CN208507668U - A kind of display screen surface labeling LED mould group - Google Patents
A kind of display screen surface labeling LED mould group Download PDFInfo
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- CN208507668U CN208507668U CN201820951490.7U CN201820951490U CN208507668U CN 208507668 U CN208507668 U CN 208507668U CN 201820951490 U CN201820951490 U CN 201820951490U CN 208507668 U CN208507668 U CN 208507668U
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- led
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- primary colours
- chip unit
- mould group
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Abstract
The utility model relates to a kind of display screen surface labeling LED mould group, including PCB substrate and LED three primary colours chip unit, single-row 2-128 LED three primary colours chip unit is arranged in the PCB substrate；A unit slot segmentation is provided between LED three primary colours chip unit described in every two；The LED three primary colours chip unit is three-primary color LED chip；PCB substrate positive function area is connect with the LED three primary colours chip unit；The PCB substrate back side is provided with external introducing tie point pad, and the pad is connect with functional areas by via hole.The external tie point pad that introduces is divided into column pad and row pad, one, each LED function area row pad；The both ends of PCB substrate respectively set 1-3 column pad, pass through the back side PCB connection between column pad.Mould group attachment convenience, rapid heat dissipation, mechanical resistant impact, antistatic effect are good.
Description
Technical field
A kind of display screen of the utility model surface labeling LED mould group, belongs to LED display LED module technology
Field.
Background technique
As light emitting diode is in the large-scale application of field of display screen, especially come China in recent years in LED display
Design, production, manufacture, application aspect have been taken its place in the front ranks of the world, especially in terms of small spacing LED is shown.Traditional small
The LED of scaled down version is mainly used away from display screen LED, size has gradually been reduced to 1.0mm*1.0mm even hereinafter, with LED
Diminution, there have been some problems, cause small space distance LED display screen manufacture, also appearance in terms of popularization and application
Some defects are urgently to be resolved.
Small space distance LED display screen major defect is that the heat of itself can not be exported effectively after LED reduces；In addition its
It is due to volume reduction, higher to SMT equipment precision requirement during SMT, it cannot keep during large-scale SMT each
The contraposition precision and flatness of LED；Besides the LED of small size is easy to appear in carrying, moving process and collides with, and causes
LED damage；Simultaneously there are also the diminution that biggish defect is exactly with LED component, the antistatic effect of itself declines to a great extent,
LED is caused to be easy to be damaged by extraneous static.The application aspect of small space distance LED display screen simultaneously, cost are also to restrict it quickly to send out
One fatal short slab of exhibition, therefore present product and technology needs to solve there is also defect.
Utility model content
The utility model overcomes the shortcomings of the prior art, provides a kind of display screen surface mount light-emitting diodes
Pipe die group, the mould group mount convenience, rapid heat dissipation, mechanical resistant impact, antistatic effect promotion.
A kind of display screen of the utility model surface labeling LED mould group, including PCB substrate and it is set to PCB
LED three primary colours chip unit on substrate, the PCB substrate are sheet, arrange single-row LED three primary colours core in the PCB substrate
Blade unit, LED three primary colours chip unit quantity are 2-128；
The LED three primary colours chip unit outer encapsulating has specially made structure packing colloid；Every two in the encapsulation colloid structure
A unit slot segmentation is provided between a LED three primary colours chip unit；
The PCB substrate front is laid with functional areas and lead；The functional areas by conducting resinl, key and line with it is described
The each functional areas of LED three primary colours chip unit connection connect a LED three primary colours chip unit；The PCB substrate
The back side is provided with external introducing tie point pad, and the pad is connect with functional areas by via hole.
The external tie point pad that introduces is divided into column pad and row pad, and each functional areas are arranged a row and weld
Disk；The both ends of the PCB substrate are respectively arranged 1-3 column pad, 1 row pad, pass through the back side PCB route between the column pad
Connection.
The substrate of the PCB substrate is dark insulating materials.
The outer surface of the packing colloid is frosted shape micro-structure.
The packing colloid is light transmitting epoxy resin body.
The segmentation groove depth is 0.1-0.3mm.
The LED three primary colours chip unit is three-primary color LED chip；
The three-primary color LED chip can be formal dress or flip LED.
The three-primary color LED chip connection type is common cathode or common-anode.
The utility model has the beneficial effect that compared with prior art
Display module provided by the utility model can effectively solve the small bring attachment of size, heat derives, mechanical resistant
The problems such as impact, antistatic effect are promoted.For the utility model due to using single-row modular form, backside pads are few, can simultaneously
The wiring difficulty of small space distance LED display screen PCB itself is greatly decreased, two-layer structure, structure is simple, in the prior art individually
LED chip has 4-6 peripheral hardware pin, and the utility model is combined and integrates to external pin, effectively optimizes the number of pin
Amount, advantageously reduces cost.
Compared with common topological LED framework, the LED chip of the utility model is directly installed on pcb board, and good heat dissipation is multiple
LED chip is applied in combination, and antistatic effect is better than single led chip.
Detailed description of the invention
Fig. 1, the utility model structure diagram；
Fig. 2, the display screen made surface LED packed LED chip common cathode connection PCB front elevation
Fig. 3, the display screen made surface LED packed LED chip common-anode connection PCB front elevation
The PCB back view of Fig. 4, the display screen made surface LED mould group
The semi-finished product figure that Fig. 5, the packed LED chip common cathode for completing die bond bonding wire connect
The semi-finished product figure that Fig. 6, the packed LED chip common-anode for completing die bond bonding wire connect
Fig. 7, the display screen surface LED mould group semi-finished product figure made of flip LED chips
Fig. 8, the display screen surface LED mould group semi-finished product front elevation after encapsulating is completed
Fig. 9, the display screen surface LED mould group semi-finished product perspective view after encapsulating is completed
In figure: 1 is PCB substrate, and 2 be via hole, and 3 be the public pole route of PCB, and 4 be public pole key and pad, and 5 be function
Energy area, 6 be the not common polar curve road PCB, and 7 be LED three primary colours chip unit, and 8 be the area R red LED chips anode Jian He, and 11 be to arrange
Pad；12 be row pad；13 be the back side PCB route；21 be R red LED chip；21-1 is upside-down mounting R red LED chip；22 G
For green LED chip；22-1 is upside-down mounting G green light LED chip；23 be B blue led chip；23-1 is that upside-down mounting B blue-ray LED is brilliant
Piece；24 be metallic bond and line；31 be encapsulating resin body；32 be slot segmentation.
Specific embodiment
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, but the utility model
Protection scope be not limited to these examples, it is all without departing substantially from the utility model design change or equivalent substitute be included in
Within the protection scope of the utility model.
As shown in figs 1-9,
A kind of display screen of the utility model surface labeling LED mould group, including PCB substrate 1 and be set to
LED three primary colours chip unit 7 in PCB substrate 1；The PCB substrate 1 is sheet, arranges single-row LED tri- in the PCB substrate 1
Primary colours chip unit 7,7 quantity of LED three primary colours chip unit are 2-128；
7 outer encapsulating of LED three primary colours chip unit has specially made structure packing colloid 31；In 31 structure of packing colloid
A slot segmentation 32 is provided between LED three primary colours chip unit 7 described in every two；
1 front of PCB substrate is laid with functional areas 5 and lead；The functional areas 5 pass through conducting resinl, key and line and institute
The connection of LED three primary colours chip unit 7 is stated, each functional areas 5 connect a LED three primary colours chip unit 7；It is described
1 back side of PCB substrate is provided with external introducing tie point pad, and the pad is connect with functional areas 5 by via hole 2.
The external tie point pad that introduces is divided into column pad 11 and row pad 12, and each functional areas 5 are arranged one
Row pad 12；1-3 column pad 11 is respectively arranged in the both ends of the PCB substrate 1, passes through the back side PCB line between the column pad 11
Road 13 connects.
The substrate of the PCB substrate 1 is dark insulating materials.
The outer surface of the packing colloid 31 is frosted shape micro-structure.
The packing colloid 31 is light transmitting epoxy resin body.
32 depth of slot segmentation is 0.1-0.3mm.
The three-primary color LED chip connection type is common cathode or common-anode.
Embodiment 1
A kind of display screen production method of surface labeling LED mould group, includes the following steps:
Design LED three primary colours chip unit arrangement route and arrangement array are required according to LED display driving principle；
The LED three primary colours chip unit is three-primary color LED chip；
The three-primary color LED chip is forward LED.
First the PCB substrate made of insulating materials polish flat and cleaning, drying；In the PCB base to polish flat
According to connection needs, the production front PCB and backside hole 2, PCB public pole route 3, public pole key and pad 4, die bond on plate
Functional areas 5, the not common polar curve road 6 PCB connect column pad 11 outside the back side PCB, connection row pad 12, the back side PCB outside the back side PCB
1 finished product of PCB substrate is made in route 13；
Need to put the blue 23 three-primary color LEDs crystalline substance of formal dress R red 21, G green 22, B admittedly according to function on PCB substrate finished product
Piece, and public pole key and pad 4 and not common polar curve road 6 are connected with metallic bond and line 24；
It is integrally encapsulated, is passed through by LED wafer face is put admittedly using special encapsulating mold and solid-state or liquid-state epoxy resin glue
Encapsulating resin body is formed after baking, so that LED three primary colours chip unit chip face forms surface micro-structure and distributes as net shape
Slot segmentation, be provided with a slot segmentation between every two LED three primary colours chip unit packaging body；
It, will be after completion shown in Fig. 7 encapsulating along LED three primary colours chip unit slot segmentation 32 by cutting technique after solidification
Display screen be cut into single-row display screen surface LED mould group finished product with surface LED mould group semi-finished product,
As shown in Figure 1.Mould group front route is connect outside the back side by the front PCB with 2 connection PCB back side route 13 of backside hole, PCB
Row pad 12 is connected outside column pad 11, the back side PCB.Pass through connection column pad 11 outside the back side PCB when mould group uses, outside the back side PCB
Connect row pad 12 and external circuit physical connection.
The single-row display screen is 2- with the LED three primary colours chip unit quantity in surface LED mould group finished product
128.
The substrate can be the insulating materials such as epoxy resin, BT plate, ceramic substrate, glass ceramics.
The special encapsulating mold surface has frosted shape micro-structure, and has the strip projected parts in grid arrangement, described
Strip projected parts form each LED in packaging body molded surface so that showing recessed strip segmentation slot on manufactured encapsulated member
Separation trough between chip unit group.
The encapsulating can be carried out using liquid or solid epoxy resin, can also be encapsulated using silicon class glue.
Embodiment 2
A kind of display screen production method of surface labeling LED mould group, includes the following steps:
Design LED three primary colours chip unit arrangement route and arrangement array are required according to LED display driving principle；
The LED three primary colours chip unit is three-primary color LED chip；
The three-primary color LED chip is flip LED.
First the PCB substrate made of insulating materials polish flat and cleaning, drying；In the PCB base to polish flat
According to connection needs, the production front PCB and backside hole 2, PCB public pole route 3, public pole key and pad 4, die bond on plate
Functional areas 5, the not common polar curve road 6 PCB connect column pad 11 outside the back side PCB, connection row pad 12, the back side PCB outside the back side PCB
1 finished product of PCB substrate is made in route 13；
It first fell admittedly on PCB substrate finished product and fills R red LED chip 21-1, then put G green LED chip 22-1 admittedly, finally
Admittedly putting B blue led chip 23-1, the tin cream rapid curing for making to put bonding flip LED chip admittedly with 230 DEG C of hot conditions reaches
Reliable connection；And public pole key and pad 4 and not common polar curve road 6 are connected with metallic bond and line 24；
It is integrally encapsulated, is passed through by LED wafer face is put admittedly using special encapsulating mold and solid-state or liquid-state epoxy resin glue
Encapsulating resin body is formed after baking, so that LED three primary colours chip unit wafer face forms surface micro-structure and distributes as net shape
Slot segmentation, be provided with a slot segmentation between every two LED three primary colours chip unit packaging body；
It, will be after completion shown in Fig. 7 encapsulating along LED three primary colours chip unit slot segmentation 32 by cutting technique after solidification
Display screen be cut into single-row display screen surface LED mould group finished product with surface LED mould group semi-finished product,
As shown in Figure 1.Mould group front route is connect outside the back side by the front PCB with 2 connection PCB back side route 13 of backside hole, PCB
Row pad 12 is connected outside column pad 11, the back side PCB.Pass through connection column pad 11 outside the back side PCB when mould group uses, outside the back side PCB
Connect row pad 12 and external circuit physical connection.
