JP2502058Y2 - 樹脂封止型プリント配線板 - Google Patents

樹脂封止型プリント配線板

Info

Publication number
JP2502058Y2
JP2502058Y2 JP1989080469U JP8046989U JP2502058Y2 JP 2502058 Y2 JP2502058 Y2 JP 2502058Y2 JP 1989080469 U JP1989080469 U JP 1989080469U JP 8046989 U JP8046989 U JP 8046989U JP 2502058 Y2 JP2502058 Y2 JP 2502058Y2
Authority
JP
Japan
Prior art keywords
resin
region
area
sealing
density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989080469U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0320444U (enExample
Inventor
文彦 青木
宏 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989080469U priority Critical patent/JP2502058Y2/ja
Publication of JPH0320444U publication Critical patent/JPH0320444U/ja
Application granted granted Critical
Publication of JP2502058Y2 publication Critical patent/JP2502058Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP1989080469U 1989-07-07 1989-07-07 樹脂封止型プリント配線板 Expired - Fee Related JP2502058Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989080469U JP2502058Y2 (ja) 1989-07-07 1989-07-07 樹脂封止型プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989080469U JP2502058Y2 (ja) 1989-07-07 1989-07-07 樹脂封止型プリント配線板

Publications (2)

Publication Number Publication Date
JPH0320444U JPH0320444U (enExample) 1991-02-28
JP2502058Y2 true JP2502058Y2 (ja) 1996-06-19

Family

ID=31625559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989080469U Expired - Fee Related JP2502058Y2 (ja) 1989-07-07 1989-07-07 樹脂封止型プリント配線板

Country Status (1)

Country Link
JP (1) JP2502058Y2 (enExample)

Also Published As

Publication number Publication date
JPH0320444U (enExample) 1991-02-28

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Legal Events

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