JP2562773Y2 - Semiconductor integrated circuit device - Google Patents

Description

The present invention relates to a semiconductor integrated circuit device in which a semiconductor pellet is sealed in an insulator package.

(B) Conventional technology In recent years, in response to the demand for miniaturization of electronic devices on which semiconductor integrated circuit devices are mounted, the number of external leads of the devices has been reduced. As a method of reducing the number of leads, it is general to use some leads in common. In this case, since it is necessary to connect two or more bonding pads to one lead, various methods have been considered.

FIG. 2 is a plan view of a semiconductor integrated circuit device in which internal wiring is provided in a package for connecting two or more bonding pads to one lead. A semiconductor pellet (1) containing an integrated circuit includes a bonding pad (2) along two opposing sides, and a bonding wire (3) is connected to the bonding pad (2).
Further, the semiconductor pellet (1) is held at the tab (4) and arranged at the center of the device. At the periphery of the tab (4), internal leads (5) are arranged so that the tips are along the bonding pads (2), and the bonding wires (3) are connected to the tips. Internal lead (5)
Is directly connected to the external lead (6), and the external lead (6) is held by the outer frame member (7). These semiconductor pellets (1), tabs (4) and internal leads (5)
Are sealed in a ceramic package (8).
The projections (9) provided on both sides of the tab (4)
Are used for fixing and positioning when the element is mounted on an electronic device or the like.

By the way, the connection between the bonding pad (2) and the internal lead (5) is normally made directly by the bonding wire (3), but when connecting from two bonding pads to one internal lead, Alternatively, when a specific bonding pad is connected to the internal lead across the semiconductor pellet (1), it is difficult to directly connect the two, so that the internal wiring (10) provided in the package (8) is The bonding pad and the internal lead are connected through the connection. That is, the internal wiring (10) is insulated from the tab (4) inside the package (8) in the insulated state.
And a bonding wire (3) from the bonding pad (2) to the internal wiring (10).
Are connected, and a bonding wire (3) is connected to the internal lead (5) from the internal wiring (3). Therefore, connection from the internal leads to the bonding pads on the opposite side of the semiconductor pellet (1) and connection from one internal lead to the two bonding pads become possible.

(C) Problems to be Solved by the Invention However, in the semiconductor integrated circuit device as described above, the internal wiring (10) is formed in advance in the package (8), and the internal wiring (10) and the tab (4) are formed. ), It is necessary to adopt a laminated structure in order to prevent a short circuit, and the cost of the package increases. Further, the number of connection points due to the bonding wire (3) increases, which leads to an increase in manufacturing cost.

On the other hand, a cerdip package having an opening as represented by a CCD solid-state imaging device, or a resin mold package sealed with a resin is difficult to adopt the above-described laminated structure, It has been practically impossible to provide internal wiring for the elements of the cerdip package or the resin mold package.

(D) Means for Solving the Problem The present invention has been made to solve the above-mentioned problem, and a plurality of bonding pads at least face each other.
A semiconductor pellet arranged along the side, a rectangular tab supporting the semiconductor pellet, a plurality of leads arranged around the tab, and a bonding pad connecting the bonding pad and the lead; A semiconductor integrated circuit device sealed in an insulating package, wherein at least one of the plurality of leads is provided.
First, the tip is extended to the side of the opposite side along the outer periphery of the tab, and the bonding wire is connected to the extended tip.

(E) Function According to the present invention, a bonding wire is connected to a lead extended to the opposite side along the outer periphery of the tab to obtain a connection between the bonding pad and the lead.
The bonding pad is connected to the lead on the opposite side so as to avoid the semiconductor pellet, and two or more bonding pads are connected to one lead.

(F) Embodiment One embodiment of the present invention will be described with reference to the drawings.

 FIG. 1 is a plan view of the semiconductor integrated circuit device of the present invention.

The semiconductor pellet (11) contains an integrated circuit as in FIG. 2, and a plurality of bonding pads (12) are arranged along two opposing sides. This semiconductor pellet (11)
Is held on the tab (14) and is disposed substantially at the center of the element. The internal leads (15) are arranged along the bonding pads (12) around the tabs (14),
The internal lead (15) connected to the opposing bonding pad is extended to the opposing side along the outer periphery of the tab (14). This internal lead (15)
Are provided at a fixed distance from the tab (14), and are provided in multiples according to the number of internal leads connected to the opposing bonding pads. (2 in the figure
In addition, the tip of the internal lead (15) extends to the vicinity of the bonding pad to be connected, so that the bonding wires (13) do not alternately or contact with each other. It is configured. At this time, another internal lead (extends to the opposite side)
Are bent so as to avoid the tips of the adjacent internal leads as necessary as shown in FIG.

Then, the internal lead (15) is used as is for the external lead (1
Continuing with 6), the external leads (16) are held by the outer frame member (17) in the same manner as in FIG.
The tab (14) and the internal lead (15) are sealed in a ceramic package (18). Further, a projection (19) for fixing and positioning the element when mounting the element on an electronic device or the like is provided on the outer internal lead (15) extending around the outer periphery of the tab (14). ing.

In the semiconductor integrated circuit device as described above, after the tab (14) and the internal lead (15) are sealed in a ceramic package, the external lead (16) is separated from the outer frame member (17), and the external lead (16) is further cut off. ) Is folded along the package (18).

In the present embodiment, a ceramic package in which the semiconductor pellet (1) is sealed with ceramic has been exemplified. However, the present invention can also be applied to a cerdip package or a resin mold package.

(G) Effect of the Invention According to the present invention, it is not necessary to provide an internal wiring requiring a laminated structure on the package side, so that the configuration of the package can be simplified and the number of connection points by bonding wires is reduced. Can be expected to reduce costs.

In addition, bonding pads can be connected to the leads on the opposite side even in a sardip package or a resin mold package, which is difficult to form a laminated structure. Wiring can be performed, and the use range of the element can be expanded.

[Brief description of the drawings]

FIG. 1 is a plan view of the semiconductor integrated circuit device of the present invention, and FIG. 2 is a plan view of a conventional semiconductor integrated circuit device. (1) (11) ... semiconductor pellet, (2) (12) ... bonding pad, (3) (13) ... bonding wire, (4) (14) ... tab, (5) (15) ... ... internal lead, (6) (16) ... external lead, (8) (18) ... ceramic package, (10) ... internal wiring.

Claims (2)

(57) [Scope of request for utility model registration] A semiconductor pellet having a plurality of bonding pads arranged along at least two sides facing each other, a rectangular tab for holding the semiconductor pellet, and a plurality of leads arranged on a peripheral portion of the tab. A bonding wire for connecting the bonding pad and the lead, wherein the tab is fixed to the package and the semiconductor pellet is sealed in an insulating package. Independently supported, the plurality of leads are arranged along at least one side of the tab, and at least one of the plurality of leads has a tip extending along an outer periphery of the tab to a side of an opposite side. A positioning projection is formed in the middle of the extension, and the bonding wire is connected to the tip of the extension. Conductor integrated circuit element. 2. The semiconductor integrated circuit device according to claim 1, wherein said package is made of ceramic.