JP2509092Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2509092Y2
JP2509092Y2 JP1989152868U JP15286889U JP2509092Y2 JP 2509092 Y2 JP2509092 Y2 JP 2509092Y2 JP 1989152868 U JP1989152868 U JP 1989152868U JP 15286889 U JP15286889 U JP 15286889U JP 2509092 Y2 JP2509092 Y2 JP 2509092Y2
Authority
JP
Japan
Prior art keywords
adhesive
diffusion plate
heat diffusion
wiring board
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989152868U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0392051U (https=
Inventor
久夫 新井
憲司 坊野
幸治 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chichibu Fuji Co Ltd
Original Assignee
Chichibu Fuji Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chichibu Fuji Co Ltd filed Critical Chichibu Fuji Co Ltd
Priority to JP1989152868U priority Critical patent/JP2509092Y2/ja
Publication of JPH0392051U publication Critical patent/JPH0392051U/ja
Application granted granted Critical
Publication of JP2509092Y2 publication Critical patent/JP2509092Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
JP1989152868U 1989-12-29 1989-12-29 半導体装置 Expired - Lifetime JP2509092Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989152868U JP2509092Y2 (ja) 1989-12-29 1989-12-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989152868U JP2509092Y2 (ja) 1989-12-29 1989-12-29 半導体装置

Publications (2)

Publication Number Publication Date
JPH0392051U JPH0392051U (https=) 1991-09-19
JP2509092Y2 true JP2509092Y2 (ja) 1996-08-28

Family

ID=31699107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989152868U Expired - Lifetime JP2509092Y2 (ja) 1989-12-29 1989-12-29 半導体装置

Country Status (1)

Country Link
JP (1) JP2509092Y2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184351A (ja) * 2006-01-05 2007-07-19 Nec Electronics Corp 半導体装置及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3057986U (ja) * 1998-09-25 1999-06-08 モリト株式会社 スポーツ靴用靴底

Also Published As

Publication number Publication date
JPH0392051U (https=) 1991-09-19

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