JP2512626Y2 - 樹脂封止形光半導体装置 - Google Patents
樹脂封止形光半導体装置Info
- Publication number
- JP2512626Y2 JP2512626Y2 JP1990086772U JP8677290U JP2512626Y2 JP 2512626 Y2 JP2512626 Y2 JP 2512626Y2 JP 1990086772 U JP1990086772 U JP 1990086772U JP 8677290 U JP8677290 U JP 8677290U JP 2512626 Y2 JP2512626 Y2 JP 2512626Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- wide
- resin
- narrow
- narrow portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 27
- 230000003287 optical effect Effects 0.000 title claims description 11
- 239000011347 resin Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 33
- 239000008393 encapsulating agent Substances 0.000 claims description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 238000007789 sealing Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990086772U JP2512626Y2 (ja) | 1990-08-21 | 1990-08-21 | 樹脂封止形光半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990086772U JP2512626Y2 (ja) | 1990-08-21 | 1990-08-21 | 樹脂封止形光半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0444171U JPH0444171U (enrdf_load_stackoverflow) | 1992-04-15 |
| JP2512626Y2 true JP2512626Y2 (ja) | 1996-10-02 |
Family
ID=31818609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990086772U Expired - Fee Related JP2512626Y2 (ja) | 1990-08-21 | 1990-08-21 | 樹脂封止形光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2512626Y2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003158302A (ja) * | 2001-11-21 | 2003-05-30 | Toyoda Gosei Co Ltd | 発光ダイオード |
| WO2003049207A1 (en) * | 2001-11-16 | 2003-06-12 | Toyoda Gosei Co., Ltd. | Light-emitting diode, led light, and light apparatus |
| JP2007019153A (ja) * | 2005-07-06 | 2007-01-25 | Citizen Electronics Co Ltd | 光リンクデバイス |
| JP5556369B2 (ja) * | 2010-05-25 | 2014-07-23 | 日亜化学工業株式会社 | 発光装置及びそれを用いた表示装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62209Y2 (enrdf_load_stackoverflow) * | 1980-05-26 | 1987-01-07 | ||
| JPH0247070U (enrdf_load_stackoverflow) * | 1988-09-28 | 1990-03-30 |
-
1990
- 1990-08-21 JP JP1990086772U patent/JP2512626Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0444171U (enrdf_load_stackoverflow) | 1992-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |