CN110518110A - A kind of LED encapsulation automatic production line - Google Patents
A kind of LED encapsulation automatic production line Download PDFInfo
- Publication number
- CN110518110A CN110518110A CN201910753192.6A CN201910753192A CN110518110A CN 110518110 A CN110518110 A CN 110518110A CN 201910753192 A CN201910753192 A CN 201910753192A CN 110518110 A CN110518110 A CN 110518110A
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- CN
- China
- Prior art keywords
- module
- barrel
- led
- magazine
- production line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention discloses a kind of LED to encapsulate automatic production line, including workbench, is provided with several process modules and several material tables on the workbench, is provided with dimensional code scanner on the material table；Magazine and barrel, wherein the magazine is provided with two dimensional code on the magazine and barrel for placing single LED for placing full wafer LED, the barrel；It is provided with moveable handling device between the process module and the corresponding material table, six shaft machine hand, articles holding table and camera are provided on the handling device；Human factor can be reduced to greatest extent to the unstability of production equipment parameter, process conditions etc., greatly improves LED component quality, and can also encapsulate enterprise for LED reduces headcount, reduces human cost.
Description
Technical field
The present invention relates to automatic producing technology field, especially a kind of LED encapsulates automatic production line.
Background technique
The intelligence production of LED encapsulation is future developing trend, and the production method of the LED encapsulation of country's mainstream is to be based at present
The discrete type production method of single process composition, the degree of automation, production capacity and the mobility of the equipment of single process are all very high, but
There is no the exchange of relevant data information between equipment and equipment, between all process steps the feed of the conveying of material and equipment with
Discharging is all thus to need a large amount of workers to go to operate and handle the information of associated production order, in this way by being accomplished manually
It can be easy to cause to lose because of artificial maloperation.
The LED encapsulation automated production mode of most domestic research is simply by a strip transmission line by all process steps
Equipment is together in series, and goes to carry out operation of feeding and discharging in each process or device configuration correlation machine hand, completes the transmission of material, this
LED encapsulation automated production no doubt may be implemented in kind mode, but this mode is not only at high cost, and setting due to different processes
Standby productive temp is different, and the LED technique of production object is different, and it is not high, equipment component to will lead to whole production line production capacity
Mobility is low, and this production method can only be suitble to the production of single LED, for needing flexible production with regard to unsuitable.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of LED encapsulation automatic production line.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of LED encapsulates automatic production line, including workbench, is provided with several process moulds on the workbench
Block and several material tables are provided with dimensional code scanner on the material table；
Magazine and barrel, wherein the magazine is for placing full wafer LED, the barrel is for placing single LED, the material
Two dimensional code is provided on box and barrel；
Moveable handling device, the handling device are provided between the process module and the corresponding material table
On be provided with six shaft machine hand, articles holding table and camera；
Device for transporting objects is provided between the material table.
As a preference, the process module includes die bond module, cleaning module, bonding wire module, baking-curing mould
Block, dispensing module, cutting module, test module, braid module.
As a preference, the end of the barrel is in inverted cone shape.
As a preference, the baking-curing module includes baking baking oven, is provided on the baking baking oven certainly
Dynamic door.
The beneficial effects of the present invention are: reading the two dimensional code of magazine, barrel at any time by the dimensional code scanner of material table
Information cooperates the intelligence of handling device, device for transporting objects to automatically deliver, can reduce human factor to greatest extent to production
The unstability of device parameter, process conditions etc. greatly improves LED component quality, can also encapsulate enterprise reduction person for LED
Worker's number reduces human cost.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the material table perspective view that magazine is placed in the present invention；
Fig. 3 is the material table perspective view that barrel is placed in the present invention；
Fig. 4 is the handling device perspective view that magazine is placed in the present invention；
Fig. 5 is the handling device perspective view that barrel is placed in the present invention；
Fig. 6 is the perspective view of baking-curing module section in the present invention.
Specific embodiment
It is with reference to the accompanying drawings and embodiments, right in order to which the objects, technical solutions and advantages of the application are more clearly understood
The present invention is further elaborated.For the thorough explanation present invention, some certain details can be related in following description
Section.And in these no specific details, the invention can still be realized, i.e., the technical staff in fields uses herein
These describe and state that the others skilled in the art into fields can more effectively introduce their work essence.
