JP3142754B2 - 電気音響変換器用リードフレーム - Google Patents

電気音響変換器用リードフレーム

Info

Publication number
JP3142754B2
JP3142754B2 JP07254090A JP25409095A JP3142754B2 JP 3142754 B2 JP3142754 B2 JP 3142754B2 JP 07254090 A JP07254090 A JP 07254090A JP 25409095 A JP25409095 A JP 25409095A JP 3142754 B2 JP3142754 B2 JP 3142754B2
Authority
JP
Japan
Prior art keywords
plating
electroacoustic transducer
metal substrate
lead frame
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP07254090A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09135492A (ja
Inventor
潤 小野
正吉 久保
高裕 曽根
和詞 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Star Micronics Co Ltd
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Star Micronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd, Star Micronics Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Priority to JP07254090A priority Critical patent/JP3142754B2/ja
Priority to DE1996601021 priority patent/DE69601021T2/de
Priority to EP19960306415 priority patent/EP0762800B1/en
Publication of JPH09135492A publication Critical patent/JPH09135492A/ja
Priority to HK98113341.2A priority patent/HK1012487B/en
Application granted granted Critical
Publication of JP3142754B2 publication Critical patent/JP3142754B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H01R4/024—Soldered or welded connections between cables or wires and terminals comprising preapplied solder
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
JP07254090A 1995-09-07 1995-09-29 電気音響変換器用リードフレーム Expired - Fee Related JP3142754B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP07254090A JP3142754B2 (ja) 1995-09-07 1995-09-29 電気音響変換器用リードフレーム
DE1996601021 DE69601021T2 (de) 1995-09-07 1996-09-04 Anschlussrahmen für elektroakustische Wandler und elektroakustischer Wandler
EP19960306415 EP0762800B1 (en) 1995-09-07 1996-09-04 Lead frame for electroacoustic transducer and electroacoustic transducer
HK98113341.2A HK1012487B (en) 1995-09-07 1998-12-14 Lead frame for electroacoustic transducer and electroacoustic transducer

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7-229954 1995-09-07
JP22995495 1995-09-07
JP07254090A JP3142754B2 (ja) 1995-09-07 1995-09-29 電気音響変換器用リードフレーム

Publications (2)

Publication Number Publication Date
JPH09135492A JPH09135492A (ja) 1997-05-20
JP3142754B2 true JP3142754B2 (ja) 2001-03-07

Family

ID=26529078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP07254090A Expired - Fee Related JP3142754B2 (ja) 1995-09-07 1995-09-29 電気音響変換器用リードフレーム

Country Status (3)

Country Link
EP (1) EP0762800B1 (enExample)
JP (1) JP3142754B2 (enExample)
DE (1) DE69601021T2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI109075B (fi) * 1998-10-05 2002-05-15 Nokia Corp Akustisen muuntimen alustan kiinnitysmenetelmä

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3125396U (ja) 2006-03-14 2006-09-21 琢磨 藤原 ノート型パソコン台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5914658A (ja) * 1982-07-16 1984-01-25 Hitachi Cable Ltd 半導体用リ−ドフレ−ム
JPS59168660A (ja) * 1983-03-15 1984-09-22 Hitachi Cable Ltd 半導体用リ−ドフレ−ム
JPH0611904B2 (ja) * 1986-12-04 1994-02-16 株式会社神戸製鋼所 高力、高導電性銅合金の製造方法
JPH01109756A (ja) * 1987-10-23 1989-04-26 Kobe Steel Ltd 半導体装置用リードフレーム
JP2790421B2 (ja) * 1993-10-25 1998-08-27 スター精密株式会社 電気音響変換器及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3125396U (ja) 2006-03-14 2006-09-21 琢磨 藤原 ノート型パソコン台

Also Published As

Publication number Publication date
EP0762800B1 (en) 1998-11-25
HK1012487A1 (en) 1999-07-30
JPH09135492A (ja) 1997-05-20
DE69601021T2 (de) 1999-06-10
DE69601021D1 (de) 1999-01-07
EP0762800A2 (en) 1997-03-12
EP0762800A3 (enExample) 1997-04-23

Similar Documents

Publication Publication Date Title
US6518508B2 (en) Ag-pre-plated lead frame for semiconductor package
US8564107B2 (en) Lead frame and method for manufacturing the same
JP3760075B2 (ja) 半導体パッケージ用リードフレーム
US6593643B1 (en) Semiconductor device lead frame
JP2576830B2 (ja) リードフレーム
US5916696A (en) Conformable nickel coating and process for coating an article with a conformable nickel coating
CN107134415A (zh) 半导体器件及其制造方法
KR20100028791A (ko) 리드 프레임 및 그 제조방법
KR101120288B1 (ko) 성장 형성물 감소 방법 및 장치와 집적 회로
US6287896B1 (en) Method for manufacturing lead frames and lead frame material for semiconductor device
JP2925815B2 (ja) 半導体チップ実装用リードフレームとその製造方法
JP3142754B2 (ja) 電気音響変換器用リードフレーム
JPH11111909A (ja) 半導体装置用リードフレーム
US7250671B2 (en) Lead frame and method for manufacturing semiconductor package with the same
KR100231832B1 (ko) 다중 도금층을 가진 반도체 리드프레임
HK1012487B (en) Lead frame for electroacoustic transducer and electroacoustic transducer
JPH10284666A (ja) 電子部品機器
JPH1084065A (ja) 電子部品用導電材料
JP6827150B1 (ja) リードフレーム材およびその製造方法ならびにリードフレームおよび電気電子部品
KR100203334B1 (ko) 다층도금 리드프레임
JPH04174546A (ja) 銅合金製半導体リードフレームの製造方法
KR100503038B1 (ko) 반도체 팩키지용 리드 프레임
JPH11220084A (ja) リードフレーム
JPH09102574A (ja) 樹脂密着性および打ち抜き性に優れたリードフレーム材およびその製造方法
JPH1197577A (ja) 半導体装置用ステムの製造方法

Legal Events

Date Code Title Description
S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313532

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313115

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071222

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081222

Year of fee payment: 8

LAPS Cancellation because of no payment of annual fees