CN210778676U

CN210778676U - Direct-insertion LED lamp bead with built-in patch type LED

Info

Publication number: CN210778676U
Application number: CN201921667254.3U
Authority: CN
Inventors: 唐勇
Original assignee: YLin Electronics Co ltd
Current assignee: YLin Electronics Co ltd; Yonglin Electronics Co Ltd
Priority date: 2019-10-08
Filing date: 2019-10-08
Publication date: 2020-06-16
Anticipated expiration: 2029-10-08

Abstract

The utility model discloses a built-in SMD LED's formula of cuting straightly formula LED lamp pearl, include: the surface-mounted LED lamp bead, the fixing buckle, the resin, the positive electrode pin, the negative electrode pin and the fixing part arranged on the positive electrode pin and the negative electrode pin are combined together through an ingenious structure, so that the structure of the packaged direct-insert LED lamp bead with the surface-mounted LED built in is more stable, the production and assembly processes are more convenient and faster due to the ingenious structural arrangement, and the time and the cost are saved; the problem of poor contact that the welding leads to is solved, the stability of circuit has been ensured, life, factor of safety have been improved.

Description

Direct-insertion LED lamp bead with built-in patch type LED

Technical Field

The utility model relates to a LED lamp pearl especially involves a built-in SMD LED's formula of cuting straightly LED lamp pearl.

Background

In the existing surface mount type LED lamp bead, a light-emitting wafer is usually attached to a positive electrode/a negative electrode in the actual production process, then the positive electrode/the negative electrode of the light-emitting wafer is respectively welded to the tops of a pin of the positive electrode/the negative electrode, and then the light-emitting wafer and the tops of the pin are packaged by resin. When the surface-mounted LED lamp bead manufactured by the method is used in a direct-insertion mode, the surface-mounted LED lamp bead is deformed or damaged due to unstable structure; in addition, in some surface mount LED lamp beads, the positive/negative electrodes of the light emitting chip are respectively soldered to the positive/negative electrode pins, which is inconvenient in the actual operation process, consumes long time, increases the production cost, and causes poor circuit contact due to poor soldering.

Therefore, a patch type LED lamp bead capable of solving one or more of the above technical problems is needed.

SUMMERY OF THE UTILITY MODEL

In order to solve one or more technical problems, the utility model provides a built-in SMD LED's formula of cuting straightly LED lamp pearl, including positive pole/negative pole pin, positive pole/negative pole pin is equipped with insulating fixed part, and positive pole/negative pole pin passes through insulating fixed part fixed connection, positive pole/negative pole pin respectively is provided with a first flange at least; one type of structure of the surface-mounted LED lamp bead consists of a surface mount and a light-emitting wafer; the patch is fixedly arranged on the top of the positive/negative electrode pin, and is provided with a first positive electrode and a first negative electrode which are respectively and electrically connected with the positive/negative electrode pin; the light-emitting chip is fixedly arranged at the upper end of the first anode or the first cathode of the patch, and the anode and the cathode of the light-emitting chip are respectively and electrically connected with the first anode and the first cathode of the patch; the bottom of the fixing buckle is provided with at least two second flanges, and the second flanges are matched with the first flanges in shape to form a buckle. And the resin is used for packaging and wrapping the light-emitting wafer, the patch, the fixing buckle and the top of the anode/cathode pin together.

It should be noted that the types of the surface mount LED lamp beads are various, and the surface mount LED lamp bead explained below is one of a surface mount chip and a light emitting wafer.

Under the action of the insulating fixing part, the positive electrode pin and the negative electrode pin are not electrically connected when other parts are not installed, and the insulating fixing part is formed through one-time injection molding.

Furthermore, the tops of the positive/negative electrode pins are respectively provided with a first groove, and the patches are fixedly arranged in the first grooves.

Furthermore, a second groove is formed in the top of the patch type LED lamp bead and used for filling light-transmitting resin, the second groove can be formed in the top of the patch, and the light-emitting wafer is fixedly installed in the second groove.

Furthermore, the top of the patch type LED lamp bead is provided with at least one third flange; the fixing buckle is provided with at least one third groove matched with the third flange at the top of the patch type LED lamp bead.

Furthermore, the fixing buckle is provided with at least one through hole, light of the light-emitting wafer is emitted through the through hole, and the shape of the through hole can modify the light-emitting angle and the shape of the light-emitting wafer to a certain extent.

Further, during resin packaging, the fixing parts of the anode pin and the cathode pin are packaged and wrapped, and the fixing parts are packaged together to protect the fixing parts to a certain extent.

Furthermore, a layer of silicone grease is smeared at the bottom of the light-emitting wafer and then is mounted at the upper end of the first anode or the first cathode of the patch, and the silicone grease is smeared to enable the heat of the light-emitting wafer to be led out more quickly.

Furthermore, the first positive electrode and the first negative electrode of the patch are arranged on two sides and the bottom of the patch, so that the first positive electrode/negative electrode is in contact with the pins of the positive electrode/negative electrode more fully, and poor contact is avoided.

The utility model discloses the beneficial effect who gains is: the utility model combines the patch type LED lamp bead composed of the luminous wafer and the patch, the fixing buckle, the resin, the anode/cathode pin and the setting fixing part together through an ingenious structure, so that the structure of the packaged in-line type LED lamp bead with the built-in patch type LED is more stable, and the in-line type LED lamp bead can bear larger force when being used in actual in-line insertion, thereby avoiding deformation to influence use; the ingenious structural arrangement enables the production and assembly process to be more convenient and rapid, and saves time and cost; the problem of the contact failure that the welding leads to is solved, the stability of circuit has been ensured, provides supplementary heat dissipation to a certain extent, has improved life, factor of safety, has greatly improved the practical value of this product.

Drawings

Fig. 1 is a schematic diagram of a direct-insert LED lamp bead with a built-in surface mount type LED of the present invention;

fig. 2 is an explosion diagram of a direct-insert LED lamp bead with a built-in surface mount LED of the present invention;

fig. 3 is a side view of a direct-insert LED lamp bead with a built-in surface mount type LED of the present invention;

FIG. 4 is a cross-sectional view in the direction of side view B-B of a direct-insert LED lamp bead with a built-in surface-mount LED of the present invention;

FIG. 5 is a partial enlarged view of a section I in the B-B direction of a direct-insert LED lamp bead with a built-in surface-mount LED according to the present invention;

fig. 6 is a partial exploded view of the direct-insert LED lamp bead with a built-in surface mount LED according to the present invention;

fig. 7 is a schematic view of a fixing buckle of a direct-insert LED lamp bead with a built-in patch-type LED of the present invention;

fig. 8 is a schematic diagram of a patch of a direct-insert LED lamp bead with a built-in patch LED and a light emitting chip mounted on the upper end of the patch of the present invention;

fig. 9 is the utility model relates to a built-in SMD LED's formula of cuting straightly positive pole pin and negative pole pin's of formula LED lamp pearl schematic diagram.

[ description of reference ]

101. resin

201. fixed button

211. third groove

212. second flange

213. through hole

301. patch

302. light emitting chip

311. first negative electrode

312. first positive electrode

313. third flange

314. second groove

401. positive/negative lead

411. first groove

412. first flange

413. fixed part.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, and it will be apparent to those skilled in the art that similar modifications can be made without departing from the spirit and scope of the invention.

As shown in fig. 1-9, the utility model discloses a built-in SMD LED's cut straightly formula LED lamp pearl, built-in SMD LED's cut straightly formula LED lamp pearl includes: the lead frame comprises a positive electrode/lead 401, wherein the positive electrode/lead 401 is provided with a fixing part 413, the positive electrode/lead 401 is fixedly connected through the fixing part 413, and the positive electrode lead and the negative electrode lead are respectively provided with at least one first flange 412; a patch type LED lamp bead composed of a patch 301 and a light-emitting wafer 302 is characterized in that the patch 301 is fixedly arranged on the top of a positive/negative electrode pin 401, the patch 301 is provided with a first positive electrode 312 and a first negative electrode 311, and the first positive electrode 312 and the first negative electrode 311 are respectively and electrically connected with the positive/negative electrode pin 401; the light-emitting wafer 302 is fixedly arranged at the upper end of the first anode 312 or the first cathode 311 of the patch, and the anode and the cathode of the light-emitting wafer 302 are respectively and electrically connected with the first anode 312 and the first cathode 311 of the patch; the fixing buckle 201 is provided with at least two second flanges 212 at the bottom of the fixing buckle 201, and the second flanges 212 are matched with the first flanges 412 in shape to form a buckle. And the resin 101 is used for packaging and wrapping the light emitting wafer 302, the patch 301, the fixing buckle 201 and the top of the positive/negative pin 401 together.

It should be noted that, in practical applications, there are many types of the surface mount LED lamp beads, and in the embodiment, the surface mount 301 and the light emitting crystal 302 are used to form a surface mount LED lamp bead.

The fixing portion 413 is an insulator, the fixing portion 413 is formed by injection molding at one time in the positive/negative electrode lead 401, and has a shape similar to a rectangular parallelepiped, and is generally made of an insulating material such as plastic or rubber, and the positive/negative electrode lead 401 is fixed and separated by the fixing portion 413.

There are generally two configurations of the patch 301 mounted to the positive/negative pin 401: the first is that the patch 301 is directly mounted on the positive/negative pin 401, and the first positive electrode 312 and the first negative electrode 311 of the patch 301 are respectively in electrical contact with the positive/negative pin 401; the second is that the top of the positive/negative pin 401 has a first recess 411, and the patch 301 is fixedly mounted in the first recess 411.

Specifically, when the light emitting chip 302 is mounted, a layer of silicone grease may be coated on the bottom thereof, and then mounted on the upper end of the first positive electrode 312 or the first negative electrode 311 of the patch.

Specifically, the patch 301 has a second recess 314 on the top thereof, and the light emitting chip 302 is fixedly mounted in the second recess 314.

