JP2000012752A - Lead frame, semiconductor device using the same and manufacture of the semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame which contributes to the reduction of manufacturing cost of a lead mounted semiconductor device, by improving the fetching number of the lead mounted semiconductor device by utilizing finite dimensions more efficiently. SOLUTION: A lead frame 1 is formed into a structure where a unit, comprising mounting pieces 2, lead terminals 3 integrated with the mounting piece and independent leads 4 are arranged in a matrix form. A tie-bar 5 supports lead rows 10, which are formed by arranging in such a manner that the integral lead terminal 3, which is integral with the respective placing pieces 2, and the independent type lead terminals 4, 4 are all directing in the same direction, by connecting a part of the placing piece integrated lead terminal 3 and the independent lead terminals 4, 4. A frame body supports the lead row group 11, formed by arranging in a row in a direction which orthogonally intersects the row direction, by connecting a part of each lead row 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a lead-mounted semiconductor device for use in power applications and the like and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, lead-mounted semiconductor devices in which a semiconductor element is mounted (mounted) on a lead frame and the periphery of the mounting portion is sealed with resin have been mass-produced. A lead mount type semiconductor device is generally manufactured by the following procedure.

For example, as shown in FIG. 13, a lead frame 51 is used to mass-produce a lead-mounted semiconductor device.
Has a shape in which a plurality of units each including a mounting piece 52, a mounting piece integrated lead terminal 53, and separate type lead terminals 54 are arranged in a line. The mounting piece integrated lead terminal 53 is a lead terminal extending so as to protrude from the rectangular mounting piece 52 in one direction, and separate type lead terminals 54 are provided substantially parallel to both sides thereof. I have. These three lead terminals are arranged at predetermined intervals along the longitudinal direction of the frame 58.

The mounting piece integrated lead terminals 53... And the separate type lead terminals 54... Of the entire lead frame 51 are connected by a tie bar 57 parallel to the frame 58 and are supported collectively. A semiconductor chip 55 is mounted on each mounting piece 52 at a predetermined position by die bonding, and the semiconductor chip 55 and each of the separate lead terminals 54 are electrically connected to each other by bonding wires 56 to form an electric circuit. You.

Thereafter, as shown in FIG. 14, the lead frame 51 is set up in a molding die and resin sealing is performed. In this case, as shown in FIG. 15, a part of the lead frame 51 is sandwiched and supported by the upper mold 59 and the lower mold 60, and the entire mounting piece 52 including the bonding wires 56 is provided. Is housed in the cavity 61. In FIG. 14, the illustration of the upper mold 59 is omitted to clarify the state of the lead frame 51. FIG. 15 is a cross-sectional view taken along the line HH, assuming that illustration of the upper mold 59 is not omitted in FIG. Then, as shown in FIG. 14, the mold resin supplied from the cull 62 is injected into the cavity 61 from the gate 64 via the runner 63. After the mold resin is cured in the cavity 61, if the lead frame 51 is removed from the upper mold 59 and the lower mold 60, a semiconductor device 65 having a mold resin 66 as shown in FIG. 16 is obtained.

Next, a tie bar 5 is provided from the semiconductor device 65.
7 and the frame body 58 are cut along each boundary line between the mounting piece integrated lead terminal 53 and the separate type lead terminal 54... And the mounting piece integrated lead terminal 53 and the separate type lead terminal 54. Are completed, a plurality of lead-mounted semiconductor devices 67 as shown in FIG. 17 are completed at the same time.

As described above, a plurality of the conventional lead mount type semiconductor devices 67 can be taken out at one time along the longitudinal direction of the lead frame.

[0008]

However, the maximum number of the conventional lead mount type semiconductor devices 67 that can be taken out at once depends on the length of the lead frame 51 in the longitudinal direction. The maximum length in the longitudinal direction of the lead frame 51 is regulated by the dimensions of the resin mold, and is generally about 250 mm. Therefore, there is a problem that it is difficult to increase the length of the lead frame 51 in the longitudinal direction further in order to increase the maximum number of lead-out semiconductor devices 67 that can be taken out.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to improve the number of lead-out type semiconductor devices by taking advantage of finite dimensions more effectively. It is an object of the present invention to provide a lead frame that contributes to a reduction in the manufacturing cost of a mount type semiconductor device, a semiconductor device using the same, and a method of manufacturing a semiconductor device.

[0010]

According to a first aspect of the present invention, there is provided a lead frame, comprising: a mounting piece mounted so as to be electrically connected to a semiconductor element; A mounting piece-integrated lead terminal extending so as to protrude in one direction from the piece, and substantially parallel to the mounting piece-integrated lead terminal via a gap at a predetermined interval from the mounting piece-integrated lead terminal And a separate lead terminal electrically connected to the semiconductor element by a bonding wire, wherein the plurality of mounting pieces are arranged in the same plane, and the plurality of mounting pieces are arranged in the same plane. The above-described piece-integrated lead terminal and the above-mentioned separate-type lead terminal are formed by arranging a lead row formed by arranging the above-described piece-integrated lead terminal and the above-mentioned separate-type lead terminal all in the same direction. A tie bar for supporting and coupling the parts,
A lead body formed by arranging the plurality of lead rows in a line in a direction orthogonal to the row direction of the lead rows in the plane, and supporting a lead body by connecting a part of each lead row. And

According to the above invention, the lead frame is
In this configuration, units each including a mounting piece, a mounting piece integrated lead terminal, and a separate type lead terminal are arranged in a matrix.

The tie bar formed on the lead frame is
A plurality of mounting pieces were arranged so as to be arranged in the same plane, and were formed in a line so that the mounting piece integrated lead terminal and the separate type lead terminal attached to each mounting piece all face in the same direction. The lead row is connected and supported by the above-described piece-integrated lead terminal and a part of the separate lead terminal. That is, the tie bar connects and supports these units in a state where the plurality of units are arranged so as to face the same direction on one plane.

The frame formed on the lead frame includes a plurality of lead rows arranged in a line in a direction perpendicular to the row direction of the lead rows in the above-mentioned plane. Connect and support. In this way, the plurality of units are arranged in a matrix.

As described above, since a plurality of units are arranged in a matrix, compared to a case where only one row of units are formed along the longitudinal direction of the lead frame,
The number of units increases by the amount of the units added in the column direction of the lead rows. As a result, the number of lead-mounted semiconductor devices taken out per lead frame is improved, and the manufacturing cost of the lead-mounted semiconductor device can be reduced.

According to a second aspect of the present invention, there is provided a lead frame.
In order to solve the above-mentioned problem, in the lead frame according to claim 1, two lead rows form a pair such that the mounting-piece-integrated lead terminal side of the plurality of lead rows faces each other. At least one pair is formed, and at least a part of the above-mentioned piece-integrated lead terminal and the separate-type lead terminal of one of the lead rows forming the lead row pair is located in the gap of the other lead row. It is characterized by being arranged.

According to the above invention, at least one pair of lead rows in which two of the plurality of lead rows are arranged so that the mounting piece-integrated lead terminal sides face each other is formed. Then, at least a part of the mounting piece integrated lead terminal and the separate type lead terminal of one lead row forming such a lead row pair are different from the mounting piece integrated lead terminal and the separate type lead terminal of the other lead row. Are disposed in a gap between the two.

That is, the lead rows forming a pair of lead rows are not arranged at a certain interval in the direction orthogonal to the row direction, but utilize the gap formed in both lead rows. The mounting piece integrated lead terminal and the separate type lead terminal of the opposing lead row are arranged so as to entirely or partially enter the gap. Accordingly, the lead rows forming the lead row pair are arranged side by side in the row direction while intersecting each other.

As a result, the lead rows forming a pair of lead rows are closely arranged, and the number of units per lead frame can be increased accordingly.

According to a third aspect of the present invention, there is provided a lead frame.
In order to solve the above-mentioned problem, in the lead frame according to claim 1 or 2, at least a lead row pair in which two lead rows form a pair such that the placement pieces face each other among the plurality of lead rows. A pair of notches formed by cutting out a part of a portion where the above-mentioned pieces oppose each other is provided in the above-described pieces of both lead rows forming the above-mentioned lead row pair. It is characterized in that it is arranged so that a part of the above-mentioned placing piece facing thereto is located.

According to the above invention, at least one pair of lead rows in which two of the plurality of lead rows are arranged such that the mounting pieces face each other is formed. The mounting pieces of both lead rows forming such a lead row pair are provided with cutouts in which portions of the mounting pieces facing each other are cut out. Further, the notch is arranged such that a part of the opposing mounting piece is located.

That is, the lead rows forming a pair of lead rows are not arranged at a certain interval in the direction perpendicular to the direction of the lead rows, but are formed on the cut pieces formed on the mounting pieces of both lead rows. The notch is used to arrange a part of the mounting piece of the opposing lead row into the notch. Accordingly, the lead rows forming the lead row pair are in a state where the mounting pieces are arranged in a row in the row direction while intersecting with each other.

As a result, the lead rows forming a pair of lead rows are densely arranged, and the number of units per lead frame can be increased accordingly.

According to a fourth aspect of the present invention, there is provided a semiconductor device according to the first aspect, wherein the semiconductor element is mounted on the mounting piece of the lead frame according to the first or second aspect. It is characterized by having a sealing resin for covering and sealing the mounting piece together with the bonding wire.

According to the present invention, the mounting pieces of the lead frame according to claim 1 or 2 are arranged in a matrix so that the number of units is as large as possible. And the semiconductor device is configured. As a result, the number of lead-mounted semiconductor devices taken out per lead frame is improved, and the manufacturing cost of the lead-mounted semiconductor device can be reduced.

According to a fifth aspect of the present invention, there is provided a semiconductor device, comprising: A sealing resin that bends a part of the piece so as to be completely pulled down from the cutout part, and that covers and seals the above-mentioned mounting piece together with the above-mentioned bonding wire in a state where the above-mentioned mounting element has the above-mentioned semiconductor element mounted thereon It is characterized by having.

In the lead row of the lead frame according to the third aspect of the present invention, since the opposing mounting pieces are in a state of being crossed with each other, it is not possible to perform covering and sealing with a sealing resin as it is. According to the above invention, a part of the opposing mounting piece located in the notch is bent so as to be completely pulled down from the notch, and the opposing mounting pieces are arranged at an interval. To do. Then, the semiconductor element is mounted on each mounting piece, and the mounting piece is covered and sealed together with the bonding wires.

As a result, the number of lead-mounted semiconductor devices taken out per lead frame is improved, and the manufacturing cost of the lead-mounted semiconductor device can be reduced.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a semiconductor device, wherein at least a part of the lead frame is supported by two mold dies from both front and back surfaces. 2 when supported by
The mounting piece on which the semiconductor element is mounted is housed in a space inside the mold formed by contacting the two molds, and protrudes from each of the two molds into the space inside the mold. The positioning piece is supported from both front and back sides by a positioning pin to be formed, and after the sealing resin is injected into the space inside the mold, the sealing resin is in a semi-cured state, and then the positioning pin is moved to the mounting piece. From the surface of the sealing resin, after filling the sealing resin into the space that the positioning pins occupied in the mold,
The semiconductor device according to claim 4 or 5 is characterized in that the coating and sealing of the semiconductor device according to claim 4 or 5 is performed by curing the entire sealing resin in the inner space of the mold.

According to the above-mentioned invention, a step having the following characteristics is performed when the semiconductor device according to claim 4 is covered and sealed. When performing resin sealing, at least a part of the lead frame, such as a mounting piece integrated lead terminal, a separate lead terminal, a tie bar, and a frame, is supported from both front and back surfaces by two molding dies, and a bonding wire is provided. The entire mounting piece, including the mounting piece, is accommodated in the space inside the mold, but at the same time, the mounting piece is supported from both front and back sides by positioning pins projecting into the mold.

Next, the sealing resin is injected into the space inside the mold in a state where the mounting pieces are accommodated in this manner, and the process waits until the sealing resin is in a semi-cured state. Then, when the sealing resin is in a semi-cured state, the positioning pins are separated from the mounting piece to the surface of the sealing resin. Then, a cavity is created in the space occupied by the positioning pin in the space inside the mold,
This space is also filled with a sealing resin. As a result, the sealing resin is supplied to the inner space of the mold without any gap. In this state, the entire sealing resin is cured to complete the covering and sealing. Thereafter, by cutting the tie bar and the frame, a plurality of lead-mounted semiconductor devices can be taken out at the same time.

As a result, except for the mounting piece integrated lead terminal and the separate type lead terminal, there is no conductor portion exposed on the surface of the sealing resin, so that a lead mount type semiconductor device having stable heat radiation characteristics and insulating characteristics. Can be obtained.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a semiconductor device, wherein at least a part of the lead frame is supported by two mold dies from both front and back surfaces. 2 when supported by
The mounting piece on which the semiconductor element is mounted is housed in a space inside the mold formed by contacting the two molds, and protrudes from each of the two molds into the space inside the mold. With the positioning pin formed so that the cross-sectional area gradually decreases toward the distal end, and inserted into the interior space of the mold toward the mounting piece, and in a state separated from the mounting piece, The coating and sealing of the semiconductor device according to claim 4 or 5 is performed by injecting and curing the sealing resin into the space inside the mold.

According to the above-described invention, a step having the following characteristics is performed when the semiconductor device according to claim 4 or 5 is covered and sealed. When performing resin sealing, at least a part of a lead frame such as a mounting piece integrated lead terminal, a separate lead terminal, a tie bar, and a frame is supported by two mold dies from both front and back surfaces, and includes a bonding wire. The entire mounting piece is housed in the space inside the mold.

Next, in a state where the mounting piece is accommodated in this manner, a positioning pin projecting into the inner space of the mold and having a sectional area gradually reduced toward the tip end is inserted into the inner space of the mold. Through. At this time, the positioning pins are separated at predetermined intervals so as not to come into contact with the mounting piece. Then, in this state, the sealing resin is injected into the space inside the mold.

Since the positioning pin is separated from the mounting piece, the mounting piece in the space inside the mold moves between the positioning pins by the injection pressure of the sealing resin. The mounting piece returns to the original position by the back. Therefore, the space inside the mold including the gap between the positioning pin and the mounting piece is filled with the sealing resin. In this state, the entire sealing resin is cured to complete the coating and sealing. Thus, the above gap is also covered with the sealing resin,
The mounting piece is not exposed to the outside. Thereafter, by cutting the tie bar and the frame, a plurality of lead-mounted semiconductor devices can be taken out at the same time.

As a result, since there is no conductor portion exposed on the surface of the sealing resin except for the mounting piece integrated lead terminal and the separate type lead terminal, a lead mount type semiconductor device having stable heat radiation characteristics and insulation characteristics is provided. Can be obtained.

[0037]

[Embodiment 1] FIGS. 1 to 6 show an embodiment of a lead frame, a semiconductor device using the same and a method of manufacturing a semiconductor device according to the present invention.
This will be described below.

FIG. 1 shows a lead frame 1 according to the present embodiment.
Is shown. The lead frame 1 includes a mounting piece 2, a mounting piece integrated lead terminal 3, a separate lead terminal 4, a tie bar 5, and a frame 6. Further, one mounting piece 2, the mounting piece-integrated lead terminal 3, and the separate type lead terminal 4 constitute a unit which is a minimum unit when forming one package.

In each unit, a semiconductor chip 7 as a semiconductor element is mounted at a predetermined position on the rectangular mounting piece 2 by die bonding.
The mounting piece-integrated lead terminal 3 which is integrated with the projection protrudes in one direction and extends. Mounting piece integrated lead terminal 3
Separate lead terminals 4, 4 are provided on both sides of the device in a substantially parallel manner with a predetermined gap therebetween. These separate lead terminals 4 are electrically connected to the semiconductor chip 7 by bonding wires to form an electric circuit. Further, the mounting piece 2 is provided with a screw hole 9 for attaching to the heat sink after completion.

In the lead frame 1, the mounting pieces 2 of a plurality of, for example, four units are arranged in the same plane, and the mounting piece integrated lead terminals 3 of all the units and the separate type lead terminals are arranged. 4 are formed in a single row so that all of them face in the same direction. In one lead row 10, the vicinity of the center of the mounting piece integrated lead terminals 3 and the separate lead terminals 4 of all the units is connected by a tie bar 5 so that the four units face the above directions. Supported. Also,
Four lead rows 10 are provided in the above-mentioned plane in a direction orthogonal to the lead row 10 direction, and a lead row group 11 is formed. In the lead row group 11, the mounting piece integrated lead terminals 3 and the separate lead terminals 4 of all units are provided.
Are connected by a frame 6 and are supported collectively.

Next, a method of manufacturing the lead mount type semiconductor devices 22 (see FIG. 5) using the lead frame 1 having the above-described structure will be described below.

First, the semiconductor chip 7 is mounted on the lead frame 1.
Are mounted by die bonding and wire bonding. Thereafter, as shown in FIGS. 2 and 3, the lead frame 1 is set up on the upper mold 12 and the lower mold 13 as a mold. However, in FIG. 2, the upper mold 12 is omitted so that the state of the lead frame 1 set up becomes clear. FIG. 3 is a cross-sectional view taken along the line AA when it is assumed that the upper mold 12 is not omitted in FIG. At the time of set-up, at least a part of the lead frame 1 such as the mounting piece integrated lead terminals 3, separate lead terminals 4, tie bars 5, and the frame 6 is transferred to the upper mold 12 and the lower mold 12. It is sandwiched and supported by the lower mold 13. At this time, the entire mounting piece 2 including the bonding wires 8, 8 is placed in the cavity 14 as a space in the mold formed by the upper mold 12 and the lower mold 13 contacting each other. To be housed.

Further, as shown in FIG. 4A, positioning pins 15 and 16 are provided on the upper mold 12 and lower mold 13 respectively, and these are inserted into the cavity 14. One end of the mounting piece 2 is sandwiched and supported from both sides. Two sets of positioning pins 15 and 16 are in contact with one mounting piece 2. FIG. 4A is a sectional view taken along line BB of FIG. 2 through one set of positioning pins (the upper mold 1 of the mold).
2 is assumed to be omitted.

As described above, the mounting pieces 2 of all the units
Are collectively accommodated in the cavities 14 and supported by the positioning pins 15... 16. Then, as shown in FIG. (FIG. 4 (b)
Supply). The mold resin 17 flows from each gate 20 into all the cavities 14 through the runner 19. Then, after the mold resin 17 filled in the cavities 14 is in a semi-cured state, the positioning pins 15 and 16 are separated from the mounting piece 2 to the surface of the mold resin 17 as shown in FIG. And again cavity 14
Is filled with a mold resin 17. This way,
When the positioning pins 15 and 16 support the mounting piece 2, the cavity formed in the cavity 14 when the mounting piece 2 is supported can be filled with the mold resin 17. No need to be exposed. Therefore, there is no conductor portion exposed on the surface of the molding resin 17 except for the mounting piece integrated type lead terminal 3 and the separate type lead terminals 4 and 4, so that the lead mount type semiconductor device 22 having stable heat radiation characteristics and insulating characteristics can be provided. Obtainable.

When the molding resin 17 is completely filled in the cavity 14..., The molding resin 17 is cured to complete the covering and sealing step. When the lead frame 1 is detached from the upper mold 12 and the lower mold 13, a semiconductor device 21 having many lead-mounted semiconductor devices 22 can be obtained as shown in FIG. The circular marks 23 are formed as a result of the positioning pins 15... 16 being inserted through the mold resin 17. Further, the tie bars 5 and the frame 6 are connected to the mounting piece integrated lead terminals 3.
Is cut along each boundary line with the separate lead terminals 4 and the mounting piece integrated lead terminals 3 and the separate lead terminals 4 are separated. Complete.

Although the positioning pins 15 and 16 as shown in FIGS. 4A and 4B were used in the above-mentioned covering and sealing step, the positioning pins 24 and 16 as shown in FIG. It is also possible to use 25. Positioning pin 2
In Nos. 4 and 25, the cross-sectional area of a cross section perpendicular to the length direction gradually decreases toward the tip. Although the figure shows the case where the tip is sharp, the tip may be hemispherical.

In the above case, with the lead frame 1 supported by the upper mold 12 and the lower mold 13, the positioning pins 24 and 25 are inserted into the cavity 14 toward the mounting piece 2. At this time, positioning pin 2
The leading ends of the pins 4 and 25 are separated from each other at predetermined intervals, for example, 0.05 mm to 0.1 mm, without making contact with the mounting piece 2. In this state, the mold resin 17 supplied from the cull 18 is injected from the gate 20 into the cavity 14 via the runner 19.

Since the positioning pins 24 and 25 are separated from the mounting piece 2, the mounting piece 2 in the cavity 14 moves between the positioning pins 24 and 25 by the injection pressure of the molding resin 17. While the is not cured, the mounting piece 2 returns to its original position by springback. Therefore, the mold resin 17 is filled in the cavity 14 including the gap between the positioning pins 24 and 25 and the mounting piece 2,
In this state, the entire molding resin 17 is cured to complete the covering and sealing. As described above, since the minute gap is covered with the mold resin 17, the mounting piece 2 does not need to be exposed to the outside of the mold resin 17. Therefore, there is no conductor portion exposed on the surface of the molding resin 17 except for the mounting piece integrated type lead terminal 3 and the separate type lead terminals 4 and 4, so that the lead mount type semiconductor device 22 having stable heat radiation characteristics and insulating characteristics can be provided. Obtainable.

Although the above description has been made of the case where the units are arranged in a matrix of 4 × 4, the number of units depends on the dimensions of the lead mount type semiconductor device 22.
Needless to say, it is only necessary to form a plurality of lead rows having the number of units corresponding to the dimensions.

As described above, according to the lead frame 1 of the present embodiment, the units composed of the mounting piece 2, the mounting piece-integrated lead terminal 3, and the separate type lead terminals 4, 4 are arranged in a matrix. As compared with the case where only one row of units is formed along the longitudinal direction of the lead frame, the number of units corresponding to the length of the lead row 10 in the row direction is resin-sealed with the molding die. The number of stopping operations increases. As a result, the number of the lead-mounted semiconductor devices 22 to be taken out per lead frame can be increased, and the manufacturing cost of the lead-mounted semiconductor device 22 can be reduced.

[Embodiment 2] Another embodiment of a lead frame, a semiconductor device, and a method of manufacturing a semiconductor device according to the present invention will be described below with reference to FIGS. For convenience of explanation, components having the same functions as those shown in the drawings of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

As shown in FIG. 7, the lead frame 31 of the present embodiment has two centrally arranged lead rows 32 of the four lead rows 32... One lead row 32 is a lead row pair 33
In the gap between the mounting piece-integrated lead terminal 3 and the separate lead terminals 4 of one lead row 32 of the lead row pair 33, the other lead row 32 is mounted. The integrated lead terminal 3 and the separate lead terminal 4
4 is configured to partially enter.

That is, in the lead frame 1 of the first embodiment, as shown in FIG.
10 are arranged at intervals X (the width of the frame) in a direction perpendicular to the column direction (longitudinal direction of the lead frame), whereas the lead frame 31 of the present embodiment has two lead columns at the center. 32 are arranged so as to be adjacent to each other as closely as possible. Accordingly, the lead rows 32 forming the lead row pair 33 are arranged in a row in the row direction while intersecting each other. The semiconductor device 34 obtained as a result of resin-sealing the lead frame 31 having such a configuration by the coating and sealing step described in the first embodiment is shown in FIG.
Shown in

By arranging the lead rows 32 as described above, the number of units per lead frame can be increased by effectively utilizing the finite dimensions, and therefore the number of lead mount type semiconductor devices 22 that can be taken out simultaneously. And the manufacturing cost of the lead-mounted semiconductor device 22 can be reduced.

In this embodiment, the unit is 4 × 4
Has described the case of a matrix arrangement with one lead row pair, but the number of units depends on the dimensions of the lead-mounted semiconductor device 22.
Needless to say, the same effect can be obtained in a matrix arrangement other than × 4 or in a matrix arrangement in which two or more lead row pairs are formed.

Third Embodiment A still further embodiment of the lead frame, the semiconductor device, and the method of manufacturing a semiconductor device according to the present invention will be described below with reference to FIGS. For convenience of explanation, components having the same functions as those shown in the drawings of the first and second embodiments are denoted by the same reference numerals, and description thereof is omitted.

As shown in FIG. 9, in the lead frame 41 of the present embodiment, of the four lead rows 42..., Two sets of lead rows 42.
A pair of lead rows 43 composed of 42 are formed.
The mounting piece 2 of one lead row 42 forming one lead row pair 43 is provided with a notch 2a at a part of one end of the other lead row 42 facing the mounting piece 2. I have. Then, a part of the opposing mounting piece 2 is located in the notch 2a.

That is, in the lead frame 1 according to the first embodiment, as shown in FIG. 1, the two lead rows 10 facing the mounting piece 2 side are perpendicular to the row direction (longitudinal direction of the lead frame). While the lead frame 41 is arranged at an interval Y, the lead frame 41 of the present embodiment is configured such that the two lead rows 42 are adjacent to each other as closely as possible. Therefore, the lead rows 42 constituting the lead row pair 43 are in a state where the mounting pieces 2 are arranged in a row in the row direction while intersecting each other. As a result, the number of units per lead frame can be increased.

However, since the opposing mounting pieces 2 are in a state of being crossed with each other, the molding resin 17
Can not be sealed. Therefore, FIG.
As shown in FIG. 7, the mounting piece 2 is folded at the bending portion 2b indicated by a broken line in the mounting piece 2 so that a part of the opposing mounting piece 2 located in the notch 2a is completely pulled down from the notch 2a. The opposing mounting pieces 2 are arranged at an interval. When the bent portion is viewed in a cross-sectional view taken along line CC, it has a shape as shown in FIG. Thereafter, the semiconductor chip 7 is mounted on each mounting piece 2, and the mounting piece 2 is covered and sealed with the bonding resin and the mold resin 17 by the method described in the first embodiment. However, in this case, the positioning pins 15 and 16 or the positioning pins 24 and 25 are inserted toward portions other than the cutout portions 2 a of the mounting piece 2. Semiconductor device 4 obtained as a result
4 is shown in FIG.

By arranging the lead rows 42 as described above, the number of units per lead frame can be increased by effectively utilizing the finite dimensions, and therefore the number of lead mount type semiconductor devices 22 that can be taken out simultaneously. And the manufacturing cost can be reduced.

In this embodiment, the unit is 4 ×
4, the number of units depends on the dimensions of the lead-mounted semiconductor device 22, and the number of units depends on the dimensions of the lead-mounted semiconductor device 22. Needless to say, the same effect is obtained in a matrix arrangement in which three or more lead row pairs are formed.

[0062]

As described above, the lead frame according to the first aspect of the present invention, as described above, the mounting piece mounted so that the semiconductor element is electrically connected thereto, and protrudes in one direction from the mounting piece. The mounting piece-integrated lead terminal and the mounting piece-integrated lead terminal are extended substantially in parallel with the mounting piece-integrated lead terminal with a predetermined gap therebetween and bonded. In a lead frame having a separate lead terminal electrically connected to the semiconductor element by a wire, a plurality of mounting pieces are arranged so as to be arranged in the same plane, and the mounting pieces corresponding to the plurality of mounting pieces are arranged. A lead row formed by arranging the piece-integrated lead terminal and the separate-type lead terminal in a row so that they are all oriented in the same direction is supported by connecting the part-integrated lead terminal and a part of the separate-type lead terminal. Thailand And a frame body for connecting and supporting a part of each of the lead rows formed by arranging a plurality of the lead rows in a row in a direction perpendicular to the row direction of the lead rows in the plane. Configuration.

Therefore, since a plurality of units each including the mounting piece, the mounting piece integrated lead terminal, and the separate type lead terminal are arranged in a matrix, only one unit is formed along the longitudinal direction of the lead frame. The number of units is increased by an amount corresponding to the addition of the units in the column direction of the lead column, as compared with the case where the read operation is performed. As a result, the number of lead-out type semiconductor devices taken out per lead frame is improved, and the production cost of the lead-mounted type semiconductor device can be reduced.

The lead frame of the invention according to claim 2 is
As described above, in the lead frame according to claim 1, at least a pair of lead rows in which the two lead rows form a pair such that the mounting piece-integrated lead terminal side of the plurality of lead rows faces each other. A pair is formed, and at least a part of the above-described piece-integrated lead terminal and the separate-type lead terminal of one of the lead rows forming the lead row pair are arranged so as to be located in the gap of the other lead row. Configuration.

Therefore, the lead rows forming a pair of lead rows are densely arranged, and the number of units per lead frame can be increased accordingly.

The lead frame of the invention according to claim 3 is:
As described above, in the lead frame according to claim 1 or 2, at least one pair of lead rows in which the two lead rows form a pair such that the placement pieces face each other among the plurality of lead rows. The above-mentioned mounting pieces of both lead rows forming a pair of the above-described lead rows are provided with cutouts in which a part of the above-mentioned mounting pieces are opposed to each other, and the cutouts are provided with upper and lower cutouts. This is a configuration in which a part of the writing piece is arranged to be located.

Therefore, the lead rows forming a pair of lead rows are closely arranged, and the number of units per lead frame can be increased accordingly.

According to a fourth aspect of the present invention, there is provided a semiconductor device according to the first or second aspect of the present invention, wherein the semiconductor element is mounted on the above-described mounting piece of the lead frame. This is a configuration having a sealing resin for covering and sealing with the bonding wire.

Therefore, the number of lead-out type semiconductor devices per lead frame can be increased, and the manufacturing cost of the lead-mount type semiconductor device can be reduced.

According to a fifth aspect of the present invention, as described above, the mounting piece of the lead frame according to the third aspect is configured such that the mounting piece of the opposing upper mounting piece located in the cutout portion is replaced with the mounting piece. A portion having a sealing resin that is bent so that the portion is completely pulled down from the cutout portion, and that the mounting piece is covered and sealed together with the bonding wire in a state where the semiconductor element is mounted on the mounting piece. It is.

Therefore, the number of lead-mounted semiconductor devices per lead frame can be increased, and the manufacturing cost of the lead-mounted semiconductor device can be reduced.

According to a sixth aspect of the present invention, as described above, at least a part of the lead frame is supported from both front and back surfaces by two mold dies, and the lead frame is supported by the mold dies. At this time, the mounting piece on which the semiconductor element is mounted is housed in a space inside the mold formed by contacting the two molds, and the inside of the mold is separated from each of the two molds. The mounting piece is supported from both front and back sides by positioning pins protruding into the space, and after injecting the sealing resin into the space inside the mold, the positioning pins are raised after the sealing resin is in a semi-cured state. After separating from the mounting piece to the surface of the sealing resin and filling the sealing resin into the space occupied by the positioning pins in the mold, the space inside the mold is filled with the sealing resin. It is configured to perform the coating encapsulation of the semiconductor device according to claim 4 or 5 by curing the entire sealing resin.

Therefore, since there is no conductor exposed on the surface of the sealing resin except for the mounting piece integrated lead terminal and the separate type lead terminal, a lead mount type semiconductor device having stable heat radiation characteristics and insulating characteristics. This has the effect that a semiconductor device provided with a semiconductor device can be obtained.

According to a seventh aspect of the present invention, as described above, at least a part of the lead frame is supported from both front and back surfaces by two mold dies, and is supported by the mold dies. At this time, the mounting piece on which the semiconductor element is mounted is housed in a space inside the mold formed by contacting the two molds, and the inside of the mold is separated from each of the two molds. A positioning pin projecting into the space and having a sectional area gradually reduced toward the tip was inserted through the space inside the mold toward the mounting piece, and separated from the mounting piece. In the state, the sealing and sealing of the semiconductor device according to claim 4 or 5 is performed by injecting and curing the sealing resin into the space inside the mold.

Therefore, except for the mounting piece integrated type lead terminal and the separate type lead terminal, there is no conductor portion exposed on the surface of the sealing resin, so that a lead mount type semiconductor device having stable heat radiation characteristics and insulating characteristics. This has the effect that a semiconductor device provided with a semiconductor device can be obtained.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a lead frame according to an embodiment of the present invention.

FIG. 2 is a plan view showing a state in which the lead frame of FIG. 1 is set up in a molding die, omitting an upper die of the molding die.

FIG. 3 is a cross-sectional view taken along line AA of FIG. 2 when it is assumed that the upper mold of the mold is not omitted.

4 is a cross-sectional view taken along the line BB when it is assumed that the upper mold of the mold is not omitted in the plan view of FIG. 2, and FIG. 4 (a) is a state in which a mounting piece is supported by a positioning pin; FIG. 7B is an explanatory view showing a state in which the positioning pin is separated from the mounting piece.

FIG. 5 is a plan view illustrating a configuration of a semiconductor device according to an embodiment of the present invention.

6 is a cross-sectional view taken along the line BB when it is assumed that the upper mold of the mold is not omitted in the plan view of FIG. 2, and resin sealing is performed using a positioning pin of another form. It is explanatory drawing which shows a state.

FIG. 7 is a plan view showing a configuration of a lead frame according to another embodiment of the present invention.

FIG. 8 is a plan view showing a configuration of a semiconductor device according to another embodiment of the present invention.

FIG. 9 is a plan view showing a configuration of a lead frame according to still another embodiment of the present invention.

FIG. 10 is an explanatory view showing a state in which the mounting piece of the lead frame of FIG. 9 is bent.

11 is a cross-sectional view of the lead frame of FIG. 10 taken along line CC.

FIG. 12 is a plan view showing a configuration of a semiconductor device according to still another embodiment of the present invention.

FIG. 13 is a plan view showing a configuration of a conventional lead frame.

FIG. 14 is a plan view showing a state in which the lead frame of FIG. 13 is set up in a mold, omitting an upper mold.

FIG. 15 is a cross-sectional view taken along the line HH when it is assumed that the upper mold is not omitted in FIG. 14;

FIG. 16 is a plan view showing a configuration of a conventional semiconductor device.

FIG. 17 is a plan view showing a lead-mounted semiconductor device taken out of the semiconductor device of FIG. 16;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Mounting piece 2a Notch 2b Bending part 3 Mounting piece integrated lead terminal 4 Separate type lead terminal 5 Tie bar 6 Frame 7 Semiconductor chip (semiconductor element) 8 Bonding wire 10 Lead row 11 Lead row group 12 Upper mold (mold mold) 13 Lower mold (mold mold) 14 Cavity (space in mold) 15 Positioning pin 16 Positioning pin 17 Mold resin (sealing resin) 21 Semiconductor device 22 Lead mount Type Semiconductor Device 24 Positioning Pin 25 Positioning Pin 31 Lead Frame 32 Lead Row 33 Lead Row Pair 34 Semiconductor Device 41 Lead Frame 42 Lead Row 43 Lead Row Pair 44 Semiconductor Device

Claims (7)

[Claims] A mounting piece mounted so as to be electrically connected to the semiconductor element; a mounting piece-integrated lead terminal extending so as to protrude in one direction from the mounting piece; A separate lead terminal which is juxtaposed with the above described mounting piece integrated lead terminal substantially in parallel with the mounting piece integrated type lead terminal with a predetermined gap therebetween, and is electrically connected to the semiconductor element by a bonding wire. In the lead frame having a plurality of mounting pieces arranged in the same plane, the mounting piece integrated lead terminal and the separate lead terminal corresponding to the plurality of mounting pieces are all in the same direction. A tie bar for connecting and supporting a part of the piece-integrated lead terminal and a part of the separate-type lead terminal, and a plurality of the lead rows in the plane; Column of A lead frame comprising: a lead row group formed in a row in a direction perpendicular to the direction; 2. A plurality of lead rows, wherein at least one pair of lead rows is formed by pairing two lead rows such that the lead piece-integrated lead terminal sides face each other. 2. The arrangement according to claim 1, wherein at least a part of the lead piece integrated lead terminal and the separate type lead terminal of one of the lead rows are arranged in the gap of the other lead row. Lead frame as described. 3. A plurality of lead rows, wherein at least one pair of a pair of lead rows is formed such that the mounting pieces are opposed to each other among the plurality of lead rows. The above-mentioned placement piece is provided with a cutout part in which a part of the part where the above-mentioned placement pieces face each other is cut out, and the cutout part is arranged so that a part of the above-mentioned placement piece facing the above-mentioned placement piece is located. The lead frame according to claim 1, wherein 4. A sealing resin for covering and sealing the mounting piece together with the bonding wire in a state where the semiconductor element is mounted on the mounting piece of the lead frame according to claim 1 or 2. A semiconductor device characterized by the above-mentioned. 5. The mounting piece of the lead frame according to claim 3, wherein the mounting piece positioned opposite to the cutout portion is bent so that a part of the mounting piece facing the cutout portion is completely pulled down from the cutout portion. And a sealing resin that covers and seals the mounting piece together with the bonding wire in a state where the semiconductor element is mounted on the mounting piece. 6. A mold metal formed by supporting at least a part of the lead frame from both front and back surfaces by two mold dies, and contacting the two mold dies during the support by the mold dies. The above-mentioned mounting piece on which the semiconductor element is mounted is accommodated in the mold space, and the above-mentioned mounting piece is supported from both front and back sides by positioning pins protruding from each of the two molds into the mold mold interior space. After injecting the sealing resin into the mold die space,
After the sealing resin is in a semi-cured state, the positioning pins are separated from the mounting piece to the surface of the sealing resin,
5. The method according to claim 4, further comprising: filling the space occupied by the positioning pins in the mold with the sealing resin, and then curing the entire sealing resin in the space inside the mold.
Or a method for manufacturing a semiconductor device, wherein the semiconductor device according to claim 5 is covered and sealed. 7. A molding die formed by supporting at least a part of the lead frame from both front and back surfaces by two molding dies, and contacting the two molding dies during the support by the molding dies. The mounting piece on which the semiconductor element is mounted is housed in the in-mold space, and each of the two protruding molds protrudes into the in-mold space and has a gradually decreasing cross-sectional area toward the tip. The sealing resin is injected into the mold die space while the formed positioning pin is inserted into the mold die space toward the placement piece, and separated from the placement piece. A method for manufacturing a semiconductor device, wherein the semiconductor device according to claim 4 or 5 is cured by curing.