CN201072759Y - Surface labeling type three-color light emitting diode packaging structure - Google Patents

Surface labeling type three-color light emitting diode packaging structure Download PDF

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Publication number
CN201072759Y
CN201072759Y CNU2007201295284U CN200720129528U CN201072759Y CN 201072759 Y CN201072759 Y CN 201072759Y CN U2007201295284 U CNU2007201295284 U CN U2007201295284U CN 200720129528 U CN200720129528 U CN 200720129528U CN 201072759 Y CN201072759 Y CN 201072759Y
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CN
China
Prior art keywords
led
utility
encapsulating structure
model
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007201295284U
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Chinese (zh)
Inventor
叶进荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi LIAN crystal optoelectronics Co., Ltd.
Original Assignee
Shenzhen Beijing Optoelectronics Science & Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to CNU2007201295284U priority Critical patent/CN201072759Y/en
Application granted granted Critical
Publication of CN201072759Y publication Critical patent/CN201072759Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a SMT tri-color LED sealing structure, which comprises a red LED sealed in a shell, a green LED, a blue LED and a supporting frame. The supporting frame is provided with a welding plate, and the three LEDs are distributed on the supporting frame in straight line. Because the utility model R, G, B LED are distributed in straight line, the light extraction efficiency is high and the luminescence angle on horizontal direction is large, the color mixing is even, and the color of the image processed with color mixing is even and no color difference; the thickness of the side wall of the sealing structure can be improved to be more than1.5mm, which is beneficial for waterproof automatic glues pouring.

Description

A kind of surface-adhered type Tricolor LED encapsulating structure
Technical field
The utility model relates to technical field of electronic devices, is specifically related to a kind of surface-adhered type Tricolor LED encapsulating structure.
Background technology
LED display (LED panel) is a kind of by the control semiconductor light-emitting-diode luminous display screen that shows, is used for various information such as display text, figure, image, animation, market, video, video signal.LED display is divided into graphic display screen and video display screen, forms by the LED matrix-block.Graphic display screen can show Chinese character, English text and figure synchronously with computer; Video display screen adopts microcomputer to control, picture and text, image and luxuriant, with in real time, synchronously, information propagation pattern is play various information clearly, also can show two dimension, three-dimensional animation, video recording, TV, VCD program and on-the-spot circumstance.LED display display frame is bright in luster, third dimension is strong, quiet as oil painting, moving as film, be widely used in station, harbour, airport, market, hospital, hotel, bank, securities market, construction market, auction room, Industrial Management and other public place.LED display can show numeral, literal, the graph image of variation; Not only can be used for indoor environment and can also be used for outdoor environment, have projecting apparatus, video wall, the incomparable advantage of LCDs.Why LED (light-emitting diode) is subjected to extensively paying attention to and is developed rapidly, is that the advantage that had with itself is inseparable.These advantages are summarized: the brightness height, operating voltage is low, power consumption is little, miniaturization, the life-span is long, shock-resistant and stable performance.The development prospect of LED is very wide, and at present just towards high brightness more, more high weather resistance, higher luminous density, higher uniformity of luminance, reliability, panchromaticization direction develop.
The composition mode of LED display mainly contains following several form at present:
1, three-in-one Surface Mount: red, green, blue three luminous points are encapsulated in same housing the inside;
2, three and one Surface Mount: promptly red, green, blue three luminous points are encapsulated in the different housings the inside.
As shown in Figure 1, red in the SMD LED light-emitting diode that the LED display of present the 1st kind of form uses, green, the arrangement of blue light-emitting diode is not on same straight line, this scheme is red in the horizontal direction, green, and blue lighting angle is variant, thereby cause LED display to watch aberration in the horizontal direction, influence viewing effect.
The utility model content
The technical problems to be solved in the utility model provides a kind of surface-adhered type Tricolor LED encapsulating structure, the surface-adhered type Tricolor LED encapsulating structure lighting angle that overcomes prior art is variant, thereby cause LED display to watch aberration in the horizontal direction, the thickness that influences viewing effect and encapsulating structure is thin partially, is unfavorable for carrying out the defective that sealing is handled.
The utility model is to solve the problems of the technologies described above the technical scheme that is adopted to be:
A kind of surface-adhered type Tricolor LED encapsulating structure, comprise the red light emitting diodes, green LED, blue LED and the support that are encapsulated in the housing, on the described support pad is set, described three light-emitting diodes are distributed on the described support, and described red light emitting diodes, green LED and blue LED distribute at described support upper edge straight line.
Described surface-adhered type Tricolor LED encapsulating structure, wherein: the thickness of described encapsulating structure is made as greater than 1.5 millimeters.
Described surface-adhered type Tricolor LED encapsulating structure, wherein: the thickness of described encapsulating structure is made as 2.8 millimeters.
The beneficial effects of the utility model are: since the utility model R, G, B LED linear array, so light extraction efficiency height, lighting angle is big in the horizontal direction, and colour mixture is even, and the color of image that colour mixture is come out is even, does not have aberration; The encapsulating structure lateral thickness is brought up to more than the 1.5mm, helps doing the waterproof encapsulating and handle on pcb board.
Description of drawings
Fig. 1 is a prior art surface-adhered type Tricolor LED encapsulating structure schematic diagram;
Fig. 2 is the utility model surface-adhered type Tricolor LED encapsulating structure schematic diagram;
Fig. 3 is the utility model encapsulating structure circuit diagram;
Fig. 4 is the utility model surface-adhered type Tricolor LED encapsulating structure front schematic view;
Fig. 5 is the utility model surface-adhered type Tricolor LED encapsulating structure side schematic view;
Fig. 6 is placed in encapsulating structure on the pcb board for the utility model and carries out the waterproof sealing and handle schematic diagram.
Embodiment
With embodiment the utility model is described in further detail with reference to the accompanying drawings below:
As shown in Figure 2, the utility model carries out three-in-one Surface Mount with light-emitting diode, red, blue, green three kinds of LED are encapsulated in housing the inside and are arranged on the same straight line.Wherein 1,6 pin is respectively the positive and negative electrode of red LED, and 2,3 pins are respectively the positive and negative electrode of green LED, and 3,4 pins are respectively the positive and negative electrode of blue led.The utility model circuit diagram as shown in Figure 3, the front of the utility model surface-adhered type Tricolor LED encapsulating structure as shown in Figure 4, its side as shown in Figure 5, the thickness that the utility model is provided with surface-adhered type Tricolor LED encapsulating structure is not less than 1.5mm, and preferable enforcement is of a size of 2.8mm.
As shown in Figure 6, after being welded on the utility model surface-adhered type Tricolor LED encapsulating structure on the pcb board, on pcb board, pour into marine glue, carry out water-proofing treatment, because the utility model increases the thickness of encapsulating structure, so marine glue can be because of not overflowing the surface of muffling the utility model surface-adhered type Tricolor LED encapsulating structure.
Those skilled in the art do not break away from essence of the present utility model and spirit, can there be the various deformation scheme to realize the utility model, the above only is the preferable feasible embodiment of the utility model, be not so limit to interest field of the present utility model, the equivalent structure that all utilization the utility model specifications and accompanying drawing content are done changes, and all is contained within the interest field of the present utility model.

Claims (3)

1. surface-adhered type Tricolor LED encapsulating structure, comprise the red light emitting diodes, green LED, blue LED and the support that are encapsulated in the housing, on the described support pad is set, described three light-emitting diodes are distributed on the described support, it is characterized in that: described red light emitting diodes, green LED and blue LED distribute at described support upper edge straight line.
2. surface-adhered type Tricolor LED encapsulating structure according to claim 1, it is characterized in that: the thickness of described encapsulating structure is made as greater than 1.5 millimeters.
3. surface-adhered type Tricolor LED encapsulating structure according to claim 1 and 2 is characterized in that: the thickness of described encapsulating structure is made as 2.8 millimeters.
CNU2007201295284U 2007-08-10 2007-08-10 Surface labeling type three-color light emitting diode packaging structure Expired - Fee Related CN201072759Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007201295284U CN201072759Y (en) 2007-08-10 2007-08-10 Surface labeling type three-color light emitting diode packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007201295284U CN201072759Y (en) 2007-08-10 2007-08-10 Surface labeling type three-color light emitting diode packaging structure

Publications (1)

Publication Number Publication Date
CN201072759Y true CN201072759Y (en) 2008-06-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007201295284U Expired - Fee Related CN201072759Y (en) 2007-08-10 2007-08-10 Surface labeling type three-color light emitting diode packaging structure

Country Status (1)

Country Link
CN (1) CN201072759Y (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102005446A (en) * 2010-11-03 2011-04-06 熊周成 Light-emitting diode (LED) packaging structure and LED luminescent display module
CN102064165A (en) * 2010-11-25 2011-05-18 深圳市贝晶光电科技有限公司 Novel LED (Light Emitting Diode) device
CN102394265A (en) * 2011-12-01 2012-03-28 广东粤华新光电科技有限公司 Manufacturing method of SMD full color LED component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102005446A (en) * 2010-11-03 2011-04-06 熊周成 Light-emitting diode (LED) packaging structure and LED luminescent display module
CN102064165A (en) * 2010-11-25 2011-05-18 深圳市贝晶光电科技有限公司 Novel LED (Light Emitting Diode) device
CN102394265A (en) * 2011-12-01 2012-03-28 广东粤华新光电科技有限公司 Manufacturing method of SMD full color LED component

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: JIANGXI LIANCHUANG BEIJING OPTOELECTRONIC CO., LTD

Free format text: FORMER OWNER: SHENZHEN BEIJING OPTOELECTRONICS SCIENCE + TECHNOLOGY CO., LTD.

Effective date: 20101027

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518109 1-5/F, FACTORY BUILDING 1, JUNLONG INDUSTRIAL DISTRICT, XINWEI HUIDOU, YOUSONG, LONGHUA SUBDISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 330096 1/F, FACTORY BUILDING 101, LIANCHUANG OPTOELECTRONIC SCI-TECH PARK, NO.168, JINGDONG AVENUE, NANCHANG NEW AND HIGH TECHNOLOGY DEVELOPMENT ZONE

TR01 Transfer of patent right

Effective date of registration: 20101027

Address after: 330096, Nanchang hi tech Zone, 168 Jingdong Avenue, LIAN photoelectric technology park, No. 101 building, first floor

Patentee after: Jiangxi LIAN crystal optoelectronics Co., Ltd.

Address before: 518109 Guangdong Province, Shenzhen city Longhua Street tabulaeformis bucket Wai Junlong Industrial Zone No. 1 building 1-5

Patentee before: Shenzhen Beijing Optoelectronics Science & Technology Co.,Ltd.

DD01 Delivery of document by public notice

Addressee: Jiangxi LIAN crystal optoelectronics Co., Ltd.

Document name: Notification to Pay the Fees

DD01 Delivery of document by public notice

Addressee: Jiangxi LIAN crystal optoelectronics Co., Ltd.

Document name: Notification of Termination of Patent Right

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080611

Termination date: 20140810

EXPY Termination of patent right or utility model