JP2831853B2 - Ｉｃの位置決め装置 - Google Patents

Ｉｃの位置決め装置

Info

Publication number
JP2831853B2
JP2831853B2 JP7526251A JP52625195A JP2831853B2 JP 2831853 B2 JP2831853 B2 JP 2831853B2 JP 7526251 A JP7526251 A JP 7526251A JP 52625195 A JP52625195 A JP 52625195A JP 2831853 B2 JP2831853 B2 JP 2831853B2
Authority
JP
Japan
Prior art keywords
positioning
arms
base
positioning device
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7526251A
Other languages
English (en)
Japanese (ja)
Inventor
敏雄 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP7526251A priority Critical patent/JP2831853B2/ja
Application granted granted Critical
Publication of JP2831853B2 publication Critical patent/JP2831853B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP7526251A 1994-08-31 1995-08-30 Ｉｃの位置決め装置 Expired - Fee Related JP2831853B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7526251A JP2831853B2 (ja) 1994-08-31 1995-08-30 Ｉｃの位置決め装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23066994 1994-08-31
JP6-230669 1994-08-31
JP7526251A JP2831853B2 (ja) 1994-08-31 1995-08-30 Ｉｃの位置決め装置

Publications (1)

Publication Number Publication Date
JP2831853B2 true JP2831853B2 (ja) 1998-12-02

Family

ID=16911450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7526251A Expired - Fee Related JP2831853B2 (ja) 1994-08-31 1995-08-30 Ｉｃの位置決め装置

Country Status (6)

Country Link
JP (1) JP2831853B2 (de)
KR (1) KR0171485B1 (de)
CN (1) CN1126529A (de)
DE (1) DE19580944C2 (de)
MY (1) MY131968A (de)
WO (1) WO1996007201A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10358691B4 (de) 2003-12-15 2012-06-21 Qimonda Ag Verfahren zum Beladen einer Sockel-Einrichtung mit einem entsprechenden Halbleiter-Bauelement
DE10359648B4 (de) 2003-12-18 2013-05-16 Qimonda Ag Sockel-Einrichtung zur Verwendung beim Test von Halbleiter-Bauelementen, sowie Vorrichtung und Verfahren zum Beladen einer Sockel-Einrichtung mit einem entsprechenden Halbleiter-Bauelement
DE102005033870A1 (de) * 2005-07-20 2007-01-25 Robert Bosch Gmbh Vorrichtung zum Entfernen eines Produkts
DE102007022690B4 (de) * 2007-05-11 2010-11-18 Multitest Elektronische Systeme Gmbh Zentriervorrichtung für elektronische Bauelemente
CN102795363B (zh) * 2012-08-24 2015-04-08 深圳市华腾半导体设备有限公司 一种元器件定位方法及定位装置
CN105300333A (zh) * 2015-11-24 2016-02-03 杭州士兰微电子股份有限公司 芯片测试机、芯片测试机的监控装置及监控方法
JP2020034368A (ja) * 2018-08-29 2020-03-05 セイコーエプソン株式会社 電子部品搬送装置、電子部品搬送用ユニットおよび電子部品検査装置
CN114074204B (zh) * 2022-01-19 2022-05-20 深圳市恒讯通电子有限公司 一种电路板加工用智能调试定位机构

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6375905A (ja) * 1986-09-19 1988-04-06 Hitachi Ltd 部品の位置決め装置
DD300993A7 (de) * 1989-02-20 1992-09-17 Halbleiterwerk Frankfurt Gmbh Anordnung zur lagepositionierung und zum andruecken von gehaeusen

Also Published As

Publication number Publication date
KR0171485B1 (ko) 1999-03-30
WO1996007201A1 (fr) 1996-03-07
CN1126529A (zh) 1996-07-10
DE19580944T1 (de) 1998-01-22
MY131968A (en) 2007-09-28
DE19580944C2 (de) 1999-07-29

Similar Documents

Publication Publication Date Title
US4940935A (en) Automatic SMD tester
US6573739B1 (en) IC testing apparatus
WO1997005495A1 (fr) Testeur de dispositif a semi-conducteurs
JP4018254B2 (ja) 電子部品の試験方法
WO2004011952A1 (ja) 電子部品試験装置
WO2004109305A1 (ja) 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法
US5151651A (en) Apparatus for testing IC elements
JP2831853B2 (ja) Ｉｃの位置決め装置
JP2003066104A (ja) インサートおよびこれを備えた電子部品ハンドリング装置
TWI787250B (zh) 電子元件測試裝置用之載具
JP4279413B2 (ja) 電子部品試験装置用インサート
JP4222442B2 (ja) 電子部品試験装置用インサート
US20080252317A1 (en) Apparatus for testing system-in-package devices
TWI387769B (zh) 用於檢測微型ｓｄ裝置之方法
JP2940858B2 (ja) Ｉｃ試験装置
WO1996011392A1 (fr) Automate programmable et son procede de mise en application dans la mesure de dispositifs
TWI387761B (zh) 用於檢測微型ｓｄ裝置的方法
TWI381178B (zh) Electronic component processing device and electronic component location detection method
KR100714754B1 (ko) 전자부품 시험장치
US7489155B2 (en) Method for testing plurality of system-in-package devices using plurality of test circuits
WO2002056040A1 (en) Pusher and electronic part tester with the pusher
US20080252321A1 (en) Apparatus for testing micro SD devices
TWI384242B (zh) 用於檢測系統整合型封裝裝置的方法
JP2003028924A (ja) 電子部品ハンドリング装置および電子部品の温度制御方法
JPH0329335A (ja) 半導体チッププローバ

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees