EP0762800A3 - - Google Patents

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Publication number
EP0762800A3
EP0762800A3 EP96306415A EP96306415A EP0762800A3 EP 0762800 A3 EP0762800 A3 EP 0762800A3 EP 96306415 A EP96306415 A EP 96306415A EP 96306415 A EP96306415 A EP 96306415A EP 0762800 A3 EP0762800 A3 EP 0762800A3
Authority
EP
European Patent Office
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP96306415A
Other versions
EP0762800B1 (en
EP0762800A2 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Star Micronics Co Ltd
Original Assignee
Star Micronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP22995495 priority Critical
Priority to JP229954/95 priority
Priority to JP07254090A priority patent/JP3142754B2/en
Priority to JP254090/95 priority
Application filed by Star Micronics Co Ltd filed Critical Star Micronics Co Ltd
Publication of EP0762800A2 publication Critical patent/EP0762800A2/en
Publication of EP0762800A3 publication Critical patent/EP0762800A3/en
Application granted granted Critical
Publication of EP0762800B1 publication Critical patent/EP0762800B1/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • H01R4/023Soldered or welded connections between cables or wires and terminals
    • H01R4/024Soldered or welded connections between cables or wires and terminals comprising preapplied solder
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/06Arranging circuit leads; Relieving strain on circuit leads
EP19960306415 1995-09-07 1996-09-04 Lead frame for electroacoustic transducer and electroacoustic transducer Expired - Lifetime EP0762800B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP22995495 1995-09-07
JP229954/95 1995-09-07
JP07254090A JP3142754B2 (en) 1995-09-07 1995-09-29 Electro-acoustic transducer lead frame
JP254090/95 1995-09-29

Publications (3)

Publication Number Publication Date
EP0762800A2 EP0762800A2 (en) 1997-03-12
EP0762800A3 true EP0762800A3 (en) 1997-04-23
EP0762800B1 EP0762800B1 (en) 1998-11-25

Family

ID=26529078

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19960306415 Expired - Lifetime EP0762800B1 (en) 1995-09-07 1996-09-04 Lead frame for electroacoustic transducer and electroacoustic transducer

Country Status (4)

Country Link
EP (1) EP0762800B1 (en)
JP (1) JP3142754B2 (en)
DE (2) DE69601021D1 (en)
HK (1) HK1012487A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI109075B (en) * 1998-10-05 2002-05-15 Nokia Corp Method of mounting the base of an acoustic transducer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5914658A (en) * 1982-07-16 1984-01-25 Hitachi Cable Ltd Lead frame for semiconductor
JPS59168660A (en) * 1983-03-15 1984-09-22 Hitachi Cable Ltd Lead frame for semiconductor
JPS63143246A (en) * 1986-12-04 1988-06-15 Kobe Steel Ltd Production of high tension high conductivity copper alloy
JPH01109756A (en) * 1987-10-23 1989-04-26 Kobe Steel Ltd Lead frame for semiconductor device
EP0650308A1 (en) * 1993-10-25 1995-04-26 Star Micronics Co., Ltd. Electroacoustic transducer and method of fabricating the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5914658A (en) * 1982-07-16 1984-01-25 Hitachi Cable Ltd Lead frame for semiconductor
JPS59168660A (en) * 1983-03-15 1984-09-22 Hitachi Cable Ltd Lead frame for semiconductor
JPS63143246A (en) * 1986-12-04 1988-06-15 Kobe Steel Ltd Production of high tension high conductivity copper alloy
JPH01109756A (en) * 1987-10-23 1989-04-26 Kobe Steel Ltd Lead frame for semiconductor device
EP0650308A1 (en) * 1993-10-25 1995-04-26 Star Micronics Co., Ltd. Electroacoustic transducer and method of fabricating the same

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 008, no. 095 (E - 242) 2 May 1984 (1984-05-02) *
PATENT ABSTRACTS OF JAPAN vol. 009, no. 019 (E - 292) 25 January 1985 (1985-01-25) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 398 (C - 538) 21 October 1988 (1988-10-21) *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 350 (E - 800) 7 August 1989 (1989-08-07) *
R.SCHETTY: "Outer Lead Plating Process Protects Solderability", ELECTRONIC PACKAGING AND PACKAGING, vol. 34, no. 2, February 1994 (1994-02-01), NEWTON, MASS., US, pages 114 - 116, XP000430271 *

Also Published As

Publication number Publication date
EP0762800A2 (en) 1997-03-12
EP0762800B1 (en) 1998-11-25
JP3142754B2 (en) 2001-03-07
HK1012487A1 (en) 2000-04-28
DE69601021D1 (en) 1999-01-07
JPH09135492A (en) 1997-05-20
DE69601021T2 (en) 1999-06-10

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