JP3118739B2 - 洗浄装置 - Google Patents

洗浄装置

Info

Publication number
JP3118739B2
JP3118739B2 JP04358224A JP35822492A JP3118739B2 JP 3118739 B2 JP3118739 B2 JP 3118739B2 JP 04358224 A JP04358224 A JP 04358224A JP 35822492 A JP35822492 A JP 35822492A JP 3118739 B2 JP3118739 B2 JP 3118739B2
Authority
JP
Japan
Prior art keywords
processing
flow
processed
holes
flow holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP04358224A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06204199A (ja
Inventor
賢治 横溝
智早 田島
栄一 向井
儀幸 本田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP04358224A priority Critical patent/JP3118739B2/ja
Priority to US08/172,419 priority patent/US5503171A/en
Priority to KR1019930030041A priority patent/KR100306087B1/ko
Priority to TW082111074A priority patent/TW238401B/zh
Publication of JPH06204199A publication Critical patent/JPH06204199A/ja
Priority to KR1019980017969A priority patent/KR19990066687A/ko
Priority to KR1019980017968A priority patent/KR19990066686A/ko
Application granted granted Critical
Publication of JP3118739B2 publication Critical patent/JP3118739B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
JP04358224A 1992-12-26 1992-12-26 洗浄装置 Expired - Fee Related JP3118739B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP04358224A JP3118739B2 (ja) 1992-12-26 1992-12-26 洗浄装置
US08/172,419 US5503171A (en) 1992-12-26 1993-12-22 Substrates-washing apparatus
KR1019930030041A KR100306087B1 (ko) 1992-12-26 1993-12-27 세정장치
TW082111074A TW238401B (ca) 1992-12-26 1993-12-28
KR1019980017969A KR19990066687A (ko) 1992-12-26 1998-05-19 세정장치
KR1019980017968A KR19990066686A (ko) 1992-12-26 1998-05-19 세정처리장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04358224A JP3118739B2 (ja) 1992-12-26 1992-12-26 洗浄装置

Publications (2)

Publication Number Publication Date
JPH06204199A JPH06204199A (ja) 1994-07-22
JP3118739B2 true JP3118739B2 (ja) 2000-12-18

Family

ID=18458186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04358224A Expired - Fee Related JP3118739B2 (ja) 1992-12-26 1992-12-26 洗浄装置

Country Status (3)

Country Link
JP (1) JP3118739B2 (ca)
KR (3) KR100306087B1 (ca)
TW (1) TW238401B (ca)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328481B2 (ja) * 1995-10-13 2002-09-24 東京エレクトロン株式会社 処理方法および装置
KR101425813B1 (ko) * 2012-12-24 2014-08-05 주식회사 케이씨텍 웨이퍼의 침지식 세정 건조 장치
KR102137876B1 (ko) * 2018-08-29 2020-08-13 이한주 개폐식 기판 처리 장치 및 기판 처리 방법

Also Published As

Publication number Publication date
KR19990066686A (ko) 1999-08-16
KR19990066687A (ko) 1999-08-16
KR940016548A (ko) 1994-07-23
JPH06204199A (ja) 1994-07-22
TW238401B (ca) 1995-01-11
KR100306087B1 (ko) 2001-11-30

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