CN206401359U - A kind of bonded LED lamp - Google Patents
A kind of bonded LED lamp Download PDFInfo
- Publication number
- CN206401359U CN206401359U CN201720067996.7U CN201720067996U CN206401359U CN 206401359 U CN206401359 U CN 206401359U CN 201720067996 U CN201720067996 U CN 201720067996U CN 206401359 U CN206401359 U CN 206401359U
- Authority
- CN
- China
- Prior art keywords
- positive pole
- attachment portion
- pin
- negative
- colloid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses the positive pole attachment portion and negative pole attachment portion outside colloid of protruding from are respectively arranged with the positive pole pin and negative pin of a kind of bonded LED lamp, can be by LED attachment on circuit boards without bending pin, simple in construction, production efficiency is high, and production cost is low.
Description
Technical field
The utility model is related to a kind of bonded LED lamp.
Background technology
Some LED lamp beads are directly to be molded by injecting glue earlier, and it is shaped as cylindric, and encapsulating amount is larger, generates into
This is higher；In later improved technique, using first passing through after injecting glue, dispensing is carried out, is adopted in such a way, due to dispensing work
Skill can not be controlled to product design, so its product design being made that is single, it is plane that can only make light-emitting area
Product, and its complex process, manufacturing cost are also higher；In addition, the colloid of general bonded LED lamp is by matched moulds up and down
Mode carries out injecting glue, and the required precision of mould is higher, and the pin of the bonded LED lamp after demoulding needs to carry out clubfoot processing
After could mount on circuit boards, making step is various, influence production efficiency.
Utility model content
In order to solve the above problems, the purpose of this utility model is that a kind of simple in construction, encapsulating amount of offer is small, produces effect
The high bonded LED lamp of rate.
The utility model is to solve the technical scheme that uses of its technical problem：
At least it is connected with a kind of bonded LED lamp, including a piece of LED luminescent wafers above, the LED luminescent wafers
One group of positive pole pin and negative pin for being mutually matched, the positive pole pin include a positive pole attachment portion, the positive pole attachment portion
Projection is provided with a positive pole convex portion for being used to connect LED luminescent wafers；The negative pin includes a negative pole attachment portion, described negative
Pole attachment portion projection is provided with a negative pole convex portion for being used to connect LED luminescent wafers, the negative pole attachment portion and positive pole attachment portion
Highly maintain an equal level；The outer wrap of the positive pole convex portion, negative pole convex portion and LED luminescent wafers has colloid, the positive pole attachment portion
Or negative pole attachment portion protrudes from the colloid.
The positive pole convex portion and negative pole convex portion extend to the inside of colloid from the bottom of the colloid.
The beneficial effect of utility model is：The positive pole pin and negative pin of a kind of bonded LED lamp of the present utility model
On be respectively arranged with the positive pole attachment portion and negative pole attachment portion protruded from outside colloid, LED can be pasted without bending pin
Dress is on circuit boards, simple in construction, and production efficiency is high, and production cost is low.
Brief description of the drawings
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is the structural representation of bonded LED lamp of the present utility model；
Fig. 2 is the process sequence diagram for the method for manufacturing bonded LED lamp；
Fig. 3 is the front view of metallic support of the present utility model；
Fig. 4 is the sectional view of the embodiment 1 of a die cavity of the present utility model；
Fig. 5 is the sectional view of the embodiment 2 of a die cavity of the present utility model；
Fig. 6 is the structural representation of the metallic support after the demoulding.
Embodiment
On reference picture 1, a kind of bonded LED lamp, including a piece of LED luminescent wafers 1 above, the LED luminescent wafers 1
The one group of positive pole being mutually matched pin 11 and negative pin 12 are at least connected with, the positive pole pin 11 includes a positive pole attachment portion
111, the projection of positive pole attachment portion 111 is provided with a positive pole convex portion 112 for being used to connect LED luminescent wafers 1；The negative pole draws
Pin 12 includes a negative pole attachment portion 121, and the projection of negative pole attachment portion 121, which is provided with one, to be used to connect the negative of LED luminescent wafers 1
Pole convex portion 122, the negative pole attachment portion 121 highly maintains an equal level with positive pole attachment portion 111；The positive pole convex portion 112, negative pole convex portion
The outer wrap of 122 and LED luminescent wafers 1 has colloid 2, and the positive pole attachment portion 111 or negative pole attachment portion 121 protrude from institute
State colloid 2.In the present embodiment, the bonded LED lamp includes three LED luminescent wafers 1, and every luminescent wafer 1 is connected respectively
There are the one group of positive pole being mutually matched pin 11 and negative pin 12, the glow color of above-mentioned three LED luminescent wafers is different, by three
The light that piece LED luminescent wafers are sent can go out different colors with mixed display.
Preferably, the bottom of the positive pole convex portion 112 and negative pole convex portion 122 from the colloid 2 is extended in colloid 2
Portion.Positive pole attachment portion 111 and the bending of negative pole attachment portion 121 need not be to be mounted on by the bonded LED lamp of above structure
On circuit board, simultaneously, it is possible to reduce encapsulating amount, because positive pole convex portion 112 and negative pole convex portion 122 are from the bottom of the colloid 2
The inside of colloid 2 is extended to, positive pole attachment portion 111 and negative pole attachment portion 121 protrude from the bottom water of colloid 2 and relative colloid 2
It is flat to set, the cost of the mould used can be reduced only by the mold injection molding of an opening upwards.
Reference picture 2 is to Fig. 6, and a kind of method for making described bonded LED lamp comprises the following steps：
Step one：Metallic support is made, produces and is set on multiple LED positions 3, each LED position 3 on metallic support
Have on metallic circuit piece 10, each metallic circuit piece 10 at least provided with the one group of positive pole being mutually matched pin 11 and negative pin
12, in the present embodiment, three groups of positive pole pins 11 and negative pin 12 are provided with metallic circuit piece 10, on metallic support
Metallic circuit piece 10 carries out punching press, and positive pole pin 11 is born by being stamped and formed out the positive pole convex portion 112 and positive pole attachment portion 111
Pole pin 12 is by being stamped and formed out the negative pole attachment portion 121 of negative pole convex portion 122；
Step 2：Die bond, is all fixed with a LED luminescent wafers 1 on each metallic circuit piece 10, and LED luminescent wafers 1 lead to
Dispensing is crossed to fix；
Step 3：Bonding wire, by the positive pole pin 11 and negative pole on the circuit on LED luminescent wafers 1 and metallic circuit piece 10
Pin 12 is welded；
Step 4：In injecting glue, the die cavity that resin glue is injected into mould 4, the mold cavity openings are upward, the opening of die cavity
Both sides end face it is concordant, then the metallic support after bonding wire is placed on mould 4, and cause each LED position 3 correspond in
In one die cavity, the positive pole convex portion 112 and negative pole convex portion 122 are stretched in die cavity, the positive pole attachment portion 111 and negative pole patch
It is affiliated to respectively on the both sides end face of the opening of die cavity in dress portion 121；The glue of injection is liquid resin, it is preferable that the mould 4
Top be also stamped pressing plate 5, metallic support can be fixed on mould 4 by pressing plate 5, prevent metallic support from beating；
Step 5：Baking, the metallic support after injecting glue, mould 4 and pressing plate 5 are put into baking in roasting plant makes resin
The glue solidifies；The temperature of baking is 130 DEG C to 135 DEG C, and the time of baking is 40 to 45 minutes；
Step 6：The demoulding, after the completion of baking, opens pressing plate 5, metallic support is taken out from mould 4；
Step 7：Cutting, threshing, thrust the positive pole pin 11 and negative pin 12 of each metallic circuit piece 10 so that every
Individual bonded LED lamp departs from metallic support；
Step 8：Test, carries out performance test to Surface-mount LED lamp, screens out defective work；Wherein, using automatic light splitting machine
Tested.
Step 9：Tape package, automatic taping-machine is put into by the Surface-mount LED lamp of test passes, is wound on lacquer disk(-sc).
, can will be SMD without the bending pin after the injection of colloid 2 is completed in the method for making bonded LED lamp
LED is mounted on circuit boards, and the bottom due to positive pole convex portion 112 and negative pole convex portion 122 from the colloid 2 extends to colloid
2 inside, positive pole attachment portion 111 and negative pole attachment portion 121 protrude from colloid 2 and the lower horizontal of relative colloid 2 is set, therefore
Can be by a mold cavity openings upwards, the mould 4 that the both sides end face of the opening of die cavity is concordant can complete the shaping of colloid 2,
Reduce the cost of the mould used.
Preferred embodiments of the present utility model are the foregoing is only, as long as realizing the utility model with essentially identical means
The technical scheme of purpose is belonged within protection domain of the present utility model.
Claims (2)
1. a kind of bonded LED lamp, including：LED luminescent wafers more than a piece of（1）, the LED luminescent wafers（1）On at least
It is connected with the one group of positive pole being mutually matched pin（11）And negative pin（12）, it is characterised in that：
The positive pole pin（11）Including a positive pole attachment portion（111）, the positive pole attachment portion（111）Projection, which is provided with one, to be used for
Connect LED luminescent wafers（1）Positive pole convex portion（112）；
The negative pin（12）Including a negative pole attachment portion（121）, the negative pole attachment portion（121）Projection, which is provided with one, to be used for
Connect LED luminescent wafers（1）Negative pole convex portion（122）, the negative pole attachment portion（121）With positive pole attachment portion（111）Highly hold
It is flat；
The positive pole convex portion（112）, negative pole convex portion（122）With LED luminescent wafers（1）Outer wrap have colloid（2）, it is described
Positive pole attachment portion（111）Or negative pole attachment portion（121）Protrude from the colloid（2）.
2. a kind of bonded LED lamp as claimed in claim 1, it is characterised in that：The positive pole convex portion（112）With negative pole convex portion
（122）From the colloid（2）Bottom extend to colloid（2）Inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720067996.7U CN206401359U (en) | 2017-01-18 | 2017-01-18 | A kind of bonded LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720067996.7U CN206401359U (en) | 2017-01-18 | 2017-01-18 | A kind of bonded LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206401359U true CN206401359U (en) | 2017-08-11 |
Family
ID=59519811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720067996.7U Expired - Fee Related CN206401359U (en) | 2017-01-18 | 2017-01-18 | A kind of bonded LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206401359U (en) |
-
2017
- 2017-01-18 CN CN201720067996.7U patent/CN206401359U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170811 Termination date: 20200118 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |