CN219106188U - Low-current high-voltage high-brightness semiconductor - Google Patents
Low-current high-voltage high-brightness semiconductor Download PDFInfo
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- CN219106188U CN219106188U CN202320014276.XU CN202320014276U CN219106188U CN 219106188 U CN219106188 U CN 219106188U CN 202320014276 U CN202320014276 U CN 202320014276U CN 219106188 U CN219106188 U CN 219106188U
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- injection molding
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- bearing part
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Abstract
The embodiment of the application discloses a high bright semiconductor of low current high voltage, includes: a conductive bearing part; the injection molding fixing part is wrapped on the conductive bearing part; the connecting part is arranged on the conductive bearing part, and the injection fixing part is filled to the connecting part. When the injection molding fixing part wraps the conductive bearing part, injection molding substances of the injection molding fixing part are filled into the connecting part when wrapping the conductive bearing part, and as the injection molding fixing part is filled into the connecting part, the contact surface between the injection molding fixing part and the conductive bearing part is increased, the surface of the conductive bearing part is flat, the conductive bearing part of the connecting part is additionally arranged, the contact area between the injection molding fixing part and the conductive bearing part is increased, the friction force and the resistance between the injection molding fixing part and the conductive bearing part are increased, and the connection firmness between the injection molding fixing part and the conductive bearing part is greatly improved, so that the injection molding fixing part is stably injection molded and installed on the conductive bearing part.
Description
Technical Field
The embodiment of the application relates to the technical field of electronics, in particular to a low-current high-voltage high-brightness semiconductor.
Background
The LED bracket is a base seat of the LED lamp bead before packaging, on the basis of the LED bracket, the chip is fixed and welded with the positive electrode and the negative electrode, and then the LED lamp bead is packaged and formed once by packaging glue. A plurality of conductive brackets are processed on the material belt copper plate to serve as conductive terminals (the conductive terminals still belong to a part of the material belt copper plate at the moment), then the conductive terminals are placed into an injection molding machine to be molded into plastic main bodies, after the plastic main bodies are embedded and molded with the conductive terminals, the soldering tin feet of the conductive terminals are required to be bent, and the conductive terminals are punched from the material belt copper plate in the bending step. The plastic main body is easily separated from the material belt copper plate due to later punching, so that the product is scrapped, and the product yield is affected.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art or related art.
To this end, a first aspect of the present utility model provides a low current high voltage high brightness semiconductor.
In view of this, there is provided according to a first aspect of an embodiment of the present application a low-current high-voltage high-luminance semiconductor including:
a conductive bearing part;
the injection molding fixing part is wrapped on the conductive bearing part;
the connecting part is arranged on the conductive bearing part, and the injection fixing part is filled to the connecting part.
In a possible embodiment, the connection portion includes:
the first connecting unit is arranged on the surface of the conductive bearing part, and the injection fixing part is filled into the first connecting unit.
In a possible embodiment, the connection portion includes:
the second connecting unit is arranged at the edge of the conductive bearing part, and the injection fixing part is filled into the second connecting unit.
In a possible embodiment, the first connection unit and the second connection unit are disposed on different surfaces of the conductive carrier.
In one possible implementation manner, at least two first connection units are disposed on two sides of the same surface of the conductive bearing portion.
In a possible embodiment, the first connection unit includes grooves disposed parallel to each other, disposed on the surface of the conductive bearing portion, and the injection fixing portion is filled into the grooves.
In a possible implementation manner, the conductive bearing part comprises a first bearing plate and a second bearing plate which are adjacently arranged, the first bearing plate and the second bearing plate are connected together through the injection molding fixing part, and the electrodes of the first bearing plate and the second bearing plate are different.
In a possible embodiment, the second connection unit is a break provided at the surface edge of the conductive carrier, and the injection-molded fixing part is filled into the break.
In a possible implementation manner, the conductive bearing part is used for bearing chips, and the number of the chips is at least three.
Compared with the prior art, the utility model at least comprises the following beneficial effects: the low-current high-voltage high-brightness semiconductor provided by the embodiment of the application comprises a conductive bearing part, an injection molding fixing part and a connecting part, wherein the conductive bearing part is used for arranging a chip, and the injection molding fixing part is used for carrying out injection molding wrapping; the connecting part is arranged on the conductive bearing part, when the injection molding fixing part wraps the conductive bearing part, injection molding substances of the injection molding fixing part are filled into the connecting part when wrapping the conductive bearing part, the contact surface between the injection molding fixing part and the conductive bearing part is increased, the flat surface of the conductive bearing part is opposite to that of the conductive bearing part, the conductive bearing part of the connecting part is additionally arranged, the contact area between the injection molding fixing part and the conductive bearing part is increased, the friction force and the resistance between the injection molding fixing part and the conductive bearing part are increased, the connection firmness between the injection molding fixing part and the conductive bearing part is greatly improved, the injection molding fixing part is stably installed on the conductive bearing part in a filling way, the separation of the injection molding fixing part and the conductive bearing part due to the punching in the later period is avoided, and the product quality is improved.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures.
In the drawings:
FIG. 1 is a schematic view of an angle of a conductive carrier according to an embodiment of the present application;
FIG. 2 is another angular schematic block diagram of a conductive carrier according to one embodiment provided herein;
FIG. 3 is a schematic view of an angular schematic structure of a low current high voltage high light semiconductor according to one embodiment provided herein;
FIG. 4 is another angular schematic block diagram of a low current high voltage high light semiconductor according to one embodiment provided herein;
FIG. 5 is a schematic block diagram of a low current high voltage high light semiconductor carrier chip according to one embodiment provided herein;
the correspondence between the reference numerals and the component names in fig. 1 to 5 is:
100-conductive bearing parts, 200-injection fixing parts and 300-connecting parts;
110-a first bearing plate and 120-a second bearing plate;
310-first connection unit, 320-second connection unit.
Detailed Description
In order to better understand the technical solutions described above, the technical solutions of the embodiments of the present application are described in detail below through the accompanying drawings and the specific embodiments, and it should be understood that the embodiments of the present application and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of the present application, and not limit the technical solutions of the present application, and the embodiments of the present application and the technical features in the embodiments of the present application may be combined with each other without conflict.
As shown in fig. 1 to 5, according to a first aspect of an embodiment of the present application, there is provided a low-current high-voltage high-luminance semiconductor, including: a conductive carrier 100; an injection fixing portion 200, which is wrapped around the conductive bearing portion 100; the connection part 300 is disposed on the conductive bearing part 100, and the injection fixing part 200 is filled into the connection part 300.
The low-current high-voltage high-brightness semiconductor provided by the embodiment of the application comprises a conductive bearing part 100, an injection molding fixing part 200 and a connecting part 300, wherein the injection molding fixing part 200 is used for injection molding and wrapping the conductive bearing part 100, the conductive bearing part 100 is used for arranging a chip, the injection molding fixing part 200 is used for injection molding and wrapping, and the injection molding fixing part 200 can be used for injection molding but is not limited to plastics; wherein, connecting portion 300 sets up in electrically conductive carrier portion 100, when the fixed part 200 of moulding plastics parcel electrically conductive carrier portion 100, the material of moulding plastics of fixed part 200 of moulding plastics can fill in connecting portion 300 when parcel electrically conductive carrier portion 100, and after the fixed part 200 of moulding plastics was moulded plastics and is accomplished, because the same material of moulding plastics that has the fixed part 200 of moulding plastics to fill in the connecting portion 300 also, the fixed part 200 of moulding plastics after the completion has increased the firmness with electrically conductive carrier portion 100, improves the stability of being connected between fixed part 200 of moulding plastics and the electrically conductive carrier portion 100.