Referring to Fig.1, a kind of LED encapsulates automatic production line, including workbench 1, if being provided on the workbench 1
A process module 2 and several material tables 3 are done, are provided with dimensional code scanner 4 on the material table 3.Referring to Fig. 2, Fig. 3, material
Box 5 and barrel 6, wherein the magazine 5 is for placing full wafer LED, the barrel 6 is for placing single LED, 5 He of magazine
Two dimensional code, the position of system tracks material easy to produce are provided on barrel 6.Wherein material table 3 is used for storing as production
The magazine 5 or barrel 6 of material carrier, the dimensional code scanner 4 configured on material table 3 for identification magazine 5 or barrel 6 two
Tie up code information.
It is preferred that the end of the barrel 6 is in inverted cone shape, hole and the test of barrel frame are passed through convenient for barrel 6
Sorting hole on the test machine of module 27.
Referring to Fig. 4, Fig. 5, it is provided with moveable carry between the process module 2 and the corresponding material table 3 and fills
7 are set, six shaft machine hand 71, articles holding table 72 and camera 73 are provided on the handling device 7, can be identified and be carried by camera 73
Two dimensional code on body and equipment can place magazine 5 come the position for determining crawl carrier and the position being placed in equipment, articles holding table 72
Or barrel frame, barrel frame can store barrel 6.The specific structure and working principle of six shaft machine hand 71 can be with mechanical as reference class
Hand structure, details are not described herein.Device for transporting objects 8 is provided between the material table 3.Handling device 7, device for transporting objects
8 need to be turned in relatively crawl space, advance, and concrete principle can refer to the common automatic guided vehicle of production line.
Referring to Fig.1, the process module 2 includes die bond module 21, cleaning module 22, bonding wire module 23, baking-curing mould
Block 24, dispensing module 25, cutting module 26, test module 27, braid module 28.In die bond, cleaning, bonding wire, baking-curing, point
These preceding processes of glue are all using full wafer LED as production object, are carrier, loading and unloading and work for single device by magazine
Transport between sequence.In rear process, cutting is then full wafer LED to be punched into single LED, and testing with braid is with single
LED is production object, transport between process by the way that barrel or material bag are carrier.
Referring to Fig. 6, the baking-curing module 24 includes baking baking oven 241, is provided with certainly on the baking baking oven 241
Dynamic door 242, the six shaft machine hand 71 that automatically-controlled door 242 designs device 7 easy to carry can pick and place magazine 5 in baking baking oven 241.This
Outer cleaning module 22 may also set up setting automatically-controlled door.According to above-mentioned principle, the present invention can also fit above embodiment
When change and modification.Therefore, the invention is not limited to the specific embodiments disclosed and described above, to of the invention one
A little modifications and changes should also be as falling into the scope of the claims of the present invention.
In the door needs energy automatic open-close for cleaning with the plasma cleaner in baking-curing process and toasting baking oven, or by
The existing door that need to be opened manually is transformed into energy automatic open-close, and the mechanical hand on device 7 easy to carry can pick and place magazine in cabinet.
After a barrel 6 is filled in single LED test, mechanical hand grabs the barrel completely expected from test machine on handling device 7
6, the two-dimensional barcode information of barrel 6 is read by the camera of mechanical hand, by 6 two dimensional code of LED sorting information and barrel in the barrel 6
Information is bound together, and then full barrel 6 is temporarily stored in 6 frame of barrel on 7 platform of handling device, and finally empty barrel 6 is put
Go back to former completely material 6 position of barrel.The LED tested is not to send to braider at once to carry out tape package, but be first stored in material
It is stored in 6 drying boxes of cylinder, when needing to take out corresponding barrel 6 in braid Shi Zaicong drying box, passes through the machine of handling device 7
LED in tool hand handle barrel 6 is poured into the caching cylinder on the vibrating disk or vibrating disk of test machine.
Handling device 7 and device for transporting objects 8 are responsible for main material material table between the loading and unloading and process of interior equipment
Material conveying, participated in without artificial, by combining two-dimensional barcode information to track material production situation, can thus greatly reduce people
To intervene.
Production line can be mentioned by MES system or other similar intelligence control system energy monitoring device conditions of production
High equipment mobility.So far, some materials can not temporarily be accomplished to automatically supply, it is still necessary to and it is artificial to participate in, such as dispenser
Replace phosphor gel etc..
It is data acquisition function that wherein MES system is most basic, and data collector is connect with each equipment, collects equipment operation
Real-time status and save historical data, by Ethernet connect for MES monitoring and scheduling use.MES system includes production pipe
Reason and process monitoring carry out equipment management, creation data tracking, qualitative control, the inquiry of historical data, performance management etc..According to
Each equipment running status dispatches AGV system and realizes automated production by wireless communication mode.
Claims (4)
1. a kind of LED encapsulates automatic production line, it is characterised in that: including workbench (1), set on the workbench (1)
Several process modules (2) and several material tables (3) are equipped with, are provided with dimensional code scanner (4) on the material table (3)；
Magazine (5) and barrel (6), wherein the magazine (5) is for placing full wafer LED, the barrel (6) is for placing single
LED is provided with two dimensional code on the magazine (5) and barrel (6)；
It is provided with moveable handling device (7) between the process module (2) and the corresponding material table (3), it is described to remove
Six shaft machine hand (71), articles holding table (72) and camera (73) are provided on shipping unit (7)；
Device for transporting objects (8) are provided between the material table (3).
2. a kind of LED according to claim 1 encapsulates automatic production line, it is characterised in that: process module (2) packet
Include die bond module (21), cleaning module (22), bonding wire module (23), baking-curing module (24), dispensing module (25), cutting mould
Block (26), test module (27), braid module (28).
3. a kind of LED according to claim 1 encapsulates automatic production line, it is characterised in that: the end of the barrel (6)
In inverted cone shape.
4. a kind of LED according to claim 2 encapsulates automatic production line, it is characterised in that: the baking-curing module
(24) include baking baking oven (241), be provided with automatically-controlled door (242) on the baking baking oven (241).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910753192.6A CN110518110A (en) | 2019-08-15 | 2019-08-15 | A kind of LED encapsulation automatic production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910753192.6A CN110518110A (en) | 2019-08-15 | 2019-08-15 | A kind of LED encapsulation automatic production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110518110A true CN110518110A (en) | 2019-11-29 |
Family
ID=68626035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910753192.6A Pending CN110518110A (en) | 2019-08-15 | 2019-08-15 | A kind of LED encapsulation automatic production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110518110A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203196904U (en) * | 2013-02-27 | 2013-09-18 | 深圳市晟元光电科技有限公司 | Blanking device used for light-emitting diode light splitting machine |
| CN105609597A (en) * | 2015-12-24 | 2016-05-25 | 东莞中之光电股份有限公司 | Inverted assembly process flow of light emitting diode (LED) chip |
| CN107068835A (en) * | 2017-01-18 | 2017-08-18 | 中山市雄纳五金照明科技有限公司 | A kind of bonded LED lamp and preparation method thereof |
| CN207746141U (en) * | 2017-11-16 | 2018-08-21 | 鸿利智汇集团股份有限公司 | A kind of anti-device for injuring material of LED light splitting |
| CN209080875U (en) * | 2017-04-19 | 2019-07-09 | 东莞市台工电子机械科技有限公司 | A kind of novel receiving mechanism of full-automatic LED high speed light splitting machine |
| CN110007655A (en) * | 2019-04-19 | 2019-07-12 | 华南理工大学 | The acquisition of a kind of pair of LED packaging line creation data and tracing system and method |
-
2019
- 2019-08-15 CN CN201910753192.6A patent/CN110518110A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203196904U (en) * | 2013-02-27 | 2013-09-18 | 深圳市晟元光电科技有限公司 | Blanking device used for light-emitting diode light splitting machine |
| CN105609597A (en) * | 2015-12-24 | 2016-05-25 | 东莞中之光电股份有限公司 | Inverted assembly process flow of light emitting diode (LED) chip |
| CN107068835A (en) * | 2017-01-18 | 2017-08-18 | 中山市雄纳五金照明科技有限公司 | A kind of bonded LED lamp and preparation method thereof |
| CN209080875U (en) * | 2017-04-19 | 2019-07-09 | 东莞市台工电子机械科技有限公司 | A kind of novel receiving mechanism of full-automatic LED high speed light splitting machine |
| CN207746141U (en) * | 2017-11-16 | 2018-08-21 | 鸿利智汇集团股份有限公司 | A kind of anti-device for injuring material of LED light splitting |
| CN110007655A (en) * | 2019-04-19 | 2019-07-12 | 华南理工大学 | The acquisition of a kind of pair of LED packaging line creation data and tracing system and method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191129 |
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| RJ01 | Rejection of invention patent application after publication |