The single-row display screen is 2- with the LED three primary colours chip unit quantity in surface LED mould group finished product
128.
The substrate can be the insulating materials such as epoxy resin, BT plate, ceramic substrate, glass ceramics.
The special encapsulating mold surface has frosted shape micro-structure, and has the strip projected parts in grid arrangement, described
Strip projected parts to show recessed strip segmentation slot on manufactured encapsulated member, form each LED in packaging body molded surface
Separation trough between chip unit group.
The encapsulating can be carried out using liquid or solid epoxy resin, can also be encapsulated using silicon class glue.
Only the utility model preferred embodiment is described above, but is not to be construed as the limit to claim
System.All equivalent structure or equivalent flow shifts done using the utility model specification and accompanying drawing content are included in this
Within the scope of patent protection of utility model.The utility model is not limited by embodiment illustrated herein, and be to fit to
Principles disclosed herein and the consistent widest range of novel features.
Claims (7)
1. a kind of display screen surface labeling LED mould group, including PCB substrate (1) and it is set on PCB substrate (1)
LED three primary colours chip unit (7), which is characterized in that the PCB substrate (1) is sheet, is arranged on the PCB substrate (1) single
It arranges LED three primary colours chip unit (7), LED three primary colours chip unit (7) quantity is 2-128；
LED three primary colours chip unit (7) outer encapsulating has specially made structure packing colloid (31)；Packing colloid (31) structure
A slot segmentation (32) are provided between LED three primary colours chip unit (7) described in middle every two；
PCB substrate (1) front is laid with functional areas (5) and lead；The functional areas (5) by conducting resinl, key and line with
LED three primary colours chip unit (7) connection, each functional areas (5) connect a LED three primary colours chip unit
(7)；PCB substrate (1) back side is provided with external introducing tie point pad, and the pad and functional areas (5) pass through via hole
(2) it connects；
The external tie point pad that introduces is divided into column pad (11) and row pad (12), each functional areas (5) setting one
A row pad (12)；1-3 column pad (11) is respectively arranged in the both ends of the PCB substrate (1), passes through between the column pad (11)
The back side PCB route (13) connection.
2. a kind of display screen surface labeling LED mould group as described in claim 1, which is characterized in that the PCB
The substrate of substrate (1) is dark insulating materials.
3. a kind of display screen surface labeling LED mould group as described in claim 1, which is characterized in that the encapsulation
The outer surface of colloid (31) is frosted shape micro-structure.
4. a kind of display screen surface labeling LED mould group as described in claim 1, which is characterized in that the encapsulation
Colloid (31) is light transmitting epoxy resin body.
5. a kind of display screen surface labeling LED mould group as described in claim 1, which is characterized in that the segmentation
Slot (32) depth is 0.1-0.3mm.
6. a kind of display screen surface labeling LED mould group as described in claim 1, which is characterized in that the LED
Three primary colours chip unit is three-primary color LED chip；The three-primary color LED chip is formal dress or flip LED.
7. a kind of display screen surface labeling LED mould group as claimed in claim 6, which is characterized in that three base
Color LED chip connection type is common cathode or common-anode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820951490.7U CN208507668U (en) | 2018-06-20 | 2018-06-20 | A kind of display screen surface labeling LED mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820951490.7U CN208507668U (en) | 2018-06-20 | 2018-06-20 | A kind of display screen surface labeling LED mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208507668U true CN208507668U (en) | 2019-02-15 |
Family
ID=65287128
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820951490.7U Active CN208507668U (en) | 2018-06-20 | 2018-06-20 | A kind of display screen surface labeling LED mould group |
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| Country | Link |
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| CN (1) | CN208507668U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108682670A (en) * | 2018-06-20 | 2018-10-19 | 山西高科华兴电子科技有限公司 | A kind of display screen surface labeling LED module and preparation method thereof |
-
2018
- 2018-06-20 CN CN201820951490.7U patent/CN208507668U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108682670A (en) * | 2018-06-20 | 2018-10-19 | 山西高科华兴电子科技有限公司 | A kind of display screen surface labeling LED module and preparation method thereof |
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