In the conventional technology, the conductive bearing part 100 is generally wrapped only by the injection molding fixing part 200, and the injection molding fixing part 200 and the conductive bearing part 100 after injection molding are connected together only by the surfaces in contact with each other, so that the mutual connection mode is unstable, the separation between the injection molding fixing part 200 and the conductive bearing part 100 is easy to be caused, and the requirement of connection stability between the injection molding fixing part 200 and the conductive bearing part 100 is difficult to be met; compared with the connection mode between the injection molding fixing part 200 and the conductive bearing part 100 in the traditional technology, the connection part 300 is arranged on the conductive bearing part 100, when the injection molding fixing part 200 wraps the conductive bearing part 100, injection molding substances of the injection molding fixing part 200 are filled into the connection part 300 while wrapping the conductive bearing part 100, the injection molding fixing part 200 is filled into the connection part 300, the contact surface between the injection molding fixing part 200 and the conductive bearing part 100 is increased, the flat surface of the conductive bearing part 100 is increased, the contact area between the injection molding fixing part 200 and the conductive bearing part 100 is increased by adding the conductive bearing part 100 of the connection part 300, the friction force and the resistance between the injection molding fixing part 200 and the conductive bearing part 100 are increased, and the connection firmness between the injection molding fixing part 200 and the conductive bearing part 100 is greatly improved, so that the injection molding fixing part 200 is stably injected and installed on the conductive bearing part 100.
As shown in fig. 1 and 2, in some examples, the connection portion 300 includes: the first connection unit 310 is disposed on the surface of the conductive carrier 100, and the injection fixing portion 200 is filled into the first connection unit 310.
In this technical solution, the connection portion 300 includes a first connection unit 310 disposed on a surface of the conductive carrier portion 100, where when the injection molding fixing portion 200 wraps the conductive carrier portion 100, a material injected by the injection molding fixing portion 200 fills the first unit 310 disposed in the conductive carrier portion 100, the first connection unit 310 is disposed on the surface of the conductive carrier portion 100, may be concavely disposed on the surface of the conductive carrier portion 100, and may also be convexly disposed on the surface of the conductive carrier portion 100, when the injection molding material injected by the injection molding fixing portion 200 fills the first connection unit 310, the formed connection between the injection molding fixing portion 200 and the conductive carrier portion 100 is a curved surface, and when an external force is applied to the injection molding fixing portion 200, the injection molding fixing portion 200 disposed on the connection portion 300 may provide a resistance to the injection molding fixing portion, so as to increase a connection firmness between the injection molding fixing portion 200 and the conductive carrier portion 100, and to make a connection between the injection molding fixing portion 200 and the conductive carrier portion 100 more stable.
As shown in fig. 2, in some examples, the connection 300 includes: the second connection unit 320 is disposed at the edge of the conductive carrier 100, and the injection fixing portion 200 is filled into the second connection unit 320.
In this technical solution, the connection portion 300 includes a second connection unit 320 disposed at an edge of the conductive carrier portion 100, where when the injection molding fixing portion 200 wraps the conductive carrier portion 100, a material injected by the injection molding fixing portion 200 fills the second connection unit 320 disposed at the edge of the conductive carrier portion 100, the second connection unit 320 is disposed at the edge of the conductive carrier portion 100, may be concavely disposed at the surface edge of the conductive carrier portion 100, and may also be convexly disposed at the surface edge of the conductive carrier portion 100, when the injection molding material injected by the injection molding fixing portion 200 fills the second connection unit 320, the formed connection between the injection molding fixing portion 200 and the conductive carrier portion 100 is a curved surface, and when an external force is applied to the injection molding fixing portion 200, the injection molding fixing portion 200 disposed at the second connection unit 320 may provide a resistance to the injection molding fixing portion 200, so as to increase the connection firmness between the injection molding fixing portion 200 and the conductive carrier portion 100, and to make the connection between the injection molding fixing portion 200 and the conductive carrier portion 100 more stable.
As shown in fig. 1 and 2, in some examples, the first connection unit 310 and the second connection unit 320 are disposed on different surfaces of the conductive carrier 100.
In this technical solution, the first connection unit 310 and the second connection unit 320 are respectively disposed on surfaces of the conductive bearing portion 100, where the surfaces of the conductive bearing portion 100 deviate from each other, and the first connection unit 310 and the second connection unit 320, which are located on the surfaces of the conductive bearing portion 100 deviate from each other, and the conductive bearing portion 100 form curved surfaces, so that when the injection molding fixing portion 200 located on the surfaces of the conductive bearing portion 100 deviate from each other receives an external force, under the action of the curved surfaces, resistance can be provided for the injection molding fixing portions 200 located on different surfaces of the conductive bearing portion 100, and the connection firmness between the injection molding fixing portion 200 and the conductive bearing portion 100 is greatly increased, so that the connection between the injection molding fixing portion 200 and the conductive bearing portion 100 is more stable.
As shown in fig. 1 and 2, in some examples, at least two first connection units 310 are disposed on two sides of the same surface of the conductive carrier 100.
In this technical scheme, first connecting unit 310 sets up in the both sides of electrically conductive carrier 100 coplanar, injection molding fixed part 200 is when the surface of parcel injection molding electrically conductive carrier 100, the packing is moulded plastics and is filled in first connecting unit 310, first connecting unit 310 is in the same place with injection molding fixed part 200 after the completion of moulding plastics and provides resistance for it, when first connecting unit 310 is in the both sides of electrically conductive carrier 100 coplanar, can provide resistance to the injection molding fixed part 200 symmetry that is in this surface, set up first connecting unit 310 for one side, both sides of electrically conductive carrier 100 coplanar all are equipped with first connecting unit 310, greatly increase the firmness of being connected between injection molding fixed part 200 and electrically conductive carrier 100, make the connection between injection molding fixed part 200 and electrically conductive carrier 100 more stable.
As shown in fig. 1 and 2, in some examples, the first connection unit 310 includes grooves disposed parallel to each other, which are disposed on the surface of the conductive carrier part 100, and the injection fixing part 200 is filled into the grooves.
In this technical scheme, first connecting unit 310 includes mutual parallel arrangement in the recess on conductive carrier 100 surface, first connecting unit 310 is for setting up in conductive carrier 100 surface recess, for protruding first connecting unit 310 that sets up in conductive carrier 100 surface, the recess sets up can effectively avoid piling up the time production hindrance in conductive carrier 100 surface first connecting unit 310, when the parcel is moulded plastics conductive carrier 100, the material of moulding plastics fixed 200 can fill fast to in the recess, improve the injection molding efficiency of moulding plastics fixed part 200, greatly improve work efficiency.
As shown in fig. 1 to 5, in some examples, the conductive carrier 100 includes a first carrier plate 110 and a second carrier plate 120 disposed adjacently, the first carrier plate 110 and the second carrier plate 120 are connected together by the injection fixing portion 200, and the first carrier plate 110 and the second carrier plate 120 are different in electrode.
In this solution, the conductive carrier 100 includes a first carrier 110 and a second carrier 120, where the first carrier 110 and the second carrier 120 are disposed adjacently, and electrodes of the first carrier 110 and the second carrier 120 are different, a chip is disposed on the first carrier 110 and the second carrier 120, the first connection 120 and the second connection board 110 of different electrodes supply power to the chip, and the first carrier 110 and the second carrier 120 are connected together through the injection fixing portion 200.
As shown in fig. 2, in some examples, the second connection unit 320 is a break provided at the surface edge of the conductive carrier part 100, and the injection fixing part 200 is filled into the break.
