JP2024546903A5 - - Google Patents
Info
- Publication number
- JP2024546903A5 JP2024546903A5 JP2024535699A JP2024535699A JP2024546903A5 JP 2024546903 A5 JP2024546903 A5 JP 2024546903A5 JP 2024535699 A JP2024535699 A JP 2024535699A JP 2024535699 A JP2024535699 A JP 2024535699A JP 2024546903 A5 JP2024546903 A5 JP 2024546903A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- region
- metal layer
- conductive path
- interconnect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/556,346 | 2021-12-20 | ||
| US17/556,346 US12165981B2 (en) | 2021-12-20 | 2021-12-20 | 3D semiconductor package with die-mounted voltage regulator |
| PCT/US2022/052129 WO2023121876A1 (en) | 2021-12-20 | 2022-12-07 | 3d semiconductor package with die-mounted voltage regulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024546903A JP2024546903A (ja) | 2024-12-26 |
| JP2024546903A5 true JP2024546903A5 (https=) | 2025-12-17 |
Family
ID=86768936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024535699A Pending JP2024546903A (ja) | 2021-12-20 | 2022-12-07 | ダイ装着電圧調整器を有する３ｄ半導体パッケージ |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12165981B2 (https=) |
| EP (1) | EP4454014A4 (https=) |
| JP (1) | JP2024546903A (https=) |
| KR (1) | KR20240128894A (https=) |
| CN (1) | CN118613911A (https=) |
| WO (1) | WO2023121876A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230034737A1 (en) * | 2021-07-30 | 2023-02-02 | Intel Corporation | Composite ic die package including ic die directly bonded to front and back sides of an interposer |
| US12355006B2 (en) * | 2022-02-16 | 2025-07-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packages and methods of manufacturing thereof |
| CN116936531A (zh) * | 2022-03-29 | 2023-10-24 | 辉达公司 | 具有集成功率转换器模块的集成电路基板设计及其制造方法 |
| US12581663B2 (en) * | 2022-12-22 | 2026-03-17 | International Business Machines Corporation | Heterogeneous integration structure with voltage regulation |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8716855B2 (en) * | 2010-11-10 | 2014-05-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit system with distributed power supply comprising interposer and voltage regulator module |
| US9831148B2 (en) | 2016-03-11 | 2017-11-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated fan-out package including voltage regulators and methods forming same |
| KR102663810B1 (ko) * | 2016-12-30 | 2024-05-07 | 삼성전자주식회사 | 전자 소자 패키지 |
| US11515291B2 (en) | 2018-08-28 | 2022-11-29 | Adeia Semiconductor Inc. | Integrated voltage regulator and passive components |
| CN112913014B (zh) | 2018-10-26 | 2024-03-26 | 华为技术有限公司 | 用于集成稳压器(ivr)应用的电感器 |
| US11671010B2 (en) | 2020-02-07 | 2023-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Power delivery for multi-chip-package using in-package voltage regulator |
| US12288750B2 (en) * | 2021-09-24 | 2025-04-29 | Intel Corporation | Conformal power delivery structure for direct chip attach architectures |
-
2021
- 2021-12-20 US US17/556,346 patent/US12165981B2/en active Active
-
2022
- 2022-12-07 CN CN202280084591.8A patent/CN118613911A/zh active Pending
- 2022-12-07 EP EP22912278.3A patent/EP4454014A4/en active Pending
- 2022-12-07 JP JP2024535699A patent/JP2024546903A/ja active Pending
- 2022-12-07 KR KR1020247024100A patent/KR20240128894A/ko active Pending
- 2022-12-07 WO PCT/US2022/052129 patent/WO2023121876A1/en not_active Ceased
-
2024
- 2024-11-12 US US18/944,757 patent/US20250070031A1/en active Pending
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