JP2937785B2 - 実装機の部品状態検出装置 - Google Patents

実装機の部品状態検出装置

Info

Publication number
JP2937785B2
JP2937785B2 JP7016180A JP1618095A JP2937785B2 JP 2937785 B2 JP2937785 B2 JP 2937785B2 JP 7016180 A JP7016180 A JP 7016180A JP 1618095 A JP1618095 A JP 1618095A JP 2937785 B2 JP2937785 B2 JP 2937785B2
Authority
JP
Japan
Prior art keywords
component
unit
nozzle member
suction
light beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7016180A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08213800A (ja
Inventor
和久 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP7016180A priority Critical patent/JP2937785B2/ja
Priority to US08/593,496 priority patent/US5724722A/en
Priority to DE69608322T priority patent/DE69608322T2/de
Priority to EP96101349A priority patent/EP0725560B1/en
Publication of JPH08213800A publication Critical patent/JPH08213800A/ja
Application granted granted Critical
Publication of JP2937785B2 publication Critical patent/JP2937785B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/70—Structural association with built-in electrical component with built-in switch
    • H01R13/713—Structural association with built-in electrical component with built-in switch the switch being a safety switch
    • H01R13/7137—Structural association with built-in electrical component with built-in switch the switch being a safety switch with thermal interrupter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP7016180A 1995-02-02 1995-02-02 実装機の部品状態検出装置 Expired - Lifetime JP2937785B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP7016180A JP2937785B2 (ja) 1995-02-02 1995-02-02 実装機の部品状態検出装置
US08/593,496 US5724722A (en) 1995-02-02 1996-01-30 Part state detecting device for mounter
DE69608322T DE69608322T2 (de) 1995-02-02 1996-01-31 Vorrichtung zum Montieren von elektrischen und/oder elektronischen Bauteilen
EP96101349A EP0725560B1 (en) 1995-02-02 1996-01-31 Mounting device for mounting electric and/or electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7016180A JP2937785B2 (ja) 1995-02-02 1995-02-02 実装機の部品状態検出装置

Publications (2)

Publication Number Publication Date
JPH08213800A JPH08213800A (ja) 1996-08-20
JP2937785B2 true JP2937785B2 (ja) 1999-08-23

Family

ID=11909323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7016180A Expired - Lifetime JP2937785B2 (ja) 1995-02-02 1995-02-02 実装機の部品状態検出装置

Country Status (4)

Country Link
US (1) US5724722A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0725560B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2937785B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE69608322T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021166179A1 (ja) * 2020-02-20 2021-08-26 株式会社Ｆｕｊｉ 部品実装機および部品実装システム

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JP3402876B2 (ja) * 1995-10-04 2003-05-06 ヤマハ発動機株式会社 表面実装機
JPH09139961A (ja) * 1995-11-14 1997-05-27 Fujitsu Ltd 自動回線分配装置
SG52900A1 (en) * 1996-01-08 1998-09-28 Matsushita Electric Ind Co Ltd Mounting apparatus of electronic components and mounting methods of the same
BE1010707A3 (nl) * 1996-10-23 1998-12-01 Framatome Connectors Belgium Werkwijze voor het indrukken van een elektrische contactpen met een elastische bevestigingszone in een gat van een bedrukte schakelplaat.
JPH10282172A (ja) * 1997-04-07 1998-10-23 Alps Electric Co Ltd 電子機器、並びにその電子機器の測定方法
JP3907786B2 (ja) * 1997-06-16 2007-04-18 松下電器産業株式会社 電子部品実装方法及び装置
US5953812A (en) * 1997-07-03 1999-09-21 Schlumberger Technologies, Inc. Misinsert sensing in pick and place tooling
US6480223B1 (en) * 1997-09-30 2002-11-12 Siemens Aktiengesellschaft Method and device for detecting the position of terminals and/or edge of components
US6359694B1 (en) 1997-11-10 2002-03-19 Siemens Aktiengesellschaft Method and device for identifying the position of an electrical component or terminals thereof, and equipping head employing same
US6100922A (en) * 1998-06-23 2000-08-08 Juki Corporation Apparatus for recognizing an electronic component
JP3659003B2 (ja) * 1998-07-03 2005-06-15 松下電器産業株式会社 電子部品実装方法
DE19982498T1 (de) 1998-11-05 2001-02-22 Cyberoptics Corp Elektronikmontagevorrichtung mit verbessertem Bilderzeugungssystem
US6587743B1 (en) * 1999-01-29 2003-07-01 B P Microsystems, Inc. Pick and place teaching method and apparatus for implementing the same
US6538244B1 (en) 1999-11-03 2003-03-25 Cyberoptics Corporation Pick and place machine with improved vision system including a linescan sensor
US6535291B1 (en) 2000-06-07 2003-03-18 Cyberoptics Corporation Calibration methods for placement machines incorporating on-head linescan sensing
SG112893A1 (en) * 2000-08-22 2005-07-28 Matsushita Electric Ind Co Ltd Component mounting apparatus and method
US6762847B2 (en) * 2001-01-22 2004-07-13 Cyberoptics Corporation Laser align sensor with sequencing light sources
US6909515B2 (en) 2001-01-22 2005-06-21 Cyberoptics Corporation Multiple source alignment sensor with improved optics
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
KR20030097121A (ko) * 2002-06-19 2003-12-31 삼성테크윈 주식회사 부품 실장기용 위치인식장치
JP4147923B2 (ja) * 2002-12-03 2008-09-10 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
US7614144B2 (en) * 2003-05-13 2009-11-10 Panasonic Corporation Component mounting apparatus
JP4244696B2 (ja) * 2003-05-13 2009-03-25 パナソニック株式会社 部品実装機
JP3848299B2 (ja) * 2003-05-28 2006-11-22 Ｔｄｋ株式会社 ワーク保持装置
KR100625743B1 (ko) * 2003-06-13 2006-09-20 윈텍 주식회사 전자부품 검사를 위한 장치 및 방법
KR20060073542A (ko) * 2003-07-03 2006-06-28 아셈블레온 엔. 브이. 부품 배치 장치
JP4381764B2 (ja) * 2003-09-29 2009-12-09 ヤマハ発動機株式会社 撮像装置及び同装置を搭載した被撮像物移動装置
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
JP4249120B2 (ja) * 2004-11-30 2009-04-02 富士通株式会社 加圧装置および回路チップ実装装置
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
DE112006002473T5 (de) * 2005-09-14 2008-08-14 Cyberoptics Corp., Golden Valley Bestückungsmaschine mit verbesserter Bauteil-Aufnahmebild-Identifizierungsverarbeitung
US20070130755A1 (en) * 2005-10-31 2007-06-14 Duquette David W Electronics assembly machine with embedded solder paste inspection
US20070276867A1 (en) * 2006-05-23 2007-11-29 David Fishbaine Embedded inspection image archival for electronics assembly machines
MX352605B (es) * 2006-06-28 2017-11-29 Monsanto Tech Llc Star Sistema y método para clasificar objetos pequeños.
JP4805755B2 (ja) * 2006-08-31 2011-11-02 矢崎総業株式会社 絶縁体合体装置
JP4791296B2 (ja) * 2006-08-31 2011-10-12 矢崎総業株式会社 絶縁体合体装置
ATE549129T1 (de) 2007-04-26 2012-03-15 Adept Technology Inc Vakuumgreifvorrichtung
CN101836525B (zh) * 2007-11-06 2012-08-29 松下电器产业株式会社 零件安装机、零件装配头及零件装配方法
CN103604807A (zh) * 2013-12-05 2014-02-26 无锡市同步电子制造有限公司 一种自动光学检测机用pcb板定位工装
US9523570B2 (en) 2013-12-20 2016-12-20 Nike, Inc. Pick-up tool with integrated light source
CN109520937A (zh) * 2017-09-20 2019-03-26 梭特科技股份有限公司 玻璃光学检测移载设备
JPWO2021044688A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2019-09-02 2021-03-11
JP7676941B2 (ja) * 2021-05-19 2025-05-15 日本電気硝子株式会社 微小物体の検査方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2599510B2 (ja) * 1991-03-28 1997-04-09 松下電器産業株式会社 部品装着機
US5377405A (en) * 1992-07-01 1995-01-03 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and an apparatus therefor
JP2554431B2 (ja) * 1992-11-05 1996-11-13 ヤマハ発動機株式会社 実装機の部品吸着状態検出装置
JP2816787B2 (ja) * 1992-11-09 1998-10-27 ヤマハ発動機株式会社 実装機の吸着ノズル制御装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021166179A1 (ja) * 2020-02-20 2021-08-26 株式会社Ｆｕｊｉ 部品実装機および部品実装システム
JPWO2021166179A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2020-02-20 2021-08-26
JP7440606B2 (ja) 2020-02-20 2024-02-28 株式会社Fuji 部品実装機および部品実装システム
US12052826B2 (en) 2020-02-20 2024-07-30 Fuji Corporation Component mounting machine and component mounting system

Also Published As

Publication number Publication date
DE69608322D1 (de) 2000-06-21
US5724722A (en) 1998-03-10
EP0725560A3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-09-04
JPH08213800A (ja) 1996-08-20
EP0725560A2 (en) 1996-08-07
DE69608322T2 (de) 2000-09-14
EP0725560B1 (en) 2000-05-17

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