In this technical solution, the second connection unit 320 is a break difference disposed at the surface edge of the conductive bearing portion 100, and, with respect to the second connection unit 320 that is disposed at the surface edge of the conductive bearing portion 100 in a protruding manner, the second connection unit 320 that is disposed at the surface edge of the conductive bearing portion 100 in a recessed manner can effectively avoid blocking during stacking, and when the injection molding fixing portion 200 wraps the injection molding conductive bearing portion 100, the injection molded material of the injection molding fixing portion 200 can be rapidly filled into the break difference, thereby improving the injection molding efficiency of the injection molding fixing portion 200, and greatly improving the working efficiency; meanwhile, the injection molding fixing part 200 in the break-off can be tightly and firmly connected with the conductive bearing part 100, and when the conductive bearing part 100 is die-cut in the later stage, the separation of the injection molding fixing part 200 and the conductive bearing part 100 can be effectively prevented, and the product quality is improved.
As shown in fig. 5, in some examples, the conductive carrier is used to carry chips, and the number of chips is at least three.
In this technical solution, the size of the conductive carrier 100 is selected from, but not limited to, 250×1.76, and the sizes of the first carrier 110 and the second carrier 120 are different, and the conductive carrier is used for carrying chips, where a relatively smaller carrier is provided with one chip, and a relatively larger carrier is provided with two chips, and a small current and a high voltage are used for energizing, so that the light efficiency is effectively improved, and the low current can reduce the heat generation of the product.
From the above description of the embodiments, it will be apparent to those skilled in the art that the present application may be implemented by means of software plus necessary general hardware platforms, or may be implemented by hardware.
In the present utility model, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more, unless expressly defined otherwise. The terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; "coupled" may be directly coupled or indirectly coupled through intermediaries. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "rear", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or units referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model.
In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (9)
1. A low current, high voltage, high brightness semiconductor comprising:
a conductive bearing part;
the injection molding fixing part is wrapped on the conductive bearing part;
the connecting part is arranged on the conductive bearing part, and the injection fixing part is filled to the connecting part.
2. The low-current high-voltage high-luminance semiconductor according to claim 1, wherein said connection portion includes:
the first connecting unit is arranged on the surface of the conductive bearing part, and the injection fixing part is filled into the first connecting unit.
3. The low-current high-voltage high-luminance semiconductor according to claim 2, wherein said connection portion further comprises:
the second connecting unit is arranged at the edge of the conductive bearing part, and the injection fixing part is filled into the second connecting unit.
4. The low-current high-voltage high-luminance semiconductor according to claim 3, wherein the first connection unit and the second connection unit are provided on different surfaces of the conductive carrier.
5. The semiconductor of claim 2, wherein the first connection units are at least two and are disposed on two sides of the same surface of the conductive carrier.
6. The low-current high-voltage high-luminance semiconductor according to claim 2, wherein the first connection unit includes grooves arranged in parallel with each other, provided on the surface of the conductive carrier portion, and the injection-molded fixing portion is filled into the grooves.
7. The low-current high-voltage high-brightness semiconductor according to claim 1, wherein the conductive bearing part comprises a first bearing plate and a second bearing plate which are adjacently arranged, the first bearing plate and the second bearing plate are connected together through the injection molding fixing part, and the electrodes of the first bearing plate and the second bearing plate are different.
8. The low-current high-voltage high-luminance semiconductor according to claim 3, wherein the second connection unit is a break provided at a surface edge of the conductive carrier portion, and the injection-molded fixing portion is filled into the break.
9. The low-current high-voltage high-brightness semiconductor according to claim 1, wherein the conductive bearing part is used for bearing chips, and the number of the chips is at least three.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320014276.XU CN219106188U (en) | 2023-01-04 | 2023-01-04 | Low-current high-voltage high-brightness semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320014276.XU CN219106188U (en) | 2023-01-04 | 2023-01-04 | Low-current high-voltage high-brightness semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219106188U true CN219106188U (en) | 2023-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320014276.XU Active CN219106188U (en) | 2023-01-04 | 2023-01-04 | Low-current high-voltage high-brightness semiconductor |
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| CN (1) | CN219106188U (en) |
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- 2023-01-04 CN CN202320014276.XU patent/CN219106188U/en active Active
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