JPS5324793A - Production of light emitting diode lamps - Google Patents

Production of light emitting diode lamps

Info

Publication number
JPS5324793A
JPS5324793A JP10087576A JP10087576A JPS5324793A JP S5324793 A JPS5324793 A JP S5324793A JP 10087576 A JP10087576 A JP 10087576A JP 10087576 A JP10087576 A JP 10087576A JP S5324793 A JPS5324793 A JP S5324793A
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
production
diode lamps
lamps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10087576A
Other languages
Japanese (ja)
Inventor
Masaaki Umezaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP10087576A priority Critical patent/JPS5324793A/en
Publication of JPS5324793A publication Critical patent/JPS5324793A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: To produce a micro-lamp by a simple method by securing a pellet of a GaP light emitting diode between lead wires by way of a brazing material and sealing this with transparent epoxy resin.
COPYRIGHT: (C)1978,JPO&Japio
JP10087576A 1976-08-19 1976-08-19 Production of light emitting diode lamps Pending JPS5324793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10087576A JPS5324793A (en) 1976-08-19 1976-08-19 Production of light emitting diode lamps

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10087576A JPS5324793A (en) 1976-08-19 1976-08-19 Production of light emitting diode lamps

Publications (1)

Publication Number Publication Date
JPS5324793A true JPS5324793A (en) 1978-03-07

Family

ID=14285482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10087576A Pending JPS5324793A (en) 1976-08-19 1976-08-19 Production of light emitting diode lamps

Country Status (1)

Country Link
JP (1) JPS5324793A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100090332A1 (en) * 2008-10-09 2010-04-15 Joinset Co., Ltd. Ceramic chip assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100090332A1 (en) * 2008-10-09 2010-04-15 Joinset Co., Ltd. Ceramic chip assembly

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