JP2522457Y2 - 表面実装形電子部品 - Google Patents

表面実装形電子部品

Info

Publication number
JP2522457Y2
JP2522457Y2 JP1990107574U JP10757490U JP2522457Y2 JP 2522457 Y2 JP2522457 Y2 JP 2522457Y2 JP 1990107574 U JP1990107574 U JP 1990107574U JP 10757490 U JP10757490 U JP 10757490U JP 2522457 Y2 JP2522457 Y2 JP 2522457Y2
Authority
JP
Japan
Prior art keywords
lead
electronic component
substrate
leads
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990107574U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0465453U (fr
Inventor
健志 池戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP1990107574U priority Critical patent/JP2522457Y2/ja
Publication of JPH0465453U publication Critical patent/JPH0465453U/ja
Application granted granted Critical
Publication of JP2522457Y2 publication Critical patent/JP2522457Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990107574U 1990-10-16 1990-10-16 表面実装形電子部品 Expired - Fee Related JP2522457Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990107574U JP2522457Y2 (ja) 1990-10-16 1990-10-16 表面実装形電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990107574U JP2522457Y2 (ja) 1990-10-16 1990-10-16 表面実装形電子部品

Publications (2)

Publication Number Publication Date
JPH0465453U JPH0465453U (fr) 1992-06-08
JP2522457Y2 true JP2522457Y2 (ja) 1997-01-16

Family

ID=31854162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990107574U Expired - Fee Related JP2522457Y2 (ja) 1990-10-16 1990-10-16 表面実装形電子部品

Country Status (1)

Country Link
JP (1) JP2522457Y2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013222781A (ja) * 2012-04-16 2013-10-28 Sharp Corp 半導体装置のデバイス実装構造

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279154A (ja) * 1985-06-05 1986-12-09 Toshiba Corp 基板実装用電子部品
JPS6367763A (ja) * 1986-09-09 1988-03-26 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPH0465453U (fr) 1992-06-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees