HK1012487A1 - Lead frame for electroacoustic transducer and electroacoustic transducer - Google Patents

Lead frame for electroacoustic transducer and electroacoustic transducer

Info

Publication number
HK1012487A1
HK1012487A1 HK98113341A HK98113341A HK1012487A1 HK 1012487 A1 HK1012487 A1 HK 1012487A1 HK 98113341 A HK98113341 A HK 98113341A HK 98113341 A HK98113341 A HK 98113341A HK 1012487 A1 HK1012487 A1 HK 1012487A1
Authority
HK
Hong Kong
Prior art keywords
electroacoustic transducer
lead frame
electroacoustic
transducer
lead
Prior art date
Application number
HK98113341A
Inventor
Takahiro Sone
Jun Ono
Masayoshi Kubo
Kazushi Suzuki
Original Assignee
Star Mfg Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Star Mfg Co filed Critical Star Mfg Co
Publication of HK1012487A1 publication Critical patent/HK1012487A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H01R4/024—Soldered or welded connections between cables or wires and terminals comprising preapplied solder
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
HK98113341A 1995-09-07 1998-12-14 Lead frame for electroacoustic transducer and electroacoustic transducer HK1012487A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22995495 1995-09-07
JP07254090A JP3142754B2 (en) 1995-09-07 1995-09-29 Lead frame for electroacoustic transducer

Publications (1)

Publication Number Publication Date
HK1012487A1 true HK1012487A1 (en) 1999-07-30

Family

ID=26529078

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98113341A HK1012487A1 (en) 1995-09-07 1998-12-14 Lead frame for electroacoustic transducer and electroacoustic transducer

Country Status (4)

Country Link
EP (1) EP0762800B1 (en)
JP (1) JP3142754B2 (en)
DE (1) DE69601021T2 (en)
HK (1) HK1012487A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI109075B (en) * 1998-10-05 2002-05-15 Nokia Corp Method of mounting the base of an acoustic transducer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5914658A (en) * 1982-07-16 1984-01-25 Hitachi Cable Ltd Lead frame for semiconductor
JPS59168660A (en) * 1983-03-15 1984-09-22 Hitachi Cable Ltd Lead frame for semiconductor
JPH0611904B2 (en) * 1986-12-04 1994-02-16 株式会社神戸製鋼所 High-strength, high-conductivity copper alloy manufacturing method
JPH01109756A (en) * 1987-10-23 1989-04-26 Kobe Steel Ltd Lead frame for semiconductor device
JP2790421B2 (en) * 1993-10-25 1998-08-27 スター精密株式会社 Electroacoustic transducer and method of manufacturing the same

Also Published As

Publication number Publication date
EP0762800A3 (en) 1997-04-23
EP0762800A2 (en) 1997-03-12
JP3142754B2 (en) 2001-03-07
DE69601021D1 (en) 1999-01-07
JPH09135492A (en) 1997-05-20
DE69601021T2 (en) 1999-06-10
EP0762800B1 (en) 1998-11-25

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)