DE69601021T2 - Anschlussrahmen für elektroakustische Wandler und elektroakustischer Wandler - Google Patents

Anschlussrahmen für elektroakustische Wandler und elektroakustischer Wandler

Info

Publication number
DE69601021T2
DE69601021T2 DE1996601021 DE69601021T DE69601021T2 DE 69601021 T2 DE69601021 T2 DE 69601021T2 DE 1996601021 DE1996601021 DE 1996601021 DE 69601021 T DE69601021 T DE 69601021T DE 69601021 T2 DE69601021 T2 DE 69601021T2
Authority
DE
Germany
Prior art keywords
lead frame
metal foil
metallization
electroacoustic transducer
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1996601021
Other languages
German (de)
English (en)
Other versions
DE69601021D1 (de
Inventor
Masayoshi C/O Nippon Mining & Metals Co. Ltd Koza-Gun Kanagawa-Ken Kubo
Jun C/O Nippon Mining & Metals Co. Ltd. Minato-Ku Tokyo Ono
Takahiro C/O Star Micronics Co. Ltd Shizuoka-Ken 422 Sone
Kazushi C/O Star Micronics Co. Ltd. Shizuoka-Ken 422 Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Star Micronics Co Ltd
Original Assignee
Star Micronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Star Micronics Co Ltd filed Critical Star Micronics Co Ltd
Application granted granted Critical
Publication of DE69601021D1 publication Critical patent/DE69601021D1/de
Publication of DE69601021T2 publication Critical patent/DE69601021T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H01R4/024—Soldered or welded connections between cables or wires and terminals comprising preapplied solder
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
DE1996601021 1995-09-07 1996-09-04 Anschlussrahmen für elektroakustische Wandler und elektroakustischer Wandler Expired - Fee Related DE69601021T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22995495 1995-09-07
JP07254090A JP3142754B2 (ja) 1995-09-07 1995-09-29 電気音響変換器用リードフレーム

Publications (2)

Publication Number Publication Date
DE69601021D1 DE69601021D1 (de) 1999-01-07
DE69601021T2 true DE69601021T2 (de) 1999-06-10

Family

ID=26529078

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996601021 Expired - Fee Related DE69601021T2 (de) 1995-09-07 1996-09-04 Anschlussrahmen für elektroakustische Wandler und elektroakustischer Wandler

Country Status (3)

Country Link
EP (1) EP0762800B1 (enExample)
JP (1) JP3142754B2 (enExample)
DE (1) DE69601021T2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI109075B (fi) * 1998-10-05 2002-05-15 Nokia Corp Akustisen muuntimen alustan kiinnitysmenetelmä

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5914658A (ja) * 1982-07-16 1984-01-25 Hitachi Cable Ltd 半導体用リ−ドフレ−ム
JPS59168660A (ja) * 1983-03-15 1984-09-22 Hitachi Cable Ltd 半導体用リ−ドフレ−ム
JPH0611904B2 (ja) * 1986-12-04 1994-02-16 株式会社神戸製鋼所 高力、高導電性銅合金の製造方法
JPH01109756A (ja) * 1987-10-23 1989-04-26 Kobe Steel Ltd 半導体装置用リードフレーム
JP2790421B2 (ja) * 1993-10-25 1998-08-27 スター精密株式会社 電気音響変換器及びその製造方法
JP3125396U (ja) 2006-03-14 2006-09-21 琢磨 藤原 ノート型パソコン台

Also Published As

Publication number Publication date
EP0762800B1 (en) 1998-11-25
HK1012487A1 (en) 1999-07-30
JPH09135492A (ja) 1997-05-20
DE69601021D1 (de) 1999-01-07
EP0762800A2 (en) 1997-03-12
EP0762800A3 (enExample) 1997-04-23
JP3142754B2 (ja) 2001-03-07

Similar Documents

Publication Publication Date Title
DE3401065A1 (de) Kupferlegierungen mit verbesserter loetfaehigkeits-haltbarkeit
DE60200154T2 (de) Metallischer Gegenstand mit mehrlagigem Belag
DE60015686T2 (de) Beschichteter Metallartikel mit mehrlagiger Oberflächenbeschichtung für Porositätsverminderung
DE602004012910T2 (de) Kupferfolie für gedruckte Leiterplatten mit feinen Strukturen und Herstellungsverfahren
DE3330068C2 (enExample)
DE19640256B4 (de) Anschlußrahmen, Verfahren zur Edelmetallplattierung des Anschlußrahmens und Halbleitereinrichtung mit Anschlußrahmen
DE102005063554B4 (de) Rechteckiger Leiter für eine Solarbatterie, Verfahren zu dessen Herstellung, Zuleitung für eine Solarbatterie, Solarbatterie und Solarmodul
DE69830701T2 (de) Verfahren zur Herstellung eines verkupferten Aluminium Drahts
DE4414729C2 (de) Werkstoff für die Herstellung eines Leiterrahmens und Leierrahmen für Halbleiterbauelemente
DE69705262T2 (de) Verfahren zur Beschichtung eines Gegenstandes mit einer konformen Nickelbeschichtung
DE10125586B4 (de) Kupferlegierung zur Verwendung in elektrischen und elektronischen Teilen
DE102006017042B4 (de) Zuleitungsrahmen für ein Halbleiterbauteil
DE10152203B4 (de) Elektrolytkondensator und Herstellung desselben
DE69023858T2 (de) Integrierte Schaltungsanordnung mit verbesserten Verbindungen zwischen den Steckerstiften und den Halbleitermaterial-Chips.
DE3429393A1 (de) Kupferlegierung mit hoher festigkeit und hoher leitfaehigkeit
DE4311872C2 (de) Leiterrahmen für integrierte Schaltungen
DE3634495A1 (de) Kupferlegierung und verfahren zu ihrer herstellung
DE102010012609A1 (de) Sn-plattiertes Kupfer oder Sn-plattierte Kupferlegierung mit hervorragender Wärmebeständigkeit und Herstellungsverfahren dafür
DE69215377T2 (de) Aufschmeltzlötsverfahren zum bilden von einem löthocker auf einer printplatte
DE3016132A1 (de) Verfahren zur herstellung von gegen hitzeschockeinwirkung widerstandsfaehigen gedruckten schaltungen
DE69133422T2 (de) Leiterrahmen und diesen verwendende halbleiter verpackung
DE2509912A1 (de) Elektronische duennfilmschaltung
DE19681566B3 (de) Kupferlegierungsfolien für flexible Stromwege
DE3530736C2 (enExample)
DE69823713T2 (de) Legierungen auf Kupferbasis sowie Anschlusselementen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee