CN107864609B

CN107864609B - Assembling method of electronic device

Info

Publication number: CN107864609B
Application number: CN201610841864.5A
Authority: CN
Inventors: 潘詠民; 范仲成
Original assignee: Guangzhou Chenghan Electronic Technology Co ltd
Current assignee: Guangzhou Chenghan Electronic Technology Co ltd
Priority date: 2016-09-22
Filing date: 2016-09-22
Publication date: 2020-10-23
Anticipated expiration: 2036-09-22
Also published as: CN107864609A

Abstract

An assembling method of an electronic device comprises a part preparing step, a wire connecting step and an assembling step after the wire connecting step, wherein a base with a plurality of assembling channels is formed in the part preparing step, a plurality of pins with a wire connecting part respectively are manufactured, a plurality of coil modules are manufactured, each coil module is provided with a plurality of leads, and each lead is provided with two wire connecting ends. In the step of tying the tying end of each wire to the tying part of the corresponding pin, and in the step of assembling, each pin which is electrically connected with the corresponding coil module is respectively installed in the assembling channel of the base. The assembling method can improve the convenience of the electronic device in the process of wire connection and improve the stability of the electronic device after the wire connection.

Description

Assembling method of electronic device

Technical Field

The present invention relates to an assembly method, and more particularly, to an assembly method for an electronic device in which a plurality of pins and a plurality of coil modules are mounted on a base.

Background

The present invention relates to a method for manufacturing an electronic device, and more particularly to a method for manufacturing an electronic device, which includes a package box and a plurality of coil modules electrically connected to the package box, wherein the package box is manufactured by first placing a plurality of pins on a mold, then injection molding a base combined with the pins with plastic, and each pin after manufacturing has a connecting wire portion protruding from the base and an electrical connection portion protruding from the base and electrically connected to a circuit board. When the coil module is manufactured, a plurality of wires are respectively wound on the two wire racks by a machine or a manual work, and each wire is provided with two tying ends which are respectively tied on the tying parts of the corresponding pins.

In the conventional electronic device, the pins are fixedly combined on the base, and then the wire connecting end of each coil module is tied to the corresponding pin, so that the coil module and the pins are electrically connected, but in order to mount a larger number of pins, the smaller the distance between the pins is, the better the distance between the pins is, that is, the wire connecting parts of the pins are relatively close to each other after the packaging box is formed. When each wire of the coil module is tied to the corresponding tie part of the corresponding pin, the operation of winding is inconvenient, and the winding is not solid, so that the problem of poor stability after the wire is tied is easily caused.

In order to improve the convenience of wire connection, taiwan certificate number M502999 utility model has been improved on the structure of the pins, and a clamping groove for clamping the wire is provided on each pin. The utility model uses the wire clamping mode to replace the existing winding knot. The wire connecting end of each wire is clamped on the clamping groove of the corresponding pin, but the wire is only combined in a clamping mode, and the wire is easily separated from the corresponding pin. Therefore, the electronic device having such a structure can improve the convenience in wire connection, but the stability of wire connection by simply clamping and bonding the wire is not preferable.

Disclosure of Invention

It is an object of the present invention to provide a method of assembling an electronic device that overcomes at least one of the disadvantages of the prior art.

The assembling method is used for manufacturing an electronic device and comprises a part preparing step, a wire connecting step and an assembling step which is positioned after the wire connecting step, wherein in the part preparing step, a base with a plurality of assembling grooves is formed, a plurality of pins with a wire connecting part respectively are manufactured, a plurality of coil modules are manufactured, each coil module is provided with a plurality of leads, and each lead is provided with two wire connecting ends. In the step of tying the tying ends of each wire to the tying parts of the corresponding pins, the step of assembling is to install the pins electrically connected with the corresponding coil modules in the assembling channels of the base.

In the assembling method of the present invention, in the wire connecting step, the pins extend along a length extending direction and rotate around a rotation axis of the pins, respectively, the wire connecting end of each wire extends along a wire extending direction, and the wire extending direction is parallel to or perpendicular to the length extending direction.

In the assembling method, the wire tying part of each pin is provided with a clamping groove, and in the wire tying step, the wire tying end of each wire is clamped in the clamping groove of the corresponding pin and then wound and tied.

In the assembling step, each pin passes over the corresponding clamping and embedding protrusion part and then is embedded in the corresponding assembling channel on the base.

The beneficial effects of the invention are as follows: through earlier with the pin with the coil module electricity is connected, then will be the line after the pin installs respectively in this base the equipment channel, can improve the convenience of this electron device when the knot line, improve the stability after the knot line simultaneously.

Drawings

Other features and effects of the present invention will become apparent from the following detailed description of the embodiments with reference to the accompanying drawings, in which:

FIG. 1 is an assembly flow diagram of a first embodiment of the assembly method of the present invention;

FIG. 2 is an exploded perspective view illustrating the method of assembly of the first embodiment in relation to an electronic device;

fig. 3 is a perspective view for assisting in explaining an assembling step of the assembling method of the first embodiment;

FIG. 4 is a schematic wire-tying diagram for assisting in explaining a wire-tying step of the assembling method of the first embodiment;

fig. 5 is a schematic line drawing of a second embodiment of the assembly method of the present invention, which is also helpful for explaining the line drawing step.

Detailed Description

Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same reference numerals.

Referring to fig. 1, 2 and 3, a first embodiment of the assembly method of the present invention is used to manufacture an electronic device, which can be electrically connected to a circuit board not shown in the drawings, and includes a base 2 made of a non-conductive material, a plurality of pins 3 embedded in the base 2, and a plurality of coil modules 4 electrically connected to the corresponding pins 3. The base 2 has a horizontal bottom wall 21 and a mounting wall 22 surrounding the bottom wall 21 and protruding upward, and a containing space 23 with an upward opening is defined between the bottom wall 21 and the mounting wall 22, in the embodiment, the mounting wall 22 is a ring-shaped structure, but is not limited to a ring shape in manufacturing, and has an outer wall surface 221, an inner wall surface 222 facing the containing space 23, and an upper end surface 223 and a lower end surface 224 connected between the outer wall surface 221 and the inner wall surface 222.

The base 2 further has a plurality of spaced groove surfaces 25 recessed from the outer wall surface 221 toward the inner wall surface 222 to respectively define an assembly groove 24, and each assembly groove 24 has an insertion opening 241 adjacent to the outer wall surface 221, an upper opening 242 adjacent to the upper end surface 223, and a lower opening 243 adjacent to the lower end surface 224. The groove surface 25 has a plurality of snap protrusions 251 adjacent to the insertion opening 241 and protruding toward the assembly groove 24.

The pins 3 of this embodiment are respectively embedded in the corresponding assembly slots 24 of the base 2, each pin 3 has a main body 31 embedded in the assembly slot 24, a wiring portion 32 protruding from the upper opening 242, and an electrical connection portion 33 protruding from the lower opening 243 and electrically connected to the circuit board (not shown), and the wiring portion 32 has a straight clamping groove 321. The form of the coil module 4 is not particularly limited, and in the present embodiment, each coil module 4 has two bobbins 41, and a plurality of wires 42 wound around the bobbins 41, respectively, and each wire 42 has two terminal ends 421 coupled to the terminal portions 32 of the corresponding leg 3, respectively.

Referring to fig. 1, 3 and 4, the assembly method includes a part preparation step, a wire bonding step, and an assembly step, wherein the part preparation step can be subdivided into three processes, i.e., forming the base 2, fabricating the leads 3, and fabricating the coil module 4. Specifically, in the present embodiment, the base 2 having the assembling grooves 24 is formed by injection molding, the pins 3 are made of conductive material, the leads 42 of each coil module 4 are respectively wound on the corresponding bobbins 41, and after the parts are manufactured, the wire binding step is ready to be performed.

In the wire tying step of this embodiment, two machines 5 are used to clamp the pins 3 having the same number as the wire tying ends 421 of each coil module 4, after clamping, each pin 3 can rotate around a rotation axis 34 thereof, the pins 3 all extend along a length extending direction 30, and each wire tying end 421 of the wire 42 extends along a wire extending direction 40, in this embodiment, the length extending direction 30 and the wire extending direction 40 are both parallel to the rotation axis 34.

Then, the tying end 421 of each wire 42 of each coil module 4 is clamped in the clamping groove 321 of the corresponding pin 3, and then the tool 5 drives the corresponding pin 3 to rotate around the rotation axis 34 thereof, so that the tying end 421 of each wire 42 is stably wound on the tying portion 32 of the corresponding pin 3, and the tying step is completed.

In this embodiment, after the wire bonding step, the wire frame 41 of each coil module 4 is placed in the accommodating space 23 of the base 2 during assembly, and the pins 3 are respectively clamped in the corresponding assembly slots 24 of the base 2, so that when the pins 3 are respectively pressed in from the corresponding insertion openings 241 of the assembly slots 24, each pin 3 can be stably combined in the corresponding assembly slot 24 by the blocking of the clamping and embedding protrusions 251 arranged in each assembly slot 24. Since each of the connecting ends 421 of the coil module 4 is already wound on the corresponding connecting portion 32 of the pin 3 during the assembly process of the present embodiment, and the distance between the connecting ends 3 can be enlarged as required during the connecting process, the assembly method of the present embodiment is not only innovative, but also can improve the convenience of the electronic device during the connecting process and the stability after the connecting process.

Referring to fig. 5, the assembly steps of a second embodiment of the assembly method of the present invention are the same as the first embodiment except that: in the wire bonding step, the length extending direction 30 of the leads 3 is perpendicular to the wire extending direction 40 of each wire bonding end 421 of the wires 42. When the implement 5 drives each pin 3 to rotate around its own rotation axis 34, each knot end 421 can be tied to the corresponding knot portion 32 of the pin 3.

Incidentally, the pins 3 shown in the first and second embodiments of the present invention are all of a straight-insertion type structure, that is, the pins 3 are all inserted into a circuit board not shown in the figures, but the pins 3 may be of a surface-mount type structure, that is, the electrical connection portion 33 of each pin 3 may be of a straight-bar extension structure as shown in the first and second embodiments, or of a bent-pin type structure extending horizontally to the side.

Claims

1. An assembling method of an electronic device, comprising: a part preparation step, a wire connection step and an assembly step; the part preparation step is to manufacture a plurality of pins respectively provided with a knot part and a plurality of coil modules, wherein each coil module is provided with a plurality of leads, and each lead is provided with two knot ends; the method is characterized in that:

the step of preparing the part also forms a base with a plurality of assembling channels, the step of tying the two tying ends of each lead wire on the tying part of the corresponding pin respectively, and the step of assembling is positioned after the step of tying, and the pins are respectively installed in the assembling channels of the base.

2. The method of assembling an electronic device according to claim 1, wherein: in the wire connecting step, the pins extend along a length extending direction and rotate around a rotation axis of the pins respectively, the two wire connecting ends of each wire extend along a wire extending direction, and the wire extending direction is parallel to the length extending direction.

3. The method of assembling an electronic device according to claim 1, wherein: in the wire connecting step, the pins extend along a length extending direction and rotate around a rotation axis of the pins respectively, the two wire connecting ends of each wire extend along a wire extending direction, and the wire extending direction is perpendicular to the length extending direction.

4. The method of assembling an electronic device according to any one of claims 1 to 3, wherein: the knot line part of each pin is provided with a clamping groove, and in the knot line step, the two knot line ends of each lead are clamped in the clamping grooves of the corresponding pins firstly and then are wound and tied.

5. The method of assembling an electronic device according to claim 4, wherein: the base also has several groove surfaces which respectively define the assembling groove channels, each groove surface has at least one clamping and embedding projection part which is projected towards the corresponding assembling groove channel, in the assembling step, each pin respectively crosses the corresponding clamping and embedding projection part and then is embedded in the corresponding assembling groove channel on the base.