JP3176416B2 - 熱伝導性プラスチック材料用充填剤、その樹脂組成物及びその使用 - Google Patents

熱伝導性プラスチック材料用充填剤、その樹脂組成物及びその使用

Info

Publication number
JP3176416B2
JP3176416B2 JP05923692A JP5923692A JP3176416B2 JP 3176416 B2 JP3176416 B2 JP 3176416B2 JP 05923692 A JP05923692 A JP 05923692A JP 5923692 A JP5923692 A JP 5923692A JP 3176416 B2 JP3176416 B2 JP 3176416B2
Authority
JP
Japan
Prior art keywords
weight
volume
component
particle size
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP05923692A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05132576A (ja
Inventor
ビュジャール パトリス
ジーバー ウェルナー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Huntsman Advanced Materials Switzerland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Advanced Materials Switzerland GmbH filed Critical Huntsman Advanced Materials Switzerland GmbH
Publication of JPH05132576A publication Critical patent/JPH05132576A/ja
Application granted granted Critical
Publication of JP3176416B2 publication Critical patent/JP3176416B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737Organic materials with or without a thermoconductive filler
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01FCOMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00Compounds of aluminium
    • C01F7/02Aluminium oxide; Aluminium hydroxide; Aluminates
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/30Particle morphology extending in three dimensions
    • C01P2004/32Spheres
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/51Particles with a specific particle size distribution
    • C01P2004/53Particles with a specific particle size distribution bimodal size distribution
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
JP05923692A 1991-02-14 1992-02-14 熱伝導性プラスチック材料用充填剤、その樹脂組成物及びその使用 Expired - Fee Related JP3176416B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH45491 1991-02-14
CH454/91-9 1991-02-14

Publications (2)

Publication Number Publication Date
JPH05132576A JPH05132576A (ja) 1993-05-28
JP3176416B2 true JP3176416B2 (ja) 2001-06-18

Family

ID=4187395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05923692A Expired - Fee Related JP3176416B2 (ja) 1991-02-14 1992-02-14 熱伝導性プラスチック材料用充填剤、その樹脂組成物及びその使用

Country Status (6)

Country Link
EP (1) EP0499585B1 (US07541385-20090602-C00001.png)
JP (1) JP3176416B2 (US07541385-20090602-C00001.png)
KR (1) KR100210184B1 (US07541385-20090602-C00001.png)
CA (1) CA2061093A1 (US07541385-20090602-C00001.png)
DE (1) DE59203064D1 (US07541385-20090602-C00001.png)
TW (1) TW197458B (US07541385-20090602-C00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011121826A1 (ja) 2010-03-29 2011-10-06 アロン化成株式会社 熱伝導性エラストマー組成物

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JP3359410B2 (ja) * 1994-03-04 2002-12-24 三菱電機株式会社 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法
WO1998016585A1 (fr) * 1996-10-16 1998-04-23 Kureha Kagaku Kogyo K.K. Composition a base de resine
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
US6794030B1 (en) 1999-11-30 2004-09-21 3M Innovative Properties Company Heat conductive sheet and method of producing the sheet
JP2001168246A (ja) * 1999-11-30 2001-06-22 Three M Innovative Properties Co 熱伝導性シート及びその製造方法
US6500891B1 (en) 2000-05-19 2002-12-31 Loctite Corporation Low viscosity thermally conductive compositions containing spherical thermally conductive particles
JP4118691B2 (ja) * 2001-05-18 2008-07-16 株式会社日立製作所 熱硬化性樹脂硬化物
US6887811B2 (en) 2001-05-30 2005-05-03 Showa Denko K.K. Spherical alumina particles and production process thereof
JP4920141B2 (ja) * 2001-05-30 2012-04-18 昭和電工株式会社 アルミナ粒子及びその製造方法
JP2002348115A (ja) * 2001-05-30 2002-12-04 Showa Denko Kk アルミナ粒子及びその製造方法
US7053018B2 (en) 2001-05-30 2006-05-30 Showa Denko K.K. Spherical alumina particles and production process thereof
JP3807995B2 (ja) * 2002-03-05 2006-08-09 ポリマテック株式会社 熱伝導性シート
DE10260098A1 (de) * 2002-12-19 2004-07-01 Basf Ag Elektrisch isolierende und wärmeleitfähige Polyesterformmassen
TW200503952A (en) * 2003-06-04 2005-02-01 Showa Denko Kk Corundum for filling in resin and resin composition
JP4526064B2 (ja) * 2003-06-04 2010-08-18 昭和電工株式会社 樹脂充填用コランダム及び樹脂組成物
WO2004108812A1 (en) * 2003-06-04 2004-12-16 Showa Denko K.K. Corundum for filling in resin and resin composition
JP4631272B2 (ja) * 2003-11-14 2011-02-16 東レ株式会社 フィラー高充填樹脂組成物およびそれから得られる成形品
US20090188701A1 (en) * 2004-01-08 2009-07-30 Hiroshi Tsuzuki Inorganic powder, resin composition filled with the powder and use thereof
DE602005016155D1 (de) 2004-12-06 2009-10-01 Showa Denko Kk Oberflächenmodifiziertes corund sowie harzzusammensetzung
JP4890063B2 (ja) * 2006-03-20 2012-03-07 新日鐵化学株式会社 樹脂組成物、並びにこの樹脂組成物を用いて得たワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔
JP5089908B2 (ja) * 2006-04-06 2012-12-05 株式会社マイクロン 高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート用配合粒子、高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート、および、その製造方法
JP2008013759A (ja) * 2006-06-07 2008-01-24 Sumitomo Chemical Co Ltd エポキシ樹脂組成物及びエポキシ樹脂硬化物
KR20090028571A (ko) * 2006-06-07 2009-03-18 스미또모 가가꾸 가부시끼가이샤 에폭시 수지 조성물 및 에폭시 수지 경화물
JP5345340B2 (ja) * 2008-05-16 2013-11-20 新日鉄住金マテリアルズ株式会社 アルミナ配合粒子および樹脂成形体
DE102008049850A1 (de) * 2008-10-01 2010-04-08 Tesa Se Wärmeleitende Haftklebemasse
TWI350716B (en) * 2008-12-29 2011-10-11 Nanya Plastics Corp High thermal conductivity, halogen-free flame-retardent resin composition and its pre-impregnated and coating materials for printed circuit boards
JP5649126B2 (ja) * 2011-08-04 2015-01-07 株式会社日立製作所 注型用エポキシ樹脂組成物およびそれを用いた電気機器
JP6123277B2 (ja) * 2011-12-28 2017-05-10 日立化成株式会社 樹脂組成物、樹脂組成物シート及び樹脂組成物シートの製造方法、金属箔付樹脂組成物シート、bステージシート、半硬化の金属箔付樹脂組成物シート、メタルベース配線板材料、メタルベース配線板、led光源部材、並びにパワー半導体装置
ITMI20121202A1 (it) * 2012-07-10 2014-01-11 Francesco Pio Salvatore Calabrese Formulazione per materiali compositi, materiali compositi e procedimento per la loro produzione
SG11201810208RA (en) 2016-05-16 2018-12-28 Martinswerk Gmbh Products and uses thereof
EP3575366A4 (en) 2017-01-19 2020-10-28 University of Fukui MATERIAL WITH HIGH THERMAL CONDUCTIVITY AND METHOD FOR MANUFACTURING THEREOF
EP3732940A4 (en) 2017-12-27 2021-10-20 3M Innovative Properties Company CURED EPOXY RESIN COMPOSITION FOR ELECTRONIC ENCLOSURES, ITEMS AND PROCEDURES

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1462141A (fr) * 1965-01-05 1966-12-09 Lockheed Aircraft Corp Compositions céramo-plastiques moulables et résistant aux températures élevées

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011121826A1 (ja) 2010-03-29 2011-10-06 アロン化成株式会社 熱伝導性エラストマー組成物
US8871835B2 (en) 2010-03-29 2014-10-28 Aronkasei Co., Ltd Heat conductive elastomer composition

Also Published As

Publication number Publication date
TW197458B (US07541385-20090602-C00001.png) 1993-01-01
JPH05132576A (ja) 1993-05-28
EP0499585B1 (de) 1995-08-02
EP0499585A1 (de) 1992-08-19
DE59203064D1 (de) 1995-09-07
KR920016518A (ko) 1992-09-25
CA2061093A1 (en) 1992-08-15
KR100210184B1 (ko) 1999-07-15

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