JPH0320444U - - Google Patents

Info

Publication number
JPH0320444U
JPH0320444U JP1989080469U JP8046989U JPH0320444U JP H0320444 U JPH0320444 U JP H0320444U JP 1989080469 U JP1989080469 U JP 1989080469U JP 8046989 U JP8046989 U JP 8046989U JP H0320444 U JPH0320444 U JP H0320444U
Authority
JP
Japan
Prior art keywords
resin
coated
area
coated region
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989080469U
Other languages
English (en)
Japanese (ja)
Other versions
JP2502058Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989080469U priority Critical patent/JP2502058Y2/ja
Publication of JPH0320444U publication Critical patent/JPH0320444U/ja
Application granted granted Critical
Publication of JP2502058Y2 publication Critical patent/JP2502058Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP1989080469U 1989-07-07 1989-07-07 樹脂封止型プリント配線板 Expired - Fee Related JP2502058Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989080469U JP2502058Y2 (ja) 1989-07-07 1989-07-07 樹脂封止型プリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989080469U JP2502058Y2 (ja) 1989-07-07 1989-07-07 樹脂封止型プリント配線板

Publications (2)

Publication Number Publication Date
JPH0320444U true JPH0320444U (enExample) 1991-02-28
JP2502058Y2 JP2502058Y2 (ja) 1996-06-19

Family

ID=31625559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989080469U Expired - Fee Related JP2502058Y2 (ja) 1989-07-07 1989-07-07 樹脂封止型プリント配線板

Country Status (1)

Country Link
JP (1) JP2502058Y2 (enExample)

Also Published As

Publication number Publication date
JP2502058Y2 (ja) 1996-06-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees