JP2562773Y2 - 半導体集積回路素子 - Google Patents
半導体集積回路素子Info
- Publication number
- JP2562773Y2 JP2562773Y2 JP1989040421U JP4042189U JP2562773Y2 JP 2562773 Y2 JP2562773 Y2 JP 2562773Y2 JP 1989040421 U JP1989040421 U JP 1989040421U JP 4042189 U JP4042189 U JP 4042189U JP 2562773 Y2 JP2562773 Y2 JP 2562773Y2
- Authority
- JP
- Japan
- Prior art keywords
- tab
- package
- integrated circuit
- leads
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989040421U JP2562773Y2 (ja) | 1989-04-05 | 1989-04-05 | 半導体集積回路素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989040421U JP2562773Y2 (ja) | 1989-04-05 | 1989-04-05 | 半導体集積回路素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02131357U JPH02131357U (ko) | 1990-10-31 |
JP2562773Y2 true JP2562773Y2 (ja) | 1998-02-16 |
Family
ID=31550196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989040421U Expired - Lifetime JP2562773Y2 (ja) | 1989-04-05 | 1989-04-05 | 半導体集積回路素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2562773Y2 (ko) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6011462B2 (ja) * | 1977-01-31 | 1985-03-26 | 日本電気株式会社 | 半導体装置 |
JPS61194859A (ja) * | 1985-02-25 | 1986-08-29 | Hitachi Hokkai Semiconductor Kk | リ−ドフレ−ム |
-
1989
- 1989-04-05 JP JP1989040421U patent/JP2562773Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02131357U (ko) | 1990-10-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5936249U (ja) | 少くとも1つの集積回路デバイスのためのフラツト・パツケ−ジ | |
JP2002043503A (ja) | 半導体装置 | |
JPH064595Y2 (ja) | ハイブリッドic | |
JPH04307943A (ja) | 半導体装置 | |
JP2562773Y2 (ja) | 半導体集積回路素子 | |
JPS61258458A (ja) | 樹脂封止ic | |
JPS5895657U (ja) | 集積回路用リ−ドフレ−ム | |
JP2982182B2 (ja) | 樹脂封止型半導体装置 | |
JP2661115B2 (ja) | Icカード | |
JPH0666351B2 (ja) | 半導体集積回路 | |
JP2507855B2 (ja) | 半導体装置 | |
JP2587722Y2 (ja) | 半導体装置 | |
JPH02153557A (ja) | 樹脂封止型半導体装置 | |
JP3248117B2 (ja) | 半導体装置 | |
JPS635250Y2 (ko) | ||
JP2581278B2 (ja) | 半導体装置 | |
JPH11219969A (ja) | 半導体装置 | |
JP2514430Y2 (ja) | ハイブリッドic | |
JPH077023A (ja) | 樹脂封止型半導体装置 | |
JPH0442942Y2 (ko) | ||
JPH06326235A (ja) | 半導体装置 | |
JPS60101938A (ja) | 半導体装置 | |
JPS6120780Y2 (ko) | ||
JPH0637234A (ja) | 半導体装置 | |
JPH0560662B2 (ko) |