JP3175433U7 - - Google Patents

Download PDF

Info

Publication number
JP3175433U7
JP3175433U7 JP2012000976U JP2012000976U JP3175433U7 JP 3175433 U7 JP3175433 U7 JP 3175433U7 JP 2012000976 U JP2012000976 U JP 2012000976U JP 2012000976 U JP2012000976 U JP 2012000976U JP 3175433 U7 JP3175433 U7 JP 3175433U7
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
frame
diode package
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2012000976U
Other languages
English (en)
Japanese (ja)
Other versions
JP3175433U (ja
Filing date
Publication date
Priority claimed from KR1020070038279A external-priority patent/KR100901618B1/ko
Application filed filed Critical
Application granted granted Critical
Publication of JP3175433U publication Critical patent/JP3175433U/ja
Publication of JP3175433U7 publication Critical patent/JP3175433U7/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2012000976U 2007-04-19 2012-02-23 半導体ダイオードパッケージ Expired - Lifetime JP3175433U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0038279 2007-04-19
KR1020070038279A KR100901618B1 (ko) 2007-04-19 2007-04-19 발광 다이오드 패키지 및 제조방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012037168 Continuation 2008-04-17

Publications (2)

Publication Number Publication Date
JP3175433U JP3175433U (ja) 2012-05-10
JP3175433U7 true JP3175433U7 (enrdf_load_stackoverflow) 2012-10-11

Family

ID=39875630

Family Applications (7)

Application Number Title Priority Date Filing Date
JP2010503977A Withdrawn JP2010525569A (ja) 2007-04-19 2008-04-17 発光デバイスパッケージ及びこれを備えるライトユニット
JP2012037167A Withdrawn JP2012109612A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法
JP2012037166A Withdrawn JP2012109611A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法
JP2012000976U Expired - Lifetime JP3175433U (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ
JP2013066840A Pending JP2013128154A (ja) 2007-04-19 2013-03-27 発光デバイスパッケージ及びこれを備えるライトユニット
JP2015027327A Pending JP2015092639A (ja) 2007-04-19 2015-02-16 発光デバイスパッケージ及びこれを備えるライトユニット
JP2016197934A Pending JP2017011307A (ja) 2007-04-19 2016-10-06 発光デバイスパッケージ

Family Applications Before (3)

Application Number Title Priority Date Filing Date
JP2010503977A Withdrawn JP2010525569A (ja) 2007-04-19 2008-04-17 発光デバイスパッケージ及びこれを備えるライトユニット
JP2012037167A Withdrawn JP2012109612A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法
JP2012037166A Withdrawn JP2012109611A (ja) 2007-04-19 2012-02-23 半導体ダイオードパッケージ及びその製造方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2013066840A Pending JP2013128154A (ja) 2007-04-19 2013-03-27 発光デバイスパッケージ及びこれを備えるライトユニット
JP2015027327A Pending JP2015092639A (ja) 2007-04-19 2015-02-16 発光デバイスパッケージ及びこれを備えるライトユニット
JP2016197934A Pending JP2017011307A (ja) 2007-04-19 2016-10-06 発光デバイスパッケージ

Country Status (4)

Country Link
US (12) US7858993B2 (enrdf_load_stackoverflow)
JP (7) JP2010525569A (enrdf_load_stackoverflow)
KR (1) KR100901618B1 (enrdf_load_stackoverflow)
WO (1) WO2008130140A1 (enrdf_load_stackoverflow)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100901618B1 (ko) * 2007-04-19 2009-06-08 엘지이노텍 주식회사 발광 다이오드 패키지 및 제조방법
KR101360732B1 (ko) * 2007-06-27 2014-02-07 엘지이노텍 주식회사 발광 다이오드 패키지
JP5186930B2 (ja) * 2008-01-24 2013-04-24 豊田合成株式会社 発光装置
WO2010039014A2 (ko) * 2008-10-01 2010-04-08 삼성엘이디 주식회사 액정고분자를 이용한 발광다이오드 패키지
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US7923739B2 (en) * 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US9685592B2 (en) * 2009-01-14 2017-06-20 Cree Huizhou Solid State Lighting Company Limited Miniature surface mount device with large pin pads
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8860043B2 (en) * 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
TWI394299B (zh) * 2009-11-06 2013-04-21 Semileds Optoelectronics Co 具有外移式電極之垂直發光二極體
KR20130036737A (ko) * 2010-01-25 2013-04-12 비쉐이 스프라그, 인코포레이티드 금속계 전자 구성요소 및 그 제조 방법
US8525213B2 (en) * 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
KR101081169B1 (ko) * 2010-04-05 2011-11-07 엘지이노텍 주식회사 발광 소자 및 그 제조방법, 발광 소자 패키지, 조명 시스템
KR101859149B1 (ko) 2011-04-14 2018-05-17 엘지이노텍 주식회사 발광 소자 패키지
KR101103674B1 (ko) 2010-06-01 2012-01-11 엘지이노텍 주식회사 발광 소자
JP2011253910A (ja) * 2010-06-01 2011-12-15 Toshiba Corp 発光装置
US20110303940A1 (en) * 2010-06-14 2011-12-15 Hyo Jin Lee Light emitting device package using quantum dot, illumination apparatus and display apparatus
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
KR101798231B1 (ko) * 2010-07-05 2017-11-15 엘지이노텍 주식회사 발광 소자
USD643819S1 (en) 2010-07-16 2011-08-23 Cree, Inc. Package for light emitting diode (LED) lighting
MY170920A (en) 2010-11-02 2019-09-17 Carsem M Sdn Bhd Leadframe package with recessed cavity for led
CN102456818A (zh) * 2010-11-03 2012-05-16 富士康(昆山)电脑接插件有限公司 发光二极管导线架
TWI609508B (zh) * 2010-11-03 2017-12-21 惠州科銳半導體照明有限公司 具有大型接腳墊片的微型表面安裝元件
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
USD679842S1 (en) 2011-01-03 2013-04-09 Cree, Inc. High brightness LED package
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
CN103348496A (zh) * 2011-02-07 2013-10-09 克利公司 用于发光二极管（led）发光的部件和方法
CN102934228B (zh) 2011-03-02 2017-09-01 惠州科锐半导体照明有限公司 发光二极管封装件及发光二极管
CN103534821B (zh) * 2011-05-03 2017-03-29 克利公司 发光二极管（led）的封装、系统、装置及相关方法
US9397274B2 (en) * 2011-08-24 2016-07-19 Lg Innotek Co., Ltd. Light emitting device package
JP5978572B2 (ja) * 2011-09-02 2016-08-24 日亜化学工業株式会社 発光装置
MY156107A (en) 2011-11-01 2016-01-15 Carsem M Sdn Bhd Large panel leadframe
KR101459555B1 (ko) * 2011-11-02 2014-11-07 엘지이노텍 주식회사 발광 소자
JP5914933B2 (ja) * 2011-12-21 2016-05-11 住友化学株式会社 半導体用パッケージの製造方法、半導体用パッケージ及び半導体発光装置
JP2013143520A (ja) * 2012-01-12 2013-07-22 Sony Corp 撮像装置および撮像装置の製造方法
KR20140004881A (ko) * 2012-07-03 2014-01-14 삼성디스플레이 주식회사 백라이트 유닛
TWI485962B (zh) * 2012-12-22 2015-05-21 Univ Kun Shan Zero Current Switching Parallel Load Resonant Converter
KR20150019828A (ko) * 2013-08-16 2015-02-25 삼성전자주식회사 발광소자 패키지 및 그 제조방법
DE102013110355A1 (de) * 2013-09-19 2015-03-19 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines Leiterrahmenverbunds
JP2017063066A (ja) * 2014-01-30 2017-03-30 パナソニックＩｐマネジメント株式会社 半導体装置及び半導体パッケージ
KR101501020B1 (ko) * 2014-02-17 2015-03-13 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
KR101583561B1 (ko) * 2014-05-29 2016-01-08 엘지이노텍 주식회사 발광 소자
WO2016035508A1 (ja) * 2014-09-01 2016-03-10 シャープ株式会社 発光装置
JP6156402B2 (ja) 2015-02-13 2017-07-05 日亜化学工業株式会社 発光装置
JP6206442B2 (ja) * 2015-04-30 2017-10-04 日亜化学工業株式会社 パッケージ及びその製造方法、並びに発光装置
JP6862141B2 (ja) * 2015-10-14 2021-04-21 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及び照明装置
US10024492B1 (en) 2016-04-07 2018-07-17 Pelco Products, Inc. Cable-mounted traffic control device support bracket with strut member adapter
US10193320B1 (en) 2016-10-10 2019-01-29 Pelco Products, Inc. Integral terminal compartment with deployable terminal block
KR102674066B1 (ko) * 2016-11-11 2024-06-13 삼성전자주식회사 발광 소자 패키지
US10401000B1 (en) 2017-03-01 2019-09-03 Pelco Products, Inc. Traffic control device with wind dampening backplate assembly
CN108727813A (zh) * 2018-05-25 2018-11-02 郑州智锦电子科技有限公司 一种led灯外壳材料
DE102019106931A1 (de) 2019-03-19 2020-09-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement, optoelektronische Halbleitervorrichtung und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
JP7349294B2 (ja) * 2019-08-29 2023-09-22 株式会社ジャパンディスプレイ Ｌｅｄモジュール及び表示装置
US11444227B2 (en) 2019-10-01 2022-09-13 Dominant Opto Technologies Sdn Bhd Light emitting diode package with substrate configuration having enhanced structural integrity
US11444225B2 (en) 2020-09-08 2022-09-13 Dominant Opto Technologies Sdn Bhd Light emitting diode package having a protective coating
US11329206B2 (en) 2020-09-28 2022-05-10 Dominant Opto Technologies Sdn Bhd Lead frame and housing sub-assembly for use in a light emitting diode package and method for manufacturing the same

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50133873U (enrdf_load_stackoverflow) * 1975-04-18 1975-11-04
JPS5396695A (en) * 1977-02-03 1978-08-24 Toyo Dengu Seisakushiyo Kk Display
JPS53145476U (enrdf_load_stackoverflow) * 1977-04-20 1978-11-16
JPS5933265U (ja) * 1982-08-26 1984-03-01 シャープ株式会社 発光半導体表示装置
JPS60180176A (ja) * 1984-02-27 1985-09-13 Oki Electric Ind Co Ltd 光結合半導体装置
JPH06204569A (ja) * 1992-12-28 1994-07-22 Casio Comput Co Ltd 発光ダイオードの構造
DE19829197C2 (de) * 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
JP2000183407A (ja) * 1998-12-16 2000-06-30 Rohm Co Ltd 光半導体装置
JP2002299698A (ja) 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd 発光装置
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
JP2003152228A (ja) 2001-11-12 2003-05-23 Sumitomo Bakelite Co Ltd Ｌｅｄ用ケース及びｌｅｄ発光体
KR100439402B1 (ko) * 2001-12-24 2004-07-09 삼성전기주식회사 발광다이오드 패키지
JP2004063494A (ja) * 2002-07-24 2004-02-26 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
WO2004034529A1 (ja) 2002-09-30 2004-04-22 Sanyo Electric Co., Ltd. 発光素子
JP2004146815A (ja) * 2002-09-30 2004-05-20 Sanyo Electric Co Ltd 発光素子
JP4144498B2 (ja) * 2002-10-01 2008-09-03 松下電器産業株式会社 線状光源装置及びその製造方法、並びに、面発光装置
JP4009208B2 (ja) 2003-01-21 2007-11-14 京セラ株式会社 発光装置
KR20040073869A (ko) 2003-02-15 2004-08-21 엘지전자 주식회사 발광 소자의 광 반사체 구조 및 그를 이용한 발광 소자패키지
JP4132039B2 (ja) * 2003-03-24 2008-08-13 京セラ株式会社 発光素子収納用パッケージおよび発光装置
KR100550856B1 (ko) * 2003-06-03 2006-02-10 삼성전기주식회사 발광 다이오드(ｌｅｄ) 소자의 제조 방법
US7391153B2 (en) * 2003-07-17 2008-06-24 Toyoda Gosei Co., Ltd. Light emitting device provided with a submount assembly for improved thermal dissipation
JP2005078937A (ja) 2003-08-29 2005-03-24 Ichikoh Ind Ltd 薄型発光装置
JP3906199B2 (ja) 2003-11-27 2007-04-18 京セラ株式会社 発光装置
JP4544619B2 (ja) * 2004-06-08 2010-09-15 ローム株式会社 発光ダイオードランプ
KR101047795B1 (ko) * 2005-01-05 2011-07-07 엘지이노텍 주식회사 반도체 발광소자
JP2006351773A (ja) * 2005-06-15 2006-12-28 Rohm Co Ltd 半導体発光装置
JP2007027535A (ja) 2005-07-20 2007-02-01 Stanley Electric Co Ltd 光半導体装置
JP2007042681A (ja) 2005-07-29 2007-02-15 Toshiba Lighting & Technology Corp 発光ダイオード装置
CN1932603A (zh) * 2005-09-16 2007-03-21 鸿富锦精密工业（深圳）有限公司 直下式背光模组
JP4715422B2 (ja) 2005-09-27 2011-07-06 日亜化学工業株式会社 発光装置
JP5214128B2 (ja) * 2005-11-22 2013-06-19 シャープ株式会社 発光素子及び発光素子を備えたバックライトユニット
KR100635981B1 (ko) 2006-01-27 2006-10-18 알티전자 주식회사 측면발광 다이오드 패키지
US9178121B2 (en) * 2006-12-15 2015-11-03 Cree, Inc. Reflective mounting substrates for light emitting diodes
KR101026914B1 (ko) * 2006-12-28 2011-04-04 니치아 카가쿠 고교 가부시키가이샤 발광 장치, 패키지, 발광 장치의 제조 방법, 패키지의 제조방법 및 패키지 제조용 금형
US8610143B2 (en) * 2007-03-12 2013-12-17 Nichia Corporation High output power light emitting device and package used therefor
KR100901618B1 (ko) * 2007-04-19 2009-06-08 엘지이노텍 주식회사 발광 다이오드 패키지 및 제조방법
US8030674B2 (en) * 2008-04-28 2011-10-04 Lextar Electronics Corp. Light-emitting diode package with roughened surface portions of the lead-frame

Similar Documents

Publication Publication Date Title
JP3175433U7 (enrdf_load_stackoverflow)
JP2011211705A5 (enrdf_load_stackoverflow)
JP2014057060A5 (enrdf_load_stackoverflow)
JP2014057061A5 (enrdf_load_stackoverflow)
JP2014103295A5 (enrdf_load_stackoverflow)
JP2013190802A5 (enrdf_load_stackoverflow)
JP2013526323A5 (enrdf_load_stackoverflow)
JP2017511633A5 (enrdf_load_stackoverflow)
JP2012531046A5 (enrdf_load_stackoverflow)
JP2012227137A5 (ja) 発光装置
JP2017183578A5 (enrdf_load_stackoverflow)
JP2015119011A5 (enrdf_load_stackoverflow)
EP2982469A4 (en) LEAD FREE SOFT ALLOY AND VEHICLE INTERNAL ELECTRONIC SWITCHING
JP2014187081A5 (enrdf_load_stackoverflow)
JP2015084377A5 (enrdf_load_stackoverflow)
JP2015057826A5 (enrdf_load_stackoverflow)
FR2989387B1 (fr) Alliage aluminium cuivre lithium a resistance au choc amelioree
JP2014074160A5 (enrdf_load_stackoverflow)
JP2017076793A5 (enrdf_load_stackoverflow)
JP2014175321A5 (enrdf_load_stackoverflow)
JP2015514304A5 (enrdf_load_stackoverflow)
JP2014057236A5 (enrdf_load_stackoverflow)
JP2015035734A5 (enrdf_load_stackoverflow)
JP2015159321A5 (enrdf_load_stackoverflow)
ITMI20110824A1 (it) Accessorio costituito da serratura o simile