JP2528843Y2 - 発光ダイオード素子の樹脂封止装置 - Google Patents
発光ダイオード素子の樹脂封止装置Info
- Publication number
- JP2528843Y2 JP2528843Y2 JP1987155340U JP15534087U JP2528843Y2 JP 2528843 Y2 JP2528843 Y2 JP 2528843Y2 JP 1987155340 U JP1987155340 U JP 1987155340U JP 15534087 U JP15534087 U JP 15534087U JP 2528843 Y2 JP2528843 Y2 JP 2528843Y2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- resin material
- emitting diode
- diode element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims description 97
- 229920005989 resin Polymers 0.000 title claims description 97
- 238000007789 sealing Methods 0.000 title claims description 26
- 239000000463 material Substances 0.000 claims description 46
- 238000000465 moulding Methods 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 206010066901 Treatment failure Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155340U JP2528843Y2 (ja) | 1987-10-09 | 1987-10-09 | 発光ダイオード素子の樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987155340U JP2528843Y2 (ja) | 1987-10-09 | 1987-10-09 | 発光ダイオード素子の樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0160560U JPH0160560U (enrdf_load_stackoverflow) | 1989-04-17 |
| JP2528843Y2 true JP2528843Y2 (ja) | 1997-03-12 |
Family
ID=31432881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987155340U Expired - Lifetime JP2528843Y2 (ja) | 1987-10-09 | 1987-10-09 | 発光ダイオード素子の樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528843Y2 (enrdf_load_stackoverflow) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5318992A (en) * | 1976-08-05 | 1978-02-21 | Nec Corp | Production of light emitting element |
| JPS61131849A (ja) * | 1984-11-29 | 1986-06-19 | Asahi Kogyosha:Kk | 冷却水循環装置 |
| JP2533475B2 (ja) * | 1985-04-19 | 1996-09-11 | 株式会社日立製作所 | 半導体装置の製造方法 |
| JPS63287045A (ja) * | 1987-05-19 | 1988-11-24 | Sharp Corp | 光半導体装置の製造方法 |
-
1987
- 1987-10-09 JP JP1987155340U patent/JP2528843Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0160560U (enrdf_load_stackoverflow) | 1989-04-17 |
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