により固定される。   Step 2: fixing the wafer, the LED light-emitting wafer 1 is fixed to each metal circuit board 10, and the LED light-emitting wafer 1 is fixed by applying an adhesive.

ステップ３：ワイヤを溶接することであり、ＬＥＤ発光ウェハ１における回路と金属サーキットボード１０における正極ピン１１及び負極ピン１２とを溶接する。   Step 3: Welding the wires, welding the circuit on the LED light emitting wafer 1 and the positive electrode pin 11 and the negative electrode pin 12 on the metal circuit board 10.

ステップ４：接着剤を注入することであり、樹脂接着剤を金型４のキャビティに注入し、前記キャビティの開口が上に向き、キャビティの開口の両側の端面が同じ高さになり、ワイヤを溶接した後の金属ホルダーを金型４に置き、各ＬＥＤライトポイント３を一つのキャビティに一対一で対応させ、前記正極凸部１１２と負極凸部１２２をキャビティに伸ばさせ、前記正極実装部１１１と負極実装部１２１がそれぞれキャビティの開口の両側の端面に掛けられる。注入された接着剤が液体樹脂であり、金属ホルダーが動くことを防止するために、前記金型４の上にプレッシャープレート５を被せ、プレッシャープレート５で金属ホルダーを金型４に固定する。   Step 4: Injecting the adhesive, injecting the resin adhesive into the cavity of the mold 4, the opening of the cavity faces upward, the end faces on both sides of the opening of the cavity are at the same height, and the wire is inserted. The metal holder after welding is placed in the mold 4, each LED light point 3 is made to correspond to one cavity one-to-one, the positive electrode convex portion 112 and the negative electrode convex portion 122 are extended into the cavity, and the positive electrode mounting portion 111 is formed. And the negative electrode mounting portion 121 are respectively hung on the end faces on both sides of the opening of the cavity. The injected adhesive is a liquid resin, and in order to prevent the metal holder from moving, a pressure plate 5 is put on the mold 4, and the metal holder is fixed to the mold 4 by the pressure plate 5.

ステップ５：焼き付けることであり、接着剤を注入した金属ホルダー、金型４とプレッシャープレート５を焼付装置に置いて焼き付け、樹脂接着剤を凝固させる。焼き付け温度は１３０℃〜１３５℃であり、焼け付け時間は４０分〜４５分である。   Step 5: To bake, the metal holder into which the adhesive has been injected, the mold 4 and the pressure plate 5 are placed in a baking device and baked to solidify the resin adhesive. The baking temperature is 130C to 135C, and the baking time is 40 minutes to 45 minutes.

ステップ６：離型することであり、焼き付けした後、プレッシャープレート５を開け、金属ホルダーを金型４から取り出す。   Step 6: To release the mold, after baking, open the pressure plate 5 and take out the metal holder from the mold 4.

ステップ７：フットカットして脱穀することであり、各金属サーキットボード１０の正極ピン１１と負極ピン１２を切り、各表面実装型ＬＥＤランプに金属ホルダーを離脱させる。   Step 7: Threshing by foot cutting, cutting the positive electrode pin 11 and the negative electrode pin 12 of each metal circuit board 10, and detaching the metal holder from each surface mount type LED lamp.

ステップ８：テストすることであり、表面実装型ＬＥＤランプの性能をテストし、不合格の製品を篩い、その中、自動分光機でテストを行う。   Step 8: Testing, testing the performance of the surface mount LED lamp, sieving the rejected product, in which the test is performed by an automatic spectrometer.

ステップ９：編組をして包装することであり、テストして合格する表面実装型ＬＥＤランプを自動編組機に入れ、プラスチックリールに巻き取る。   Step 9: Braiding and packaging, pass the tested and passed surface mount LED lamps into the automatic braiding machine and take up on plastic reels.

表面実装型ＬＥＤランプを製作する方法において、コロイド２に対して射出成型を行った後にピンを曲げることなく表面実装型ＬＥＤランプを回路基板に実装することができ、正極凸部１１２と負極凸部１２２がいずれも前記コロイド２の底からコロイド２の内部に伸び、正極実装部１１１と負極実装部１２１がコロイド２に突き出ってコロイド２の底に対して水平に設置されるので、キャビティの開口が上に向き、キャビティの開口の両側の端面が同じ高さになる金型４でコロイド２の成形を完了でき、使用される金型のコストを削減させる。   In the method of manufacturing a surface-mounted LED lamp, the surface-mounted LED lamp can be mounted on a circuit board without bending a pin after performing injection molding on the colloid 2, and the positive electrode convex portion 112 and the negative electrode convex portion Since both 122 extend from the bottom of the colloid 2 to the inside of the colloid 2 and the positive electrode mounting portion 111 and the negative electrode mounting portion 121 protrude from the colloid 2 and are set horizontally with respect to the bottom of the colloid 2, the opening of the cavity is formed. Are turned upward, and the molding of the colloid 2 can be completed by the mold 4 in which the end faces on both sides of the opening of the cavity are at the same height, thereby reducing the cost of the mold used.

上記は本考案の好ましい実施形態に過ぎず、基本的な同じ方法で本考案の目的を達成する技術手段は全て本考案の保護範囲に属する。   The above is only a preferred embodiment of the present invention, and all technical means for achieving the object of the present invention in the same basic manner belong to the protection scope of the present invention.

Claims (2)

一枚以上のＬＥＤ発光ウェハ（１）を備え、前記ＬＥＤ発光ウェハ（１）に少なくとも一組の互いにマッチングした正極ピン（１１）と負極ピン（１２）が接続される表面実装型ＬＥＤランプであって、
前記正極ピン（１１）は正極実装部（１１１）を備え、前記正極実装部（１１１）にＬＥＤ発光ウェハ（１）を接続するための正極凸部（１１２）が突起して設けられ、
前記負極ピン（１２）は負極実装部（１２１）を備え、前記負極実装部（１２１）にＬＥＤ発光ウェハ（１）を接続するための負極凸部（１２２）が突起して設けられ、前記負極実装部（１２１）と正極実装部（１１１）の高さが同じであり、前記正極凸部（１１２）、負極凸部（１２２）及びＬＥＤ発光ウェハ（１）の外にコロイド（２）が包まれ、前記正極実装部（１１１）又は負極実装部（１２１）が前記コロイド（２）に突き出ることを特徴とする表面実装型ＬＥＤランプ。 A surface-mounted LED lamp comprising one or more LED light emitting wafers (1), wherein at least one pair of matched positive electrode pins (11) and negative electrode pins (12) are connected to the LED light emitting wafer (1). hand,
The positive electrode pin (11) includes a positive electrode mounting portion (111), and a positive electrode protruding portion (112) for connecting an LED light emitting wafer (1) to the positive electrode mounting portion (111) is provided so as to protrude,
The negative electrode pin (12) includes a negative electrode mounting portion (121), and a negative electrode protrusion (122) for connecting an LED light emitting wafer (1) is provided on the negative electrode mounting portion (121) so as to protrude therefrom. The mounting portion (121) and the positive electrode mounting portion (111) have the same height, and the colloid (2) is wrapped around the positive electrode convex portion (112), the negative electrode convex portion (122) and the LED light emitting wafer (1). Rarely, the positive electrode mounting portion (111) or the negative electrode mounting portion (121) protrudes into the colloid (2). 前記正極凸部（１１２）及び負極凸部（１２２）がいずれも前記コロイド（２）の底からコロイド（２）の内部に伸びることを特徴とする請求項１に記載の表面実装型ＬＥＤランプ。
2. The surface-mounted LED lamp according to claim 1, wherein both the positive protrusion (112) and the negative protrusion (122) extend from the bottom of the colloid (2) to the inside of the colloid (2). 3.
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