It should be noted that the shape of the first recess 411 is adapted to the shape of the bottom of the patch 301 for easy installation and fixation, and the depth of the first recess is less than or equal to the height of the patch 301. The patch 301 is placed in the first groove, the first positive electrode 312 and the first negative electrode 311 of the patch 301 are respectively in corresponding contact with the positive electrode/negative electrode pin 401, and then are directly pressed in the first groove by the fixing buckle 201 to complete the fixing and installation, and the silicone grease arranged at the bottom of the light-emitting wafer 302 is compressed during the fixing and installation process to fill the gap at the joint, so that a better heat conduction effect is provided.

Specifically, another method for fixing a patch is: at least one third flange 313 on top of the patch 301; the retaining buckle 201 has at least one third recess 211 that mates with a third lip 313 on the top of the patch 301.

It should be noted that, this fixing method is realized by the third flange 313 and the third groove 211, and compared with direct pressing fixing, the positioning is more accurate, and is suitable for the production of products requiring accurate positioning.

Specifically, the fixing buckle 201 has at least one through hole 213, the light generated by the light emitting chip 302 is emitted through the through hole 213, the through hole 213 can change the angle and shape of the light emitted by the light emitting chip 302 to some extent, and the light emitted by the light emitting chip 302 can be changed by changing the shape of the through hole 213 and filling different types of resin.

Specifically, the resin 101 may encapsulate the fixing portions 413 of the positive/negative electrode leads 401 together during encapsulation, so that the fixing portions 413 may be protected to some extent, thereby providing a more stable structure.

Specifically, the first positive electrode 312 and the first negative electrode 311 of the patch 301 are disposed on two sides and the bottom of the patch, so that the contact area between the first positive electrode 312 and the corresponding pin and the contact area between the first negative electrode 311 and the corresponding pin are larger, the contact is more sufficient, the problem of poor contact caused by welding is solved, and a more stable circuit is provided.

It should be noted that the fixing portion 413 injection-molded on the positive/negative pin 401 and the fixing buckle 201 buckled on the top of the positive/negative pin 401 form two-point transverse fixing, which guarantees the structural stability of the in-line LED lamp bead with the built-in patch LED.

Generally, the in-line LED bead with a built-in chip LED is mounted by molding a fixing portion 413 on the positive/negative lead 401, mounting the light emitting chip 302 on the chip 301, fixing the chip 301 with the light emitting chip 302 on the top of the positive/negative lead 401, fastening and fixing the chip by a fastener, and finally packaging the chip with the resin 101.

To sum up, the utility model combines a patch type LED lamp bead composed of a light emitting chip 302 and a patch 301, a fixing buckle 201, a resin 101, an anode/cathode pin 401 and a fixing part thereof together through an ingenious structure, so that the structure of the packaged in-line LED lamp bead with the built-in patch type LED is more stable, and the in-line LED lamp bead can bear larger force during actual in-line use, thereby avoiding deformation and influencing use; the ingenious structural arrangement enables the production and assembly process to be more convenient and rapid, and saves time and cost; the problem of the contact failure that the welding leads to is solved, the stability of circuit has been ensured, provides supplementary heat dissipation to a certain extent, has improved life, factor of safety, has greatly improved the practical value of this product.

The above-described embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the utility model. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A direct-insert LED lamp bead with a built-in patch type LED is characterized in that,

the positive/negative electrode pin is provided with an insulating fixing part and fixedly connected through the insulating fixing part, and the positive/negative electrode pin is provided with at least one first flange;

the surface-mounted LED lamp bead is arranged on the top of the positive electrode pin/the negative electrode pin, and the positive electrode and the negative electrode of the surface-mounted LED lamp bead are respectively and electrically connected with the positive electrode pin/the negative electrode pin;

the fixing buckle is matched with the upper end surface of the patch type LED lamp bead, at least two second flanges are arranged at the bottom of the fixing buckle, and the second flanges are matched with the first flanges in shape to form a buckle;

and the resin is used for packaging and wrapping the patch type LED lamp bead, the fixing buckle and the tops of the anode/cathode pins together.

2. The in-line LED lamp bead with a built-in patch type LED according to claim 1, wherein a first groove is formed on each of the tops of the positive/negative electrode pins, and the patch type LED lamp bead is fixedly mounted in the first grooves.

3. The in-line LED lamp bead with a built-in patch type LED according to claim 1, wherein a second groove is formed at the top of the patch type LED lamp bead.

4. The in-line LED lamp bead with the built-in patch type LED according to claim 1, wherein at least one third flange is arranged on the top of the patch type LED lamp bead;

the fixing buckle is provided with at least one third groove matched with the third flange at the top of the patch type LED lamp bead.

5. The in-line LED lamp bead of the built-in patch type LED according to claim 1, wherein the fixing buckle has at least one through hole.

6. The in-line LED lamp bead of the built-in patch LED according to claim 1, wherein the insulating fixing portion of the positive/negative electrode leads is encapsulated and wrapped during the resin encapsulation.