JP2508732Y2 - 電子部品計測装置の接触装置 - Google Patents
電子部品計測装置の接触装置Info
- Publication number
- JP2508732Y2 JP2508732Y2 JP1990056503U JP5650390U JP2508732Y2 JP 2508732 Y2 JP2508732 Y2 JP 2508732Y2 JP 1990056503 U JP1990056503 U JP 1990056503U JP 5650390 U JP5650390 U JP 5650390U JP 2508732 Y2 JP2508732 Y2 JP 2508732Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- terminals
- electronic component
- measuring device
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 5
- 238000001444 catalytic combustion detection Methods 0.000 description 18
- 238000005259 measurement Methods 0.000 description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990056503U JP2508732Y2 (ja) | 1990-05-31 | 1990-05-31 | 電子部品計測装置の接触装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990056503U JP2508732Y2 (ja) | 1990-05-31 | 1990-05-31 | 電子部品計測装置の接触装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0416367U JPH0416367U (enrdf_load_html_response) | 1992-02-10 |
| JP2508732Y2 true JP2508732Y2 (ja) | 1996-08-28 |
Family
ID=31580387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990056503U Expired - Fee Related JP2508732Y2 (ja) | 1990-05-31 | 1990-05-31 | 電子部品計測装置の接触装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508732Y2 (enrdf_load_html_response) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011052969A (ja) * | 2009-08-31 | 2011-03-17 | Hioki Ee Corp | 基板検査装置におけるｚ軸ユニットの配線引き回し構造 |
| JP6069831B2 (ja) * | 2011-12-16 | 2017-02-01 | 富士電機株式会社 | 半導体試験装置 |
| JP6131622B2 (ja) * | 2013-02-13 | 2017-05-24 | 三菱電機株式会社 | 測定装置 |
| JP6126945B2 (ja) * | 2013-08-26 | 2017-05-10 | 株式会社エンプラス | 電気部品用ソケット及び電気部品の検査システム |
| JP6881354B2 (ja) * | 2018-03-07 | 2021-06-02 | オムロン株式会社 | 検査ユニットおよび検査装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59192979A (ja) * | 1983-04-15 | 1984-11-01 | Mitsutoyo Mfg Co Ltd | 電子部品の検査方法 |
-
1990
- 1990-05-31 JP JP1990056503U patent/JP2508732Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416367U (enrdf_load_html_response) | 1992-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |