JP2024540486A5 - - Google Patents

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Publication number
JP2024540486A5
JP2024540486A5 JP2024529347A JP2024529347A JP2024540486A5 JP 2024540486 A5 JP2024540486 A5 JP 2024540486A5 JP 2024529347 A JP2024529347 A JP 2024529347A JP 2024529347 A JP2024529347 A JP 2024529347A JP 2024540486 A5 JP2024540486 A5 JP 2024540486A5
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JP
Japan
Prior art keywords
block
microelectronic device
heat
thermal
semiconductor element
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Pending
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JP2024529347A
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English (en)
Japanese (ja)
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JP2024540486A (ja
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Priority claimed from PCT/US2022/049992 external-priority patent/WO2023091430A1/en
Publication of JP2024540486A publication Critical patent/JP2024540486A/ja
Publication of JP2024540486A5 publication Critical patent/JP2024540486A5/ja
Pending legal-status Critical Current

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JP2024529347A 2021-11-17 2022-11-15 積層ダイのサーマルバイパス Pending JP2024540486A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163264214P 2021-11-17 2021-11-17
US63/264,214 2021-11-17
PCT/US2022/049992 WO2023091430A1 (en) 2021-11-17 2022-11-15 Thermal bypass for stacked dies

Publications (2)

Publication Number Publication Date
JP2024540486A JP2024540486A (ja) 2024-10-31
JP2024540486A5 true JP2024540486A5 (enExample) 2025-10-16

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ID=86324028

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JP2024529347A Pending JP2024540486A (ja) 2021-11-17 2022-11-15 積層ダイのサーマルバイパス

Country Status (7)

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US (1) US20230154816A1 (enExample)
EP (1) EP4434089A4 (enExample)
JP (1) JP2024540486A (enExample)
KR (1) KR20240103015A (enExample)
CN (1) CN118476024A (enExample)
TW (1) TWI899518B (enExample)
WO (1) WO2023091430A1 (enExample)

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