JP2527562Y2 - 基板接続構造 - Google Patents

基板接続構造

Info

Publication number
JP2527562Y2
JP2527562Y2 JP1990091539U JP9153990U JP2527562Y2 JP 2527562 Y2 JP2527562 Y2 JP 2527562Y2 JP 1990091539 U JP1990091539 U JP 1990091539U JP 9153990 U JP9153990 U JP 9153990U JP 2527562 Y2 JP2527562 Y2 JP 2527562Y2
Authority
JP
Japan
Prior art keywords
substrate
present
connection structure
module substrate
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990091539U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451169U (US07714131-20100511-C00038.png
Inventor
宜司 米本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP1990091539U priority Critical patent/JP2527562Y2/ja
Publication of JPH0451169U publication Critical patent/JPH0451169U/ja
Application granted granted Critical
Publication of JP2527562Y2 publication Critical patent/JP2527562Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
JP1990091539U 1990-09-03 1990-09-03 基板接続構造 Expired - Lifetime JP2527562Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990091539U JP2527562Y2 (ja) 1990-09-03 1990-09-03 基板接続構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990091539U JP2527562Y2 (ja) 1990-09-03 1990-09-03 基板接続構造

Publications (2)

Publication Number Publication Date
JPH0451169U JPH0451169U (US07714131-20100511-C00038.png) 1992-04-30
JP2527562Y2 true JP2527562Y2 (ja) 1997-03-05

Family

ID=31827273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990091539U Expired - Lifetime JP2527562Y2 (ja) 1990-09-03 1990-09-03 基板接続構造

Country Status (1)

Country Link
JP (1) JP2527562Y2 (US07714131-20100511-C00038.png)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224533A (ja) * 1993-01-27 1994-08-12 Ibiden Co Ltd プリント配線板組立体
JPH06260736A (ja) * 1993-03-08 1994-09-16 Nippon Cement Co Ltd Ｉｃモジュ−ルの組立体及びｉｃモジュ−ルの取付け方法
JP2003338673A (ja) * 2002-05-22 2003-11-28 Taiyo Yuden Co Ltd 回路モジュール及びそれを備える電子機器
JP4995527B2 (ja) * 2006-09-28 2012-08-08 日本電波工業株式会社 表面実装用の圧電発振器
JP5443849B2 (ja) * 2009-06-26 2014-03-19 新光電気工業株式会社 半導体装置及びその製造方法
JP6786860B2 (ja) * 2015-12-14 2020-11-18 凸版印刷株式会社 ガラス配線基板及び半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137970U (US07714131-20100511-C00038.png) * 1987-03-02 1988-09-12
JPS63273392A (ja) * 1987-05-01 1988-11-10 Seiko Epson Corp 基板の実装構造
JP2570336B2 (ja) * 1987-11-30 1997-01-08 ソニー株式会社 ハイブリッド集積回路装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
発明協会公開技報公技番号８７−１５８９４

Also Published As

Publication number Publication date
JPH0451169U (US07714131-20100511-C00038.png) 1992-04-30

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