CN206098444U - Polycrystal LED packaging support and polycrystal LED packaging body - Google Patents
Polycrystal LED packaging support and polycrystal LED packaging body Download PDFInfo
- Publication number
- CN206098444U CN206098444U CN201620780298.7U CN201620780298U CN206098444U CN 206098444 U CN206098444 U CN 206098444U CN 201620780298 U CN201620780298 U CN 201620780298U CN 206098444 U CN206098444 U CN 206098444U
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- Prior art keywords
- electrode
- target
- chip
- substrate
- led package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 230000002093 peripheral effect Effects 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 9
- 238000010276 construction Methods 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 8
- 239000003086 colorant Substances 0.000 description 7
- 239000011324 bead Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 description 1
- 244000061458 Solanum melongena Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000000215 hyperchromic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a polycrystal LED packaging support, include basement, metal electrode and the metal pin -attached who extends, its characterized in that: metal electrode includes target and peripheral electrode, the intermediate position of basement is equipped with the aperture that pierces through the front and the back, basement front aperture position installation target covers the aperture, the target extends metal pin -attached to the basement back to the hole of aperture, the substrate surface still is equipped with two at least peripheral electrodes, the peripheral electrode is installed around the target, there be arranging of interval between each metal electrode, target surface profile is the cross, target surface edge extension has the first embedding structure of embedding basement, the peripheral electrode has the second embedding structure of embedding basement at the surperficial edge extension who is close to the target. The utility model discloses the radiating effect is good, sound construction and waterproof ability reinforce.
Description
Technical field
The utility model is related to a kind of LED package supports, and in particular to a kind of polycrystalline of the multiple LED chip encapsulation of offer
LED package supports and polycrystalline LED package.
Background technology
Existing LED display all adopts RGB (red, green, blue) chip of the Essential colour of three kinds of colors on market, by assembling
Into in a luminescence unit, shades of colour is reached by colour mixture, so as to be shown as various effects, can meet basic display will
Ask, just can not realize wider wide colour gamut, and to reach broader colour gamut or resolution ratio, it is necessary to provide more in original basis
Essential colour, and more Essential colour are reached, the increase for being single led its true qualities of lamp bead is the most directly required, original
On the basis of increase more Essential colour and when monoblock LED large-size screen monitors are assembled into, could could improve the colour gamut of whole screen, reach preferably
Display effect.
RGB three primary colors and hyperchromic rear effect analysis：
Polycrystalline (explanation：Following polycrystalline refers to more than internal three LED chips of same encapsulation) LED encapsulation technologies can be with thorough
The Red Green Blue adopted since existing LED colorful display screens are born is overthrown and has combined to show the display side of color in bottom
Formula, by the combination of multi-color LED package technology, realizes the wide colour gamut and High precision of high picture quality image, also helps
In energy resource consumption is greatly reduced.Polychrome technology enables the color that common three primary colors are difficult accurate description accurately to show.
So-called polysilicon technology, just refers to and one and many has been newly increased on the basis of the RGB three primary colors of conventional LED package technology
Individual chip.If the display screen that the lamp bead that polycrystalline LED encapsulation technologies are produced is assembled into and traditional three colors (RGB) display screen pair
Than, an independent chip is increased on the basis of former RGB, and in the lamp bead used by traditional display screen, they are then all
Only tri- kinds of color chips of RGB.
By introducing one or more independent chip, the lamp bead technology of polycrystalline LED just allows LED display to realize out
More wide colour gamut, and wider wide display resolution.Not only can using the display screen of the polycrystalline LED lamp bead technology production
More vivo reproduction yellow, gold etc. are of all kinds relies only on the color that traditional RGB trichromatic techniques are difficult to true reappearance, together
When other colors it is enhanced after, good castering action can also be played to the expressive force of each portion's color, and also can be by increasing
One redness, by way of virtual display, increases display resolution, so as to reach more preferable display effect.
For LED package, the practical significance of technology upgrading is exactly as simply simply adding a new face
The light emitting diode of color with accurate reproduction colors color, effect, and also can be stretched various so as to improve color representation power
The colour gamut of color, so that the overall colour gamut of electronic display becomes more wide.Such as yellow, blue-green and aubergine, it is
More bright picture is shown, the brightness for lifting whole light source is needed.From the point of view of by spectrum, there is yellow, these Neutral colour
Performance problem just can be resolved, and the addition of yellow can make colour gamut wider, and can produce more under same energy consumption
Plus bright-coloured bright picture color.
Due to many additions of a LED, producing the LED lamp bead of polysilicon technology product needs to solve problems with：LED
The design of frame structure；The design of packaging body；The improvement of tester table.
Chinese utility model patent CN200920205045 discloses a kind of polycrystalline LED package supports, the support interposition
Substrate is set to, both sides arrange positive and negative electrode, and multiple LED chips are arranged on intermediate base bottom, and it is right that chip both positive and negative polarity connects respectively
Answer on the metal electrode of polarity, so as to realize the encapsulation of polycrystalline LED.But the patent is not provided with specific die bond position, multi-chip is solid
Easily occur dislocation after crystalline substance, disperse the problems such as not concentrating, and chip die bond, in substrate, thermal diffusivity is not all right.
Utility model content
The problem that the utility model is mainly solved is to provide a kind of multiple LED chips encapsulation and chip distribution is concentrated, uniform
Polycrystalline LED package supports and its support on the LED package that is packaged.
Concrete scheme is as follows：A kind of polycrystalline LED package supports, including substrate, metal electrode and its metal that extends draw
Pin, described metal electrode includes target and peripheral electrode, the centre position of described substrate be provided with penetrate front and
The aperture at the back side, substrate front surface aperture position installs target and simultaneously covers aperture, the hole of described target to aperture
Extend metal pins to backside of substrate, substrate surface is additionally provided with least two peripheral electrodes, peripheral electrode is arranged on middle electricity
Around pole, there is the arrangement of spacing between each metal electrode, described target surface configuration is cross, described centre
Electrode surface edge is extended with the first embedded structure of embedded substrate, and described peripheral electrode is in the Surface Edge near target
Edge is extended with the second embedded structure of embedded substrate.
Further, it is additionally provided with the wall around target.
Further, described peripheral electrode includes：First electrode, second electrode, the 3rd electrode and the 4th electrode, the
One electrode, second electrode, the 3rd electrode, the 4th electrode are separately mounted to the position at four angles of substrate surface.
Further, described first electrode, second electrode, the 3rd electrode, the 4th electrode extend respectively in basal edge
Go out metal pins to backside of substrate.
Further, the target is connected the power supply of opposite polarity with peripheral electrode, and connected mode is one positive four negative
Or one minus four just.
A kind of polycrystalline LED package, including above-mentioned polycrystalline LED package supports, LED chip, it is covered in the support and core
Protection glue on piece, the LED chip includes：First chip, the second chip, the 3rd chip, fourth chip, the first chip is positive and negative
Electrode connects respectively the target and first electrode of corresponding polarity, and the second chip positive and negative electrode connects respectively corresponding polarity
Target and second electrode, the 3rd chip positive and negative electrode connects respectively the target and the 3rd electrode of corresponding polarity,
Fourth chip positive and negative electrode connects respectively the target of corresponding polarity and the 4th electrode, and Protection glue is covered in support and chip
On.
The utility model has the advantages that：
1. cross intermediate electrode structure is adopted, the variation of chip die bond position and the variation of welding manner can be increased
(such as bonding wire, upside-down mounting all can use), makes the space of die bond and the more preferable flexible operating of welding procedure, and cross target area is several
Fill up whole region space, better heat-radiation effect.
2. wall structure is adopted in the surrounding around cross target, increase the adhesion of colloid and support and play
The effect of mine dam, one layer more waterproof guarantee.
3. in the junction and edge and the combination of substrate of peripheral electrode of the edge of cross target and substrate
Place, using barb punching structure, can increase the adhesion and one layer of waterproofing protection more of metal electrode film and plastic cement substrate.
Description of the drawings
Fig. 1 show a kind of polycrystalline LED of the utility model and encapsulates top view；
Fig. 2 is the one side sectional view of Fig. 1；
Fig. 3 show the circuit diagram of Fig. 1；
Fig. 4 encapsulates top view for the polycrystalline LED of another die bond mode of the utility model；
Fig. 5 encapsulates top view for the polycrystalline LED of another die bond mode of the utility model.
Specific embodiment
To further illustrate each embodiment, the utility model is provided with accompanying drawing.These accompanying drawings are in the utility model is disclosed
A part for appearance, it is mainly to illustrate embodiment, and the running that the associated description of specification can be coordinated to explain embodiment is former
Reason.Coordinate and refer to these contents, those of ordinary skill in the art will be understood that other possible embodiments and this practicality are new
The advantage of type.Component in figure is not necessarily to scale, and similar element numbers are conventionally used to indicate similar component.
The utility model is further illustrated in conjunction with the drawings and specific embodiments.
Embodiment 1, is a kind of preferred side of four color chips encapsulation of the present utility model with reference to shown in Fig. 1, Fig. 2 and Fig. 3
Case, including：Substrate 10, target 20, first electrode 301, second electrode 302, the 3rd electrode 303, the 4th electrode 304,
One green glow chip 401, the second green glow chip 402, blue chip 403, gold-tinted chip 404, ring wall surface 50, aperture 60, metal
Pin 70, metal lead wire 80, support 90, Protection glue (not shown).
In the present embodiment, gold-tinted chip 404 is the different electrode chip of the opposing face that positive and negative electrode is chip, is according to epitaxy
Structure based on, make that processing procedure is most simple, lower-cost chip structure.
In the present embodiment, the exiting surface of gold-tinted chip 404 is negative electrode face.
In the present embodiment, it is core that the first green glow chip 401, the second green glow chip 402, blue chip 403 are positive and negative electrode
The same electrode chip of the same face of piece, based on being the structure according to epitaxy, making processing procedure is most simple, lower-cost chip knot
Structure.
In the present embodiment, target 20 is shaped as a cross metal derby, and target 20 is arranged on into substrate 10
Medial small hole surface of position, and cover aperture 60, target 20 extends metal pins 70 in aperture 60 and carries on the back to substrate 10
Face, first electrode 301, second electrode 302, the 3rd electrode 303, the 4th electrode 304 have respectively spacing installed in substrate 10
The position at four angles, and extend metal pins 70 to the back side of substrate 10.Because target 20 adopts decussate texture, cause
The variation and the variation (such as bonding wire, upside-down mounting all can use) of welding manner of chip die bond position, makes die bond and Welder
The space of the more preferable flexible operating of skill, cross target area almost fills out whole region space, better heat-radiation effect.
Target 20 connects positive source, first electrode 301, second electrode 302, the 3rd electrode 303, the 4th electrode
304 are all connected with power cathode, and the P electrode of the first green glow chip 401 is fixed on the cross end of target 20 1, and N electrode is fixed
In first electrode 301；The P electrode of the second green glow chip 402 is fixed on the cross end of target 20 1, and N electrode is fixed on
In second electrode 302；The P electrode of blue chip 403 is fixed on the cross end of target 20 1, and it is electric that N electrode is fixed on the 3rd
On pole 303；The positive electrode face of gold-tinted chip 404 connects with target and fixes, and chip negative electrode is by metal lead wire 80 and the
Four electrodes 304 are connected；An annular plastics wall 50 is surrounded with around target 20, Protection glue covers wall 50
On, increase the adhesion of colloid and support 90 and play a part of mine dam, one layer more waterproof guarantee.
In the present embodiment, in the marginal surface of target 20 the first embedded structure 201 of embedded substrate 10, periphery are extended with
Electrode is extended with the second embedded structure 305 of embedded substrate 10 in the marginal surface near target, and embedded structure is barb
Shape, can increase the adhesion and one layer of waterproofing protection more of metal electrode film and plastic cement substrate.
To absolutely prove the utility model using cross intermediate electrode structure, increase chip die bond position variation and
The variation (such as bonding wire, upside-down mounting all can use) of welding manner, as shown in figure 4, being based on brilliant LED encapsulation of the present utility model
Another die bond mode of frame and polycrystalline LED package, wherein cross target connect positive source, and four peripheral electrodes connect
The P electrode for connecing power cathode, green glow chip and blue chip is fixed on around the cross of cross target on end, N electrode
It is fixed on periphery；The positive electrode face of gold-tinted chip and red light chips is fixed on side by side in the middle of the cross of cross target,
Chip negative electrode is connected by metal lead wire with peripheral electrode.Fig. 5 is based on brilliant LED package supports of the present utility model and polycrystalline
Another die bond mode of LED package, it is with the die bond mode difference in Fig. 4, gold-tinted chip and red light chips
Negative electrode face be fixed on peripheral electrode, chip positive electrode is connected in the cross of cross target by metal lead wire
Between.
The die bond mode of the polycrystalline LED package supports shown in Fig. 4, Fig. 5 is encapsulated based on the utility model polycrystalline LED
Body, to illustrate to adopt after the utility model polycrystalline LED package, the variation and the variation of welding manner of its die bond position,
The person skilled of this area is known that and is, and different power supply connected mode (just connecting such as minus four), not of the same race
The chip connection of class, and the change of chip die bond position, belong to the scope that utility model is protected, specific metal electrode
Arrangement, the connection of LED chip be that those skilled in the art can grasp easily, here just differs a citing, meets this practicality
Content described in new claim, and though make what change, modification, be originally be utility model protection domain.
Claims (6)
1. a kind of polycrystalline LED package supports, including substrate, metal electrode and its metal pins that extend, it is characterised in that：Institute
The metal electrode stated includes target and peripheral electrode, and the centre position of described substrate is provided with and penetrates front and back
Aperture, substrate front surface aperture position installs target and covers aperture, and described target extends to the hole of aperture
To backside of substrate, substrate surface is additionally provided with least two peripheral electrodes to metal pins, and peripheral electrode is arranged on the week of target
Enclose, there is the arrangement of spacing between each metal electrode, described target surface configuration is cross, described target table
Face edge is extended with the first embedded structure of embedded substrate, and described peripheral electrode extends in the marginal surface near target
There is the second embedded structure of embedded substrate.
2. polycrystalline LED package supports according to claim 1, it is characterised in that：It is additionally provided with the wall around target.
3. polycrystalline LED package supports according to claim 1, it is characterised in that：Described peripheral electrode includes：First is electric
Pole, second electrode, the 3rd electrode and the 4th electrode, first electrode, second electrode, the 3rd electrode, the 4th electrode are respectively mounted
In the position at four angles of substrate surface.
4. polycrystalline LED package supports according to claim 3, it is characterised in that：Described first electrode, second electrode,
3rd electrode, the 4th electrode extend metal pins to backside of substrate in basal edge respectively.
5. polycrystalline LED package supports according to claim 1, it is characterised in that：The target connects with peripheral electrode
Connect the power supply of opposite polarity, connected mode is one positive four negative or one minus four just.
6. a kind of polycrystalline LED package, including the polycrystalline LED package supports described in claim 3 or 4, LED chip, it is covered in
Protection glue on the support and chip, the LED chip includes：First chip, the second chip, the 3rd chip, fourth chip, the
One chip positive and negative electrode connects respectively the target and first electrode of corresponding polarity, and the second chip positive and negative electrode connects respectively
The target and second electrode of corresponding polarity, the 3rd chip positive and negative electrode connect respectively the target of corresponding polarity with
3rd electrode, fourth chip positive and negative electrode connects respectively the target of corresponding polarity and the 4th electrode, and Protection glue is covered in
On support and chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620780298.7U CN206098444U (en) | 2016-07-22 | 2016-07-22 | Polycrystal LED packaging support and polycrystal LED packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620780298.7U CN206098444U (en) | 2016-07-22 | 2016-07-22 | Polycrystal LED packaging support and polycrystal LED packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206098444U true CN206098444U (en) | 2017-04-12 |
Family
ID=58466508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620780298.7U Expired - Fee Related CN206098444U (en) | 2016-07-22 | 2016-07-22 | Polycrystal LED packaging support and polycrystal LED packaging body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206098444U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019074309A1 (en) | 2017-10-13 | 2019-04-18 | Samsung Electronics Co., Ltd. | Display apparatus and manufacturing method for the same |
| TWI732621B (en) * | 2019-08-27 | 2021-07-01 | 明陽半導體股份有限公司 | Light-emitting diode device with driving mechanism |
-
2016
- 2016-07-22 CN CN201620780298.7U patent/CN206098444U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019074309A1 (en) | 2017-10-13 | 2019-04-18 | Samsung Electronics Co., Ltd. | Display apparatus and manufacturing method for the same |
| CN111213240A (en) * | 2017-10-13 | 2020-05-29 | 三星电子株式会社 | Display device and method for manufacturing the same |
| EP3673511A4 (en) * | 2017-10-13 | 2020-07-15 | Samsung Electronics Co., Ltd. | Display apparatus and manufacturing method for the same |
| US11423826B2 (en) | 2017-10-13 | 2022-08-23 | Samsung Electronics Co., Ltd. | Display apparatus and manufacturing method for the same |
| CN111213240B (en) * | 2017-10-13 | 2023-08-04 | 三星电子株式会社 | Display device and method for manufacturing the same |
| TWI732621B (en) * | 2019-08-27 | 2021-07-01 | 明陽半導體股份有限公司 | Light-emitting diode device with driving mechanism |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170412 |
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| CF01 | Termination of patent right due to non-payment of annual fee |