JP2509351Y2 - 配線基材 - Google Patents

配線基材

Info

Publication number
JP2509351Y2
JP2509351Y2 JP1989128346U JP12834689U JP2509351Y2 JP 2509351 Y2 JP2509351 Y2 JP 2509351Y2 JP 1989128346 U JP1989128346 U JP 1989128346U JP 12834689 U JP12834689 U JP 12834689U JP 2509351 Y2 JP2509351 Y2 JP 2509351Y2
Authority
JP
Japan
Prior art keywords
lead
leads
base material
adjacent
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989128346U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0367433U (da
Inventor
智秀 西畑
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1989128346U priority Critical patent/JP2509351Y2/ja
Publication of JPH0367433U publication Critical patent/JPH0367433U/ja
Application granted granted Critical
Publication of JP2509351Y2 publication Critical patent/JP2509351Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP1989128346U 1989-10-31 1989-10-31 配線基材 Expired - Lifetime JP2509351Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128346U JP2509351Y2 (ja) 1989-10-31 1989-10-31 配線基材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128346U JP2509351Y2 (ja) 1989-10-31 1989-10-31 配線基材

Publications (2)

Publication Number Publication Date
JPH0367433U JPH0367433U (da) 1991-07-01
JP2509351Y2 true JP2509351Y2 (ja) 1996-09-04

Family

ID=31676058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128346U Expired - Lifetime JP2509351Y2 (ja) 1989-10-31 1989-10-31 配線基材

Country Status (1)

Country Link
JP (1) JP2509351Y2 (da)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025177A (da) * 1973-07-05 1975-03-17
JPH01119034A (ja) * 1987-10-30 1989-05-11 Ibiden Co Ltd 電子部品搭載用フイルムキャリア

Also Published As

Publication number Publication date
JPH0367433U (da) 1991-07-01

Similar Documents

Publication Publication Date Title
JP3536023B2 (ja) Cof用テープキャリアおよびこれを用いて製造されるcof構造の半導体装置
US7294532B2 (en) Method for manufacturing semiconductor device
KR100223727B1 (ko) 반도체 장치
KR100389314B1 (ko) 도금인입선 없는 인쇄회로기판의 제조방법
JP4819335B2 (ja) 半導体チップパッケージ
US6323434B1 (en) Circuit board and production method thereof
JP2509351Y2 (ja) 配線基材
JP3650500B2 (ja) 回路基板およびその製造方法
US6274822B1 (en) Manufacture of semiconductor connection components with frangible lead sections
JP2717198B2 (ja) プリント配線板におけるバンプの形成方法
JPH11274155A (ja) 半導体装置
JPH07263849A (ja) 印刷回路基板
JPH05335438A (ja) リードレスチップキャリア
JPH1116954A (ja) Tab用テープキャリア
JP2840293B2 (ja) Tab用テープ及びこれを用いた半導体装置
JP2661280B2 (ja) テープキャリヤの構造
JP2869590B2 (ja) 回路部品搭載用中間基板及びその製造法
JP2586736B2 (ja) Tab型半導体装置用キャリアテープ
JP2867547B2 (ja) 導電突起の形成方法
JPH02251160A (ja) Icチップ用キャリアフィルム
JP2550219Y2 (ja) 回路基板装置
JPH0453100B2 (da)
JPH05259214A (ja) 半導体装置
JPH088307A (ja) Tab用テープ
JPH03248543A (ja) フィルムキャリアテープ

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term