CN102064165B - Novel LED (Light Emitting Diode) device - Google Patents

Novel LED (Light Emitting Diode) device Download PDF

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Publication number
CN102064165B
CN102064165B CN2010105594031A CN201010559403A CN102064165B CN 102064165 B CN102064165 B CN 102064165B CN 2010105594031 A CN2010105594031 A CN 2010105594031A CN 201010559403 A CN201010559403 A CN 201010559403A CN 102064165 B CN102064165 B CN 102064165B
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China
Prior art keywords
support
led
emitting diodes
light
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010105594031A
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Chinese (zh)
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CN102064165A (en
Inventor
叶进荣
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Shenzhen Beijing Optoelectronics Science & Technology Co ltd
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Shenzhen Beijing Optoelectronics Science & Technology Co ltd
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Application filed by Shenzhen Beijing Optoelectronics Science & Technology Co ltd filed Critical Shenzhen Beijing Optoelectronics Science & Technology Co ltd
Priority to CN2010105594031A priority Critical patent/CN102064165B/en
Publication of CN102064165A publication Critical patent/CN102064165A/en
Application granted granted Critical
Publication of CN102064165B publication Critical patent/CN102064165B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention discloses a novel LED (Light Emitting Diode) device comprising at least three LEDs and at least one bracket; a welding plate is arranged on the bracket; the three LEDs are distributed on the bracket; the anode and the cathode of each LED are respectively led out of the bracket; the bracket is coated with epoxy resin; and tusche is coated on a platform region at the top end of the epoxy resin outside the bracket. After being coated with the tusche, the novel LED device has a black-side effect.

Description

A kind of New LED device
Technical field
The present invention relates to technical field of electronic devices, be specifically related to a kind of New LED device.
Background technology
Light-emitting diode (LED) packing forms mainly contains following several kinds at present: the direct insertion LED of a. (Dip led), b. Piranha formula LED (Flux led), c. surface-adhered type LED (SMD led).
The packing forms of the Piranha LED of prior art is the encapsulation of four pin-type, mainly contains two kinds of forms:
(1) monochromatic Piranha LED: in this kind structure in four pins anodal and negative pole respectively account for two pins, send monochromatic light during energising.
(2) full-color type Piranha LED: shown in the circuit diagram of Fig. 1, it is public electrode that a pin is arranged in four pins of this kind structure, and three pin in addition correspond respectively to three kinds of glow colors, and polarity of electrode and public electrode are opposite.Can send out the light of three kinds of different colours when switching on simultaneously.
Existing direct insertion LED and Piranha LED can operation polycrystalline products, but implementation can only be parallel with these two kinds of structures of a public electrode through polycrystalline, and such structure can not independently fully be controlled each wafer, has limited the application of LED greatly.And existing SMD LED product can be realized the purpose of independent fully each wafer of control, but its finished product outward appearance colloid consists of the material of several kinds of heterogeneities, and reliability and stability and water proof and dust proof aspect are good not as good as one-time formed epoxy resin.And existing product does not have the black flour effect.
Summary of the invention
The technical problem that the present invention will solve provides a kind of New LED device, overcomes the New LED device of prior art because different light-emitting diodes carry out copolar and connects the defective that therefore can't connect and use.
The present invention solves the problems of the technologies described above the technical scheme that is adopted to be:
A kind of New LED device; Comprise at least three light-emitting diodes and at least one support, on the said support pad is set, said three light-emitting diodes are distributed on the said support; It is outside that the positive pole of said three light-emitting diodes and negative pole are drawn said support respectively; Said support has six individual pin, the outer wrap epoxy resin of said support, and the outer epoxy resin tip platform zone of said support is brushed with tusche.
The composition of said tusche is polyester resin varnish and opens profit that its weight mixed proportion was about more than or equal to 4: 1, smaller or equal to 5: 1.
Straight line distributes said three light-emitting diodes in said support upper edge.
Said three light-emitting diodes are made as red light emitting diodes, green LED and blue LED respectively.
Said support is along straight line, broken line or curve distribution, and the red light emitting diodes on it, green LED and blue LED are connected in series respectively.
This New LED device belongs to Piranha LED, and through changing the structure of traditional Piranha LED, this device is different from the structure of 4 pins of traditional Piranha LED; This New LED device has 6 pins, through solid 3 LEDs wafers, makes the positive and negative pin of every LEDs wafer be separately independent; Can independently control each wafer; But this kind structure flexible design becomes various application products, application obtain very big open up wide. and the outward appearance colloid is one-time formed epoxy resin, and is firm shock-resistant; The dustproof and waterproof grade reaches the IP65 grade, effectively protects LED not receive ectocine.
Description of drawings
Fig. 1 is the black preceding sketch map of existing brush;
Fig. 2 is black back sketch map for the present invention brushes;
Fig. 3 is a kind of LED encapsulation front view of the embodiment of the invention;
Fig. 4 is a kind of LED package-side view of the embodiment of the invention;
Fig. 5 is a kind of LED encapsulation vertical view of the embodiment of the invention;
Fig. 6 is the circuit diagram of the embodiment of the invention;
Fig. 7 is the another kind of LED encapsulation front view of the embodiment of the invention;
Fig. 8 is the another kind of LED package-side view of the embodiment of the invention;
Fig. 9 is the another kind of LED encapsulation vertical view of the embodiment of the invention.
Embodiment
According to accompanying drawing and embodiment the present invention is done further explain below:
As shown in the figure, the main manufacturing flow process of this New LED device may further comprise the steps: Gu crystalline substance-bonding wire-sealing-brush Hei-Qie pin-test
(1) solid brilliant: as promptly to be adhesively fixed the LED wafer in the middle process of support bowl cup, used former material: wafer, support, crystal-bonding adhesive through crystal-bonding adhesive
Support: the support that this New LED device uses is a kind of material one-shot forming for the Piranha support of the special die sinking design of my company.Every support has 15 unit, and each unit rack has 6 pins, and conventional Piranha support has only 4 pins.
Wafer: green with red, blue three kinds of LED wafers are example, the solid brilliant operating type of this LED device, and redness, green, blue wafer is pressed the yi word pattern linear array, is fixed in the middle of the support bowl cup
(2) bonding wire: use former material: gold thread
Principle: use automatic bonding equipment with lead connecting wafer electrode and support operating type.
(3) sealing: use former material: mould bar, epoxy resin, use equipment: baking box
Principle: liquid epoxy resin is poured in the mould bar; Support behind the bonding wire is inserted in the mould bar; Again through high temperature 130 degree baking 1.5 hours, make the demoulding after the epoxy resin cure one-shot forming, the product after the demoulding is removed the colloid internal stress through 150 degree bakings long-time baking in 12 hours again.
The mould bar: the mould bar that this New LED device uses is proprietary design
Change traditional Piranha 5mm mould bar platform size into 8.4mm*7.62mm by 7.62mm*7.62mm, beneficial effect is to increase the bonded area of epoxy resin and support, makes product more solid and reliable.
(4) brush China ink: tool using: semi-automatic pad printer, put the anchor clamps of support, baking box, charging tray
Spent material: polyester resin varnish; Opening profit uses pad printer with the black processing of colloid top plan brush; The composition of tusche is a polyester resin varnish and open profit, and the weight mixed proportion is about between 4: 1 to 5: 1, and the position that brush is black is colloid tip platform zone; Brush black after after 100 degrees centigrade of bakings of 1 hour printing ink is dried typing, effect is to make the LED display product that the black flour effect is arranged.
(5) cut pin: use diel that material unnecessary on the support is cut off, the positive and negative electrode of each LED wafer is separated.
(6) test: light the LED wafer with measurement jig through electric current, test the electrical parameter of each LED wafer, will electrically reach the bad order article and choose.
LED device of the present invention independently separates the positive and negative electrode of the LED wafer of each glow color; But flexible design goes out into LED module and LED display product; Range of application obtains very big expansion; And product has more advantage at aspects such as water proof and dust proof grade and colour mixture white balances than conventional products, and handles through appearance brush China ink, and it is better to make product be used as the LED display display effect.
Those skilled in the art do not break away from essence of the present invention and spirit; Can there be the various deformation scheme to realize the present invention; The above is merely the preferable feasible embodiment of the present invention; Be not so limit to interest field of the present invention, the equivalent structure that all utilizations specification of the present invention and accompanying drawing content are done changes, and all is contained within the interest field of the present invention.

Claims (3)

1. New LED device; Comprise at least three light-emitting diodes and at least one support, on the said support pad is set, said three light-emitting diodes are distributed on the said support; It is characterized in that: it is outside that the positive pole of said three light-emitting diodes and negative pole are drawn said support respectively; Said support has six individual pin, the outer wrap epoxy resin of said support, and the outer epoxy resin tip platform zone of said support is brushed with tusche; The composition of said tusche is polyester resin varnish and opens profit that its weight mixed proportion is more than or equal to 4: 1, smaller or equal to 5: 1.
2. New LED device according to claim 1 is characterized in that: straight line distributes said three light-emitting diodes in said support upper edge.
3. New LED device according to claim 2 is characterized in that: said three light-emitting diodes are respectively red light emitting diodes, green LED and blue LED.
CN2010105594031A 2010-11-25 2010-11-25 Novel LED (Light Emitting Diode) device Expired - Fee Related CN102064165B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010105594031A CN102064165B (en) 2010-11-25 2010-11-25 Novel LED (Light Emitting Diode) device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010105594031A CN102064165B (en) 2010-11-25 2010-11-25 Novel LED (Light Emitting Diode) device

Publications (2)

Publication Number Publication Date
CN102064165A CN102064165A (en) 2011-05-18
CN102064165B true CN102064165B (en) 2012-08-01

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105524535A (en) * 2016-01-22 2016-04-27 何挺 Nanometer radiation heat radiation paint and manufacturing method thereof
CN107068835B (en) * 2017-01-18 2019-08-23 中山市雄纳五金照明科技有限公司 A kind of production method of bonded LED lamp

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY131962A (en) * 2001-01-24 2007-09-28 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
CN201044149Y (en) * 2007-06-05 2008-04-02 深圳市共达光电器件有限公司 LED color display unit
CN201072759Y (en) * 2007-08-10 2008-06-11 深圳市贝晶光电科技有限公司 Surface labeling type three-color light emitting diode packaging structure
CN201117657Y (en) * 2007-08-10 2008-09-17 深圳市贝晶光电科技有限公司 Light emitting diode packaging structure
CN201383298Y (en) * 2009-04-17 2010-01-13 卞飚 LED lattice module

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