JPS5318992A - Production of light emitting element - Google Patents

Production of light emitting element

Info

Publication number
JPS5318992A
JPS5318992A JP9384076A JP9384076A JPS5318992A JP S5318992 A JPS5318992 A JP S5318992A JP 9384076 A JP9384076 A JP 9384076A JP 9384076 A JP9384076 A JP 9384076A JP S5318992 A JPS5318992 A JP S5318992A
Authority
JP
Japan
Prior art keywords
light emitting
production
emitting element
good
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9384076A
Other languages
Japanese (ja)
Inventor
Akinori Numata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9384076A priority Critical patent/JPS5318992A/en
Publication of JPS5318992A publication Critical patent/JPS5318992A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: Light emitting diodes of good appearance are produced with good mass productivity by using transfer-molding-purpose resin.
COPYRIGHT: (C)1978,JPO&Japio
JP9384076A 1976-08-05 1976-08-05 Production of light emitting element Pending JPS5318992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9384076A JPS5318992A (en) 1976-08-05 1976-08-05 Production of light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9384076A JPS5318992A (en) 1976-08-05 1976-08-05 Production of light emitting element

Publications (1)

Publication Number Publication Date
JPS5318992A true JPS5318992A (en) 1978-02-21

Family

ID=14093580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9384076A Pending JPS5318992A (en) 1976-08-05 1976-08-05 Production of light emitting element

Country Status (1)

Country Link
JP (1) JPS5318992A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4590667A (en) * 1984-08-22 1986-05-27 General Instrument Corporation Method and apparatus for assembling semiconductor devices such as LEDs or optodetectors
JPH0160560U (en) * 1987-10-09 1989-04-17

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4590667A (en) * 1984-08-22 1986-05-27 General Instrument Corporation Method and apparatus for assembling semiconductor devices such as LEDs or optodetectors
JPH0160560U (en) * 1987-10-09 1989-04